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1. 发明申请

US20090277884A1 SURFACE MODIFICATION METHOD 审中-公开
标题翻译：表面改性方法
公开(公告)号：US20090277884A1
公开(公告)日：2009-11-12
申请号：US12392164
申请日：2009-02-25
申请人： Yoshiyuki UNO , Yasuhiro Okamoto , Tetsuomi Mohri , Yuji Tanaka , Motoki Kakui , Kazuo Nakamae
发明人： Yoshiyuki UNO , Yasuhiro Okamoto , Tetsuomi Mohri , Yuji Tanaka , Motoki Kakui , Kazuo Nakamae
IPC分类号： B23K26/00 , B23K26/12
CPC分类号： B23K26/127 , B23K26/0622 , B23K26/082 , B23K26/12 , B23K26/3568 , B23K2101/20
摘要： The present invention relates to a surface modification method allowing the surface of a subject to be more effectively modified. In a pulsed-laser device suitable for use in this surface modification method, a semiconductor laser light source and a modulator constitute a seed light source. The seed light output from the seed light source is amplified by fibers for optical amplification, and the amplified light constitutes output from the pulsed-laser device. The pulsed-laser device allows the pulse width and repetition frequency of the output pulsed-laser light to be varied independently of each other. The pulse width of the pulsed-laser light output from the pulsed-laser device is preferably not more than 10 ns, and the repetition frequency is preferably at least 50 kHz.
摘要翻译：本发明涉及能够更有效地改变被检体表面的表面改性方法。在适用于该表面改性方法的脉冲激光装置中，半导体激光光源和调制器构成种子光源。从种子光源输出的种子光被用于光放大的光纤放大，并且放大的光构成了脉冲激光装置的输出。脉冲激光器件允许输出脉冲激光的脉冲宽度和重复频率彼此独立地变化。从脉冲激光装置输出的脉冲激光的脉冲宽度优选为10ns以下，重复频率优选为50kHz以上。

2. 发明授权

US08080773B2 Method and apparatus of measuring backward light, and laser processing method 有权
标题翻译：测量反光的方法和装置，以及激光加工方法
公开(公告)号：US08080773B2
公开(公告)日：2011-12-20
申请号：US12392331
申请日：2009-02-25
申请人： Shinobu Tamaoki , Motoki Kakui , Kazuo Nakamae
发明人： Shinobu Tamaoki , Motoki Kakui , Kazuo Nakamae
IPC分类号： G01J1/32
CPC分类号： G01J1/20 , B23K26/705
摘要： The present invention relates to a method of measuring backward light, which is constructed for checking, prior to laser processing, backward light that propagates backward through an isolator included in a laser processing apparatus. The present invention also relates to a laser processing method and the like. A laser processing apparatus has an optical head provided with a laser light source part, light guide, and isolator. The optical head has an emitting optical system, irradiation optical system, and light collecting optical system. The method of measuring backward light uses a photodetector to detect, from reference light introduced from a measurement light source into the optical head, the power of an optical component that has passed through the isolator, while changing the position of the measurement light source. The laser processing method performs laser processing by using the laser processing apparatus that has the optical head in which the arrangement of optical components is adjusted beforehand on the basis of the result of detection or result of measurement.
摘要翻译：本发明涉及一种测量向后光的方法，其被构造用于在激光加工之前检查通过包括在激光加工设备中的隔离器向后传播的向后光。本发明还涉及一种激光加工方法等。激光加工设备具有设置有激光光源部分，光导和隔离器的光学头。光头具有发射光学系统，照射光学系统和聚光光学系统。逆向光的测量方法使用光检测器，在测量光源的位置改变的同时，从测量光源引入光头的参考光检测已经通过隔离器的光学部件的功率。激光加工方法通过使用具有基于检测结果或测量结果预先调整光学部件的布置的光头的激光加工装置进行激光加工。

