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1. 发明申请

US20070225437A1 Curable Silicone Composition and Cured Product Thereof 有权
标题翻译：可固化硅酮组合物及其固化产品
公开(公告)号：US20070225437A1
公开(公告)日：2007-09-27
申请号：US10578798
申请日：2004-11-04
申请人： Yoshitsugu Morita , Minoru Isshiki , Hiroshi Ueki , Atsushi Togashi
发明人： Yoshitsugu Morita , Minoru Isshiki , Hiroshi Ueki , Atsushi Togashi
IPC分类号： C08L83/06 , C09D183/06 , C09J183/06
CPC分类号： C09J183/06 , C08L83/00 , C08L83/06
摘要： A curable silicone composition includes: (A) an organopolysiloxane represented by the siloxane unit formula (1) given below and having at least two univalent organic groups that contain epoxy groups and are free of aromatic rings: [R13SiO1/2]a [R22SiO2/2]b [R3SiO3/2]c (where R1, R2, and R3 are univalent organic groups, at least two of which are contain epoxy groups and are free of aromatic rings; more than 20 mole % of R3 are aryl groups; a+b+c & equals; 1; on average, “a” satisfies the following condition: 0≦a≦0.8; on average, “b” satisfies the following condition: 0≦b≦0.8; and, on average satisfies the following condition: 0.2≦c≦1.0); (B) a linear-chain organopolysiloxane having at least two univalent organic groups that contain phenolic hydroxyl groups; and (C) a curing accelerator.
摘要翻译：可固化的有机硅组合物包括：（A）由下式给出的硅氧烷单元式（1）表示的具有至少两个含有环氧基并且不含芳环的一价有机基团的有机聚硅氧烷：[R 1 3 SiO 2 1/2 2 2 2 > 2/2 3 R 1，R 2，R 3和R 3是一价有机基团，其中至少两个含有环氧基并且不含芳环; 大于20摩尔％的R 3是芳基; a + b + c等于1;平均而言，“a”满足以下条件：0 <= a <= 0.8;平均，“b”满足以下条件：0 <= b <= 0.8;平均满足下列条件：0.2 <= c <= 1.0）; （B）具有至少两个含有酚羟基的一价有机基团的直链有机聚硅氧烷; 和（C）固化促进剂。

2. 发明授权

US07781522B2 Curable silicone composition and cured product thereof 有权
标题翻译：可固化硅酮组合物及其固化产物
公开(公告)号：US07781522B2
公开(公告)日：2010-08-24
申请号：US10578798
申请日：2004-11-04
申请人： Yoshitsugu Morita , Minoru Isshiki , Hiroshi Ueki , Atsushi Togashi
发明人： Yoshitsugu Morita , Minoru Isshiki , Hiroshi Ueki , Atsushi Togashi
IPC分类号： C08G77/52 , C08G77/00 , C08L83/04
CPC分类号： C09J183/06 , C08L83/00 , C08L83/06
摘要： A curable silicone composition includes: (A) an organopolysiloxane represented by the siloxane unit formula (1) given below and having at least two univalent organic groups that contain epoxy groups and are free of aromatic rings: [R13SiO1/2]a[R22SiO2/2]b[R3SiO3/2]c (where R1, R2, and R3 are univalent organic groups, at least two of which are univalent organic groups which contain epoxy groups and are free of aromatic rings; more than 20 mole % of R3 are aryl groups; a+b+c equals 1; on average, “a” satisfies the following condition: 0≦a≦0.8; on average, “b” satisfies the following condition: 0.2≦b≦0.8; and, on average, “c” satisfies the following condition: 0.2
摘要翻译：可固化的有机硅组合物包括：（A）由下面给出的硅氧烷单元式（1）表示的具有至少两个含有环氧基并且不含芳环的一价有机基团的有机聚硅氧烷：[R 13 SiO 1/2] a [R 22 SiO 2 / 2] b [R3SiO3 / 2] c（其中R1，R2和R3是一价有机基团，其中至少两个是含有环氧基并且不含芳环的一价有机基团;大于20摩尔％的R3是芳基; a + b + c等于1;平均而言，“a”满足以下条件：0＆nlE; a＆nlE; 0.8;平均而言，“b”满足以下条件：0.2＆nlE; b＆nlE; 0.8; ，“c”满足以下条件：0.2

