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    • 4. 发明授权
    • Semiconductor light emitting device and light emitting module
    • 半导体发光器件和发光模块
    • US08648375B2
    • 2014-02-11
    • US13601336
    • 2012-08-31
    • Hideto FuruyamaAkihiro KojimaMiyoko ShimadaYosuke AkimotoHideyuki Tomizawa
    • Hideto FuruyamaAkihiro KojimaMiyoko ShimadaYosuke AkimotoHideyuki Tomizawa
    • H01L33/00
    • H01L33/505
    • According to one embodiment, a semiconductor light emitting device includes: a semiconductor layer including a first and second surfaces, and a light emitting layer; a p-side electrode provided on the second surface; an n-side electrode provided on the second surface; a first insulating film covering the p-side and the n-side electrodes; a p-side wiring section electrically connected to the p-side electrode through the first insulating film; an n-side wiring section electrically connected to the n-side electrode through the first insulating film; and a phosphor layer provided on the first surface. The phosphor layer has an upper surface and an oblique surface, the oblique surface forming an obtuse angle with the upper surface and inclined with respect to the first surface. Thickness of the phosphor layer immediately below the oblique surface is smaller than thickness of the phosphor layer immediately below the upper surface.
    • 根据一个实施例,半导体发光器件包括:包括第一和第二表面的半导体层和发光层; 设置在第二表面上的p侧电极; 设置在所述第二表面上的n侧电极; 覆盖p侧和n侧电极的第一绝缘膜; 通过第一绝缘膜电连接到p侧电极的p侧布线部分; 通过第一绝缘膜与n侧电极电连接的n侧配线部; 以及设置在第一表面上的荧光体层。 荧光体层具有上表面和倾斜表面,倾斜表面与上表面形成钝角并相对于第一表面倾斜。 斜面正下方的荧光体层的厚度小于上表面正下方的荧光体层的厚度。
    • 7. 发明申请
    • SEMICONDUCTOR LIGHT EMITTING DEVICE AND LIGHT EMITTING MODULE
    • 半导体发光器件和发光模块
    • US20130313581A1
    • 2013-11-28
    • US13601336
    • 2012-08-31
    • Hideto FuruyamaAkihiro KojimaMiyoko ShimadaYosuke AkimotoHideyuki Tomizawa
    • Hideto FuruyamaAkihiro KojimaMiyoko ShimadaYosuke AkimotoHideyuki Tomizawa
    • H01L33/50H01L33/08
    • H01L33/505
    • According to one embodiment, a semiconductor light emitting device includes: a semiconductor layer including a first and second surfaces, and a light emitting layer; a p-side electrode provided on the second surface; an n-side electrode provided on the second surface; a first insulating film covering the p-side and the n-side electrodes; a p-side wiring section electrically connected to the p-side electrode through the first insulating film; an n-side wiring section electrically connected to the n-side electrode through the first insulating film; and a phosphor layer provided on the first surface. The phosphor layer has an upper surface and an oblique surface, the oblique surface forming an obtuse angle with the upper surface and inclined with respect to the first surface. Thickness of the phosphor layer immediately below the oblique surface is smaller than thickness of the phosphor layer immediately below the upper surface.
    • 根据一个实施例,半导体发光器件包括:包括第一和第二表面的半导体层和发光层; 设置在第二表面上的p侧电极; 设置在所述第二表面上的n侧电极; 覆盖p侧和n侧电极的第一绝缘膜; 通过第一绝缘膜电连接到p侧电极的p侧布线部分; 通过第一绝缘膜与n侧电极电连接的n侧配线部; 以及设置在第一表面上的荧光体层。 荧光体层具有上表面和倾斜表面,倾斜表面与上表面形成钝角并相对于第一表面倾斜。 斜面正下方的荧光体层的厚度小于上表面正下方的荧光体层的厚度。