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    • 1. 发明申请
    • SPUTTERING APPARATUS AND METHOD FOR FORMING A TRANSMISSIVE CONDUCTIVE LAYER OF A LIGHT EMITTING DEVICE
    • 用于形成发光装置的透射导电层的溅射装置和方法
    • US20140197026A1
    • 2014-07-17
    • US14239109
    • 2011-08-17
    • Young Chul ShinGi Bum KimWon Goo Hur
    • Young Chul ShinGi Bum KimWon Goo Hur
    • H01J37/34
    • H01J37/3411C23C14/0641C23C14/34H01L31/1884H01L33/42Y02E10/50
    • There is provided a method for manufacturing a nitride semiconductor light emitting device, including: forming a light emitting structure including first and second conductive nitride semiconductor layers on a substrate and an active layer formed therebetween; forming the first conductive nitride semiconductor layer, the active layer, and the second conductive nitride semiconductor layer in sequence; forming a first electrode connected to the first conductive nitride semiconductor layer; forming a photo-resist layer on the second conductive nitride semiconductor layer so as to expose a portion of the semiconductor layer; and removing the photo-resist layer after a reflective metal layer and a barrier metal layer serving as a second electrode structure are successively formed on the second conductive nitride semiconductor layer exposed by the photo-resist layer.
    • 提供了一种用于制造氮化物半导体发光器件的方法,包括:在衬底上形成包括第一和第二导电氮化物半导体层的发光结构和在其间形成的有源层; 依次形成第一导电氮化物半导体层,有源层和第二导电氮化物半导体层; 形成连接到所述第一导电氮化物半导体层的第一电极; 在所述第二导电氮化物半导体层上形成光致抗蚀剂层,以暴露所述半导体层的一部分; 并且在用作第二电极结构的反射金属层和阻挡金属层之后依次形成在由光致抗蚀剂层暴露的第二导电氮化物半导体层上,去除光致抗蚀剂层。
    • 2. 发明授权
    • Method of manufacturing semiconductor light emitting device
    • 制造半导体发光器件的方法
    • US08409896B2
    • 2013-04-02
    • US13286834
    • 2011-11-01
    • Won Goo HurYoung Chul ShinGi Bum KimSeung Woo Choi
    • Won Goo HurYoung Chul ShinGi Bum KimSeung Woo Choi
    • H01L21/00
    • H01L33/42H01L33/025H01L2933/0016
    • There is provided a method of manufacturing a semiconductor light emitting device, the method including: forming a light emitting structure by sequentially growing an n-type nitride semiconductor layer, an active layer, and a p-type nitride semiconductor layer on a substrate; forming a transparent electrode on the p-type nitride semiconductor layer through a sputtering process; and forming a nitrogen gas atmosphere in an interior of a reaction chamber in which the sputtering process is performed, prior to or during the sputtering process.In the case of the semiconductor light emitting device obtained according to embodiments of the invention, a deterioration phenomenon in electrode characteristics caused due to a nitrogen vacancy may be minimized in manufacturing a transparent electrode through a sputtering process to thereby allow for the provision of a transparent electrode having significantly improved electrical characteristics.
    • 提供一种制造半导体发光器件的方法,该方法包括:通过在衬底上依次生长n型氮化物半导体层,有源层和p型氮化物半导体层来形成发光结构; 通过溅射工艺在p型氮化物半导体层上形成透明电极; 以及在溅射工艺之前或期间在其中进行溅射工艺的反应室的内部形成氮气气氛。 在根据本发明的实施例获得的半导体发光器件的情况下,由于氮空位引起的电极特性的劣化现象在通过溅射工艺制造透明电极时可能被最小化,从而允许提供透明 电极具有显着改善的电特性。
    • 4. 发明授权
    • Method of manufacturing vertical light emitting diode with dual surface pattern to improve light extraction
    • 制造具有双表面图案的垂直发光二极管的方法,以改善光提取
    • US08455282B2
    • 2013-06-04
    • US13162254
    • 2011-06-16
    • Ki Sung KimGi Bum KimTae Hun KimYoung Chul ShinYoung Sun Kim
    • Ki Sung KimGi Bum KimTae Hun KimYoung Chul ShinYoung Sun Kim
    • H01L21/00
    • H01L33/22H01L33/0066H01L33/0075H01L33/0079H01L33/20H01L2933/0025H01L2933/0091
    • A semiconductor light emitting diode (LED) and a manufacturing method thereof are disclosed. The method for manufacturing a semiconductor light emitting diode (LED) includes: forming a light emission structure including a first conductive semiconductor layer, an active layer, and a second conductive semiconductor layer on a substrate with prominences and depressions; removing the substrate from the light emission structure to expose a first concavoconvex portion corresponding to the prominences and depressions; forming a protection layer on the first concavoconvex portion; removing a portion of the protection layer to expose a convex portion of the first concavoconvex portion; and forming a second concavoconvex portion on the convex portion of the first concavoconvex portion. The semiconductor light emitting diode (LED) includes: a light emission structure including a first conductive type semiconductor layer, an active layer, and a second conductive type semiconductor layer; a first concavoconvex portion formed on the light emission structure and having a second concavoconvex portion at a convex portion thereof; and a protection layer filling up a concave portion of the first concavoconvex portion.
    • 公开了一种半导体发光二极管(LED)及其制造方法。 制造半导体发光二极管(LED)的方法包括:在具有突起和凹陷的基板上形成包括第一导电半导体层,有源层和第二导电半导体层的发光结构; 从所述发光结构去除所述衬底以暴露对应于所述突起和凹陷的第一凹凸部分; 在第一凹凸部上形成保护层; 去除所述保护层的一部分以暴露所述第一凹凸部的凸部; 以及在所述第一凹凸部的所述凸部上形成第二凹凸部。 半导体发光二极管(LED)包括:包括第一导电类型半导体层,有源层和第二导电类型半导体层的发光结构; 形成在所述发光结构上的第一凹凸部,在其凸部具有第二凹凸部; 以及填充所述第一凹凸部的凹部的保护层。