3. 发明授权

US08039778B2 Laser processing apparatus and laser processing method 有权
标题翻译：激光加工设备和激光加工方法
公开(公告)号：US08039778B2
公开(公告)日：2011-10-18
申请号：US12256974
申请日：2008-10-23
申请人： Motoki Kakui , Kazuo Nakamae , Shinobu Tamaoki
发明人： Motoki Kakui , Kazuo Nakamae , Shinobu Tamaoki
IPC分类号： G01J1/32
CPC分类号： B23K26/03 , B23K26/082 , B23K2101/32 , B23K2101/36
摘要： The present invention relates to a laser processing apparatus and the like having a structure for implementing at the same time both an efficient laser processing in the place where a laser beam is difficult to reach and a laser processing without damages in the place where the laser beam is easy to reach. This laser processing apparatus comprises a laser light source, an irradiation optical system applying a laser beam to an object while scanning the laser beam, a photo-detector detecting the laser beam applied from the irradiation optical system, and a control section of making switching between a continuous oscillation and a pulse oscillation of the laser beam at the laser light source. In particular, the control section makes a continuous oscillation of the laser beam with respect to the laser light source in the case in which the laser beam applied from the irradiation optical system is detected at the photo-detector; while it makes a pulse oscillation of the laser beam with respect to the laser light source in the case in which no laser beam applied from the irradiation optical system is detected at the photo-detector.
摘要翻译：激光加工装置本发明涉及一种激光加工装置等，其结构是同时实现在激光束难以到达的地方进行有效的激光加工，激光加工在激光加工的地方很容易到达。该激光加工装置包括：激光光源，在扫描激光束的同时向物体施加激光的照射光学系统;检测从照射光学系统施加的激光束的光检测器;以及控制部，在激光光源处的激光束的连续振荡和脉冲振荡。特别地，在从光检测器检测到从照射光学系统施加的激光束的情况下，控制部分使激光束相对于激光光源连续振荡; 而在光检测器未检测到从照射光学系统施加的激光束的情况下，激光束相对于激光光源的脉冲振荡。

4. 发明申请

US20110148002A1 LASER PROCESSING METHOD AND LASER PROCESSING DEVICE 有权
标题翻译：激光加工方法和激光加工装置
公开(公告)号：US20110148002A1
公开(公告)日：2011-06-23
申请号：US13059592
申请日：2009-10-23
申请人： Motoki Kakui , Kazuo Nakamae , Shinobu Tamaoki
发明人： Motoki Kakui , Kazuo Nakamae , Shinobu Tamaoki
IPC分类号： B29C35/08
CPC分类号： H05K3/0035 , B23K26/0622 , B23K26/082 , B23K26/389 , B23K26/40 , B23K2103/172 , B23K2103/42 , B23K2103/50 , H01S3/067
摘要： The present invention relates to a laser processing method and the like which use no wavelength conversion technique by nonlinear optical crystals when selectively removing an insulating layer of a printed board, while employing only one wavelength throughout the entire removal processing. A laser processing apparatus (1), preferably used in the laser processing method, has a MOPA structure and comprises a seed light source (100), a YbDF (110), a bandpass filter (120), a YbDF (130), a bandpass filter (140), a YbDF (150), a YbDF (160), and so forth. The laser processing method according to the present invention is a laser processing method of removing an insulating layer comprised of a resin laminated on a conductor layer by irradiating it with pulsed laser light outputted from the laser processing apparatus (1) and uses laser light having a wavelength at which the light absorbed by the conductor layer is less than 10%, and sets the fluence per one pulse to a fracture damage threshold of the insulating layer or higher.
摘要翻译：本发明涉及在选择性地去除印刷电路板的绝缘层时采用非线性光学晶体的波长转换技术的激光加工方法等，而在整个去除处理中仅使用一个波长。优选用于激光加工方法的激光加工装置（1）具有MOPA结构，包括种子光源（100），YbDF（110），带通滤光器（120），YbDF（130），带通滤波器（140），YbDF（150），YbDF（160）等。根据本发明的激光加工方法是通过用从激光加工设备（1）输出的脉冲激光照射层压在导体层上的由树脂构成的绝缘层的激光加工方法，并使用具有由导体层吸收的光的波长小于10％，并且将每个脉冲的注量设定为绝缘层的断裂损伤阈值或更高。

