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1. 发明申请

US20110079896A1 SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE FABRICATION METHOD 审中-公开
标题翻译：半导体器件和半导体器件制造方法
公开(公告)号：US20110079896A1
公开(公告)日：2011-04-07
申请号：US12892029
申请日：2010-09-28
申请人： Yoshiyuki SATOH , Kenji KOBAE , Kimio NAKAMURA , Takayoshi MATSUMURA , Kuniko ISHIKAWA
发明人： Yoshiyuki SATOH , Kenji KOBAE , Kimio NAKAMURA , Takayoshi MATSUMURA , Kuniko ISHIKAWA
IPC分类号： H01L23/488 , H01L21/44
CPC分类号： H01L24/11 , H01L21/56 , H01L24/12 , H01L24/75 , H01L24/81 , H01L24/95 , H01L25/0655 , H01L2224/1134 , H01L2224/1191 , H01L2224/13021 , H01L2224/13022 , H01L2224/131 , H01L2224/16225 , H01L2224/29198 , H01L2224/2929 , H01L2224/293 , H01L2224/32225 , H01L2224/73204 , H01L2224/75 , H01L2224/75251 , H01L2224/75252 , H01L2224/81193 , H01L2224/81203 , H01L2224/81205 , H01L2224/81801 , H01L2224/83192 , H01L2224/83855 , H01L2224/97 , H01L2924/00013 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/0105 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2224/81 , H01L2924/00014 , H01L2224/13099 , H01L2924/00 , H01L2924/0665
摘要： A semiconductor device fabrication method, comprising the steps of: forming a solder portion on an electrode of a substrate on which a semiconductor chip is to be mounted; applying a resin layer onto the substrate to a thickness such that a top region of the solder portion is exposed; curing the resin layer; providing a thermosetting underfill material over a region where the semiconductor chip is to be mounted; placing an electrode of the semiconductor chip face down on the solder portion in such a manner that the electrode faces the solder portion; and heating the underfill material and the solder portion.
摘要翻译：一种半导体器件制造方法，包括以下步骤：在要安装半导体芯片的衬底的电极上形成焊料部分; 将树脂层施加到基板上以使得焊料部分的顶部区域暴露的厚度; 固化树脂层; 在要安装半导体芯片的区域上提供热固性底部填充材料; 将所述半导体芯片的电极朝向所述焊料部分，使得所述电极面向所述焊料部分; 并加热底部填充材料和焊料部分。

2. 发明申请

US20100327043A1 COMPRESSION-BONDING APPARATUS 失效
标题翻译：压接装置
公开(公告)号：US20100327043A1
公开(公告)日：2010-12-30
申请号：US12818554
申请日：2010-06-18
申请人： Kimio NAKAMURA , Yoshiyuki Satoh , Kenji Kobae
发明人： Kimio NAKAMURA , Yoshiyuki Satoh , Kenji Kobae
IPC分类号： B23K37/00
CPC分类号： H01L24/97 , H01L21/563 , H01L24/75 , H01L24/81 , H01L2224/0554 , H01L2224/05568 , H01L2224/05573 , H01L2224/05647 , H01L2224/16 , H01L2224/16225 , H01L2224/32225 , H01L2224/48227 , H01L2224/73203 , H01L2224/73204 , H01L2224/75 , H01L2224/75251 , H01L2224/75252 , H01L2224/75305 , H01L2224/75315 , H01L2224/7598 , H01L2224/81203 , H01L2224/81903 , H01L2224/83192 , H01L2224/83203 , H01L2224/83862 , H01L2224/9211 , H01L2224/97 , H01L2924/00014 , H01L2924/01029 , H01L2924/01033 , H01L2924/01078 , H01L2924/01079 , H01L2924/014 , H01L2924/07802 , H01L2924/14 , H01L2924/00 , H01L2224/81 , H01L2224/83 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556
摘要： A compression-bonding apparatus includes a support stage and a pressing tool. The pressing tool includes a pressing stage, an elastic member and a plurality of bonding heads. The elastic member is held by the pressing stage. The plurality of bonding heads includes an upper surface attached to the elastic member and a lower surface facing an upper surface of the support stage.
摘要翻译：压接装置包括支撑台和按压工具。按压工具包括加压台，弹性件和多个接合头。弹性部件由压制台保持。多个接合头包括附接到弹性构件的上表面和面向支撑台的上表面的下表面。