5. 发明申请

US20080210886A1 Laser processing method and laser processing apparatus 失效
标题翻译：激光加工方法和激光加工设备
公开(公告)号：US20080210886A1
公开(公告)日：2008-09-04
申请号：US11878973
申请日：2007-07-30
申请人： Kazuo Nakamae , Motoki Kakui , Shinobu Tamaoki
发明人： Kazuo Nakamae , Motoki Kakui , Shinobu Tamaoki
IPC分类号： G21K5/10
CPC分类号： B23K26/03 , B23K26/032 , B23K26/046 , B23K26/048 , B23K26/0665 , B23K26/0861 , B23K26/53
摘要： The present invention relates to a laser processing method and the like having a structure for making it possible to process an object to be processed in various ways while accurately adjusting the installation state of the object. The method irradiates the object with plural adjustment laser light beams that are set in a specific positional relationship against a converging point of processing laser light beam, and adjusts the state of installation of the object while monitoring irradiation areas of the adjustment laser light beams on the surface of the object. Each irradiation directions of adjustment laser light beams is different from that of the processing laser light beam. By reflecting the irradiation condition of the adjustment laser light beam and monitored information of the irradiation areas in positional adjustment of the object, the installation state of the object can be adjusted in accordance with various kinds of processing.
摘要翻译：本发明涉及一种激光加工方法等，其具有能够在精确地调整物体的安装状态的情况下以各种方式处理待处理物体的结构。该方法以与处理用激光的会聚点为特定的位置关系设定的多个调整用激光照射物体，并且在监视被调节激光的照射区域的同时调整对象的安装状态物体的表面。调整激光的各照射方向与加工用激光的不同。通过在对象的位置调整中反映调整激光的照射条件和照射区域的监视信息，可以根据各种处理来调整物体的安装状态。

6. 发明申请

US20080072924A1 Fouling removing method 审中-公开
标题翻译：污垢去除方法
公开(公告)号：US20080072924A1
公开(公告)日：2008-03-27
申请号：US11882168
申请日：2007-07-31
申请人： Kazuo Nakamae , Motoki Kakui , Shinobu Tamaoki
发明人： Kazuo Nakamae , Motoki Kakui , Shinobu Tamaoki
IPC分类号： B08B6/00
CPC分类号： B08B7/0042
摘要： The present invention relates to a fouling removing method which removes a fouling, comprised of a chemical compound containing carbon, on an object surface by laser light irradiation. The fouling removing method irradiates the fouling on the object surface with laser light while blowing a supporting gas on this area. This structure allows the supporting gas and a fouling material to react with each other when burning the fouling by laser irradiation, so as to generate a carbon-containing gas, and the supporting gas to blow away carbonized residues generated on the object surface. This drastically reduces the carbonized residues on the exposed surface of the object having removed the fouling.
摘要翻译：本发明涉及一种污垢去除方法，其通过激光照射在物体表面上除去由含有碳的化合物组成的污垢。污垢清除方法在该区域吹送支撑气体的同时用激光照射物体表面上的污垢。这种结构允许支持气体和结垢材料在通过激光照射燃烧结垢时彼此反应，以产生含碳气体，并且支撑气体吹走在物体表面上产生的碳化残余物。这大大减少了去除污垢的物体的暴露表面上的碳化残余物。

7. 发明授权

US08294123B2 Laser processing method and laser processing apparatus 失效
标题翻译：激光加工方法和激光加工设备
公开(公告)号：US08294123B2
公开(公告)日：2012-10-23
申请号：US11878973
申请日：2007-07-30
申请人： Kazuo Nakamae , Motoki Kakui , Shinobu Tamaoki
发明人： Kazuo Nakamae , Motoki Kakui , Shinobu Tamaoki
IPC分类号： G21K5/10
CPC分类号： B23K26/03 , B23K26/032 , B23K26/046 , B23K26/048 , B23K26/0665 , B23K26/0861 , B23K26/53
摘要： The present invention relates to a laser processing method and the like having a structure for making it possible to process an object to be processed in various ways while accurately adjusting the installation state of the object. The method irradiates the object with plural adjustment laser light beams that are set in a specific positional relationship against a converging point of processing laser light beam, and adjusts the state of installation of the object while monitoring irradiation areas of the adjustment laser light beams on the surface of the object. Each irradiation directions of adjustment laser light beams is different from that of the processing laser light beam. By reflecting the irradiation condition of the adjustment laser light beam and monitored information of the irradiation areas in positional adjustment of the object, the installation state of the object can be adjusted in accordance with various kinds of processing.
摘要翻译：本发明涉及一种激光加工方法等，其具有能够在精确地调整物体的安装状态的情况下以各种方式处理待处理物体的结构。该方法以与处理用激光的会聚点为特定的位置关系设定的多个调整用激光照射物体，并且在监视被调节激光的照射区域的同时调整对象的安装状态物体的表面。调整激光的各照射方向与加工用激光的不同。通过在对象的位置调整中反映调整激光的照射条件和照射区域的监视信息，可以根据各种处理来调整物体的安装状态。

8. 发明申请

US20080123694A1 Fiber laser apparatus and laser processing method 有权
标题翻译：光纤激光设备和激光加工方法
公开(公告)号：US20080123694A1
公开(公告)日：2008-05-29
申请号：US11808927
申请日：2007-06-13
申请人： Kazuo Nakamae , Motoki Kakui , Shinobu Tamaoki
发明人： Kazuo Nakamae , Motoki Kakui , Shinobu Tamaoki
IPC分类号： H01S3/067
CPC分类号： G02B6/4296 , G02B6/03633 , H01S3/06758 , H01S3/0809 , H01S3/094007 , H01S3/2308
摘要： The invention relates to a fiber laser apparatus having a structure that enables efficient laser processing for an object and to a laser processing method. The fiber laser apparatus comprises an amplifying section for amplifying seed light by cladding-pumping, and has a structure for further using a residual component of pumping light for cladding-pumping in order to heat the object. In particular, a guiding optical fiber is provided between an amplifying optical fiber of the amplifying section and an output optical system converging the single-mode amplified seed light on the object, the guiding optical fiber serving to increase the degree of freedom in arranging the output optical system. The guiding optical fiber has a structure enabling the single-mode propagation of the amplified seed light outputted from the amplifying optical fiber and multimode propagation of the residual pumping light. Because the object is irradiated with the converged amplified seed light, while being heated with the residual pumping light outputted from the output optical system, even an object with a complex shape can be subjected to efficient laser processing.
摘要翻译：本发明涉及具有能够对物体进行有效的激光加工和激光加工方法的结构的光纤激光装置。光纤激光装置包括用于通过包层泵浦放大种子光的放大部分，并且具有进一步使用用于包层抽吸的泵浦光的残余分量以加热物体的结构。特别地，在放大部分的放大光纤与将单模放大种子光聚光在物体上的输出光学系统之间设置引导光纤，该引导光纤用于增加排列输出的自由度光学系统。引导光纤具有使得能够从放大光纤输出的放大的种子光的单模传播和残余泵浦光的多模传播的结构。由于物体被会聚的放大的种子光照射，所以在从输出光学系统输出的剩余泵浦光被加热的同时，即使具有复杂形状的物体也能进行有效的激光加工。