3. 发明申请

US20120080220A1 ELECTRONIC DEVICE, CIRCUIT BOARD, AND MANUFACTURING METHOD OF ELECTRONIC DEVICE 审中-公开
标题翻译：电子设备，电路板和电子设备的制造方法
公开(公告)号：US20120080220A1
公开(公告)日：2012-04-05
申请号：US13196317
申请日：2011-08-02
申请人： Kimio NAKAMURA , Shuichi TAKEUCHI , Yoshiyuki SATOH , Kenji KOBAE
发明人： Kimio NAKAMURA , Shuichi TAKEUCHI , Yoshiyuki SATOH , Kenji KOBAE
IPC分类号： H05K1/18 , H05K13/00
CPC分类号： H05K1/113 , H01L21/563 , H01L23/3128 , H01L23/49811 , H01L23/49838 , H01L24/16 , H01L24/81 , H01L24/83 , H01L2224/13019 , H01L2224/16105 , H01L2224/16225 , H01L2224/16238 , H01L2224/32225 , H01L2224/73204 , H01L2224/8114 , H01L2224/81141 , H01L2224/81191 , H01L2224/81193 , H01L2224/81194 , H01L2224/81385 , H01L2224/83192 , H01L2924/01005 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/01037 , H01L2924/01074 , H01L2924/01079 , H01L2924/01088 , H01L2924/014 , H01L2924/15311 , H01L2924/15787 , H01L2924/181 , H05K3/3436 , H05K2201/0367 , H05K2201/10977 , Y10T29/49124 , H01L2924/00
摘要： An electronic device includes a circuit board including a first electrode and a second electrode; and an electronic component including a first terminal and a second terminal, wherein the first electrode includes a first pad portion to which the first terminal is connected and a first protrusion portion disposed in a first direction in parallel with a straight line passing through the first electrode and the second electrode with respect to the first pad portion and being into contact with the first terminal, the second electrode includes a second pad portion to which the second terminal is connected and a second protrusion portion disposed in a second direction opposite to the first direction with respect to the second pad portion and being into contact with the second terminal.
摘要翻译：电子装置包括：电路板，包括第一电极和第二电极; 以及包括第一端子和第二端子的电子部件，其中所述第一电极包括与所述第一端子连接的第一焊盘部分和与通过所述第一电极的直线平行的第一方向设置的第一突出部分所述第二电极相对于所述第一焊盘部分与所述第一端子接触，所述第二电极包括第二焊盘部分，所述第二端子连接到所述第二焊盘部分，所述第二突出部分设置在与所述第一方向相反的第二方向上相对于第二焊盘部分并与第二端子接触。

4. 发明申请

US20120230001A1 ELECTRONIC DEVICE, PORTABLE ELECTRONIC TERMINAL, AND METHOD OF MANUFACTURING ELECTRONIC DEVICE 审中-公开
标题翻译：电子设备，便携式电子终端和制造电子设备的方法
公开(公告)号：US20120230001A1
公开(公告)日：2012-09-13
申请号：US13348935
申请日：2012-01-12
申请人： Tetsuya TAKAHASHI , Kenji KOBAE , Shuichi TAKEUCHI , Yoshiyuki SATOH , Kimio NAKAMURA
发明人： Tetsuya TAKAHASHI , Kenji KOBAE , Shuichi TAKEUCHI , Yoshiyuki SATOH , Kimio NAKAMURA
IPC分类号： H05K7/10 , H05K3/30
CPC分类号： H01L23/3128 , H01L23/36 , H01L23/4334 , H01L25/03 , H01L2224/16225 , H01L2224/32225 , H01L2224/32245 , H01L2224/73204 , H01L2224/73253 , H01L2924/15311 , H01L2924/181 , H01L2924/19107 , Y10T29/4913 , H01L2924/00 , H01L2924/00012
摘要： An electronic device includes an interposer, a first chip being mounted on a first surface of the interposer, the first chip having a first surface facing the first surface of the interposer and a second surface opposite to the first surface of the first chip, a second chip being mounted on a second surface of the interposer opposite to the first surface of the interposer, the second chip having a first surface facing the second surface of the interposer and a second surface opposite to the first surface of the second chip, a first metal plate being connected to the second surface of the first chip, a second metal surface being provided over the second surface of the second chip, and a via penetrating through the interposer and connected to the first metal plate and the second metal plate.
摘要翻译：电子设备包括插入器，第一芯片安装在插入件的第一表面上，第一芯片具有面向插入件的第一表面的第一表面和与第一芯片的第一表面相对的第二表面，第二芯片的第二表面芯片安装在与插入件的第一表面相对的插入件的第二表面上，第二芯片具有面向插入件的第二表面的第一表面和与第二芯片的第一表面相对的第二表面，第一金属板连接到第一芯片的第二表面，第二金属表面设置在第二芯片的第二表面上，以及穿过插入件并连接到第一金属板和第二金属板的通孔。

5. 发明申请

US20120225325A1 MAGNETIC RECORDING MEDIUM 有权
标题翻译：磁记录介质
公开(公告)号：US20120225325A1
公开(公告)日：2012-09-06
申请号：US13372116
申请日：2012-02-13
申请人： HIROAKI NEMOTO , Ikuko TAKEKUMA , Kimio NAKAMURA , Junichi SAYAMA
发明人： HIROAKI NEMOTO , Ikuko TAKEKUMA , Kimio NAKAMURA , Junichi SAYAMA
IPC分类号： G11B5/66 , B32B15/04
CPC分类号： G11B5/653 , C22C5/04 , C22C38/002 , C22C2202/02 , G11B5/65 , G11B5/66
摘要： Surface flatness of magnetic recording medium to which a magnetic recording layer made of L10 FePt magnetic alloy thin film, with distance between a magnetic head and a magnetic recording medium sufficiently reduced. The magnetic recording layer includes: magnetic layers containing a magnetic alloy including Fe and Pt as principal materials; and one non-magnetic material selected from carbon, oxide and nitride. The first magnetic layer disposed closer to a substrate has a granular structure in which magnetic alloy grains including FePt alloy as the principal material are separated from grain boundaries including the non-magnetic material as the principal material. The second magnetic layer disposed closer to the surface than the first magnetic layer is fabricated so as to have a homogeneous structure in which an FePt alloy and the non-magnetic material are mixed in a state finer than diameters of the FePt magnetic alloy grains in the first magnetic layer.
摘要翻译：由L10FePt磁性合金薄膜制成的磁记录层，磁头和磁记录介质之间的距离充分降低的磁记录介质的表面平整度。磁记录层包括：含有以Fe和Pt为主要材料的磁性合金的磁性层; 和一种选自碳，氧化物和氮化物的非磁性材料。靠近基板设置的第一磁性层具有以包含FePt合金作为主要材料的磁性合金颗粒与包括非磁性材料在内的晶界作为主要材料的颗粒结构。制造比第一磁性层更靠近表面的第二磁性层，以具有均匀的结构，其中FePt合金和非磁性材料以比FePt磁性合金粒子的直径小的状态混合第一磁性层。

6. 发明申请

US20120052330A1 PERPENDICULAR MAGNETIC RECORDING MEDIUM AND MANUFACTURING METHOD OF THE SAME 审中-公开
标题翻译：全能磁记录介质及其制造方法
公开(公告)号：US20120052330A1
公开(公告)日：2012-03-01
申请号：US13214270
申请日：2011-08-22
申请人： Ikuko TAKEKUMA , Kimio NAKAMURA , Junichi SAYAMA , Hiroaki NEMOTO
发明人： Ikuko TAKEKUMA , Kimio NAKAMURA , Junichi SAYAMA , Hiroaki NEMOTO
IPC分类号： G11B5/66 , G11B5/84
CPC分类号： G11B5/84 , G11B5/65 , G11B5/66
摘要： A perpendicular magnetic recording medium having sufficient perpendicular uniaxial magnetic anisotropy energy and a crystal grain size for realizing an areal recording density of one terabit or more per one square centimeter, and excellent in mass productivity, and a manufacturing method of the same are provided. On a substrate, a substrate-temperature control layer, an underlayer and a magnetic recording layer are sequentially formed. The magnetic recording layer is formed by repeating a magnetic layer stacking step N times (N≧2), which includes a first step of heating the substrate in a heat process chamber, and a second step of depositing, in a deposition process chamber, the magnetic recording layer constituted of an alloy mainly composed of FePt to which at least one kind of non-magnetic material selected from a group constituted of C and an Si oxide is added.
摘要翻译：提供具有足够的垂直单轴磁各向异性能和晶粒尺寸的垂直磁记录介质，用于实现每平方厘米一兆比特或更大的面密度记录密度，并且具有优异的批量生产率及其制造方法。在衬底上依次形成衬底温度控制层，底层和磁记录层。通过重复N次（N≥2）的磁性层堆叠步骤形成磁记录层，其包括在热处理室中加热衬底的第一步骤，以及在沉积处理室中沉积第二步骤由主要由FePt组成的合金构成的磁记录层，其中添加了选自C和Si氧化物中的至少一种非磁性材料。

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