9. 发明授权

US08455791B2 Laser processing method, laser processing device and cable harness production method 有权
标题翻译：激光加工方法，激光加工装置和线束生产方法
公开(公告)号：US08455791B2
公开(公告)日：2013-06-04
申请号：US12397490
申请日：2009-03-04
申请人： Shinobu Tamaoki , Motoki Kakui , Kazuo Nakamae
发明人： Shinobu Tamaoki , Motoki Kakui , Kazuo Nakamae
IPC分类号： B23K26/00
CPC分类号： B23K26/0869 , B23K37/0426 , B23K2101/32 , B23K2101/38 , Y10T29/49192
摘要： The present invention relates to a laser processing method and the like provided with a structure for enabling realization of both preferable processing of locations not easily reached by laser light and effective inhibition of damage caused to locations easily reached by laser light during laser processing. Radiation optics scan locations irradiated with laser light from a laser light source while radiating laser light onto a plurality of objects arranged on a stage and the periphery thereof from a direction perpendicular to the stage. On the stage reflecting members are respectively arranged adjacent to the plurality of objects. The reflecting members reflect laser light radiated from the radiation optics towards lateral surfaces of the objects. Since laser light reflected by the reflecting members is radiated onto the lateral surfaces of the objects, laser light also reaches the lateral surfaces of the objects not easily reached by laser light without having to increase the intensity of the laser light.
摘要翻译：本发明涉及一种激光加工方法等，其具有能够实现激光不容易达到的位置的优选处理的结构，并且有效地抑制了激光加工期间由激光容易达到的位置造成的损坏。辐射光学器件扫描由激光光源激光照射的位置，同时将激光从与舞台垂直的方向布置在舞台上的多个物体及其周边上。在舞台上反射构件分别设置成与多个物体相邻。反射构件将从辐射光学器件辐射的激光反射到物体的侧表面。由于由反射构件反射的激光被辐射到物体的侧面上，所以激光也到达激光不容易达到的物体的侧面，而不必增加激光的强度。

10. 发明授权

US08305689B2 Light source apparatus and optical module included therein 有权
标题翻译：其中包括光源装置和光模块
公开(公告)号：US08305689B2
公开(公告)日：2012-11-06
申请号：US12248472
申请日：2008-10-09
申请人： Motoki Kakui , Kazuo Nakamae , Shinobu Tamaoki
发明人： Motoki Kakui , Kazuo Nakamae , Shinobu Tamaoki
IPC分类号： G02B27/10 , G02B26/00 , G02F1/03
CPC分类号： B23K26/066 , H01S3/0064 , H01S3/06754
摘要： The present invention relates to a light source apparatus or the like provided with a structure that can block reflected return light also when an emitting end side of an optical isolator is a space. The light source apparatus comprises a light source section, a guide section, and an optical module. The optical module includes a collimator, an optical isolator, and an oblique-beam blocking section. The collimator outputs collimated light with a predetermined beam diameter as a forward propagating beam. The optical isolator is a polarization-independent optical isolator that introduces the collimated light from a first end and outputs this collimated light from a second end. The oblique-beam blocking section includes first and second optical components each having a window of a diameter D, and blocks light incident at a predetermined angle relative to an optical axis of the forward propagating beam out of a backward propagating beam, by separating the first and second optical components from each other by a predetermined distance.
摘要翻译：本发明涉及一种光源装置等，其具有当光隔离器的发射端侧为空间时也能够阻挡反射的返回光的结构。光源装置包括光源部，引导部和光模块。光学模块包括准直器，光隔离器和倾斜束阻挡部分。准直仪将预定光束直径的准直光输出为正向传播光束。光隔离器是偏振无关的光隔离器，其引入来自第一端的准直光，并从第二端输出该准直光。倾斜束阻挡部分包括每个具有直径D的窗口的第一和第二光学部件，并且通过将第一和第二光学部件的第一和第二光学部件分离出来，阻挡从向前传播的光束相对于正向传播光束的光轴以预定角度入射的光和第二光学部件彼此间隔预定距离。

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