3. 发明申请

US20060073347A1 Curable organopolysiloxane composition and a semiconductor device made with the use of this composition 有权
标题翻译：可固化的有机聚硅氧烷组合物和使用该组合物制成的半导体器件
公开(公告)号：US20060073347A1
公开(公告)日：2006-04-06
申请号：US10530693
申请日：2003-09-08
申请人： Yoshitsugu Morita , Tomoko Kato , Atsushi Togashi , Hiroji Enami
发明人： Yoshitsugu Morita , Tomoko Kato , Atsushi Togashi , Hiroji Enami
IPC分类号： B32B27/06 , C08L83/04 , H01L21/56
CPC分类号： C08K5/5419 , C08G77/12 , C08G77/20 , C08G77/70 , C08K5/56 , C08L83/04 , C08L2205/02 , H01L2224/48091 , H01L2224/48247 , H01L2224/8592 , H01L2924/1301 , H01L2924/181 , H01L2924/3025 , Y10T428/31663 , C08L83/00 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： A curable organopolysiloxane composition includes: (A) a straight-chain organopolysiloxane having per molecule at least two silicon-bonded alkenyl groups and at least one silicon-bonded aryl group; (B) a branched-chain organopolysiloxane with siloxane units represented by the following general formula: RSiO3/2, where R is a substituted or unsubstituted monovalent hydrocarbon group, and having per molecule at least one silicon-bonded alkenyl group and at least one silicon-bonded aryl group; (C) an organopolysiloxane having in one molecule at least two silicon-bonded hydrogen atoms; and (D) a hydrosilylation catalyst; and a semiconductor device with a semiconductor element coated with a cured body of the aforementioned composition.
摘要翻译：可固化的有机聚硅氧烷组合物包括：（A）每分子具有至少两个硅键合的烯基和至少一个与硅键合的芳基的直链有机聚硅氧烷; （B）具有由以下通式表示的硅氧烷单元的支链有机聚硅氧烷：其中R是取代或未取代的单价烃基，并且每分子具有至少一个硅 - 键合的烯基和至少一个与硅键合的芳基; （C）在一个分子中具有至少两个与硅键合的氢原子的有机聚硅氧烷; 和（D）氢化硅烷化催化剂; 以及具有涂覆有上述组成的固化体的半导体元件的半导体器件。

4. 发明授权

US07282270B2 Curable organopolysiloxane composition and a semiconductor device made with the use of this composition 有权
标题翻译：可固化的有机聚硅氧烷组合物和使用该组合物制成的半导体器件
公开(公告)号：US07282270B2
公开(公告)日：2007-10-16
申请号：US10530693
申请日：2003-09-08
申请人： Yoshitsugu Morita , Tomoko Kato , Atsushi Togashi , Hiroji Enami
发明人： Yoshitsugu Morita , Tomoko Kato , Atsushi Togashi , Hiroji Enami
IPC分类号： B32B9/04
CPC分类号： C08K5/5419 , C08G77/12 , C08G77/20 , C08G77/70 , C08K5/56 , C08L83/04 , C08L2205/02 , H01L2224/48091 , H01L2224/48247 , H01L2224/8592 , H01L2924/1301 , H01L2924/181 , H01L2924/3025 , Y10T428/31663 , C08L83/00 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： A curable organopolysiloxane composition includes: (A) a straight-chain organopolysiloxane having per molecule at least two silicon-bonded alkenyl groups and at least one silicon-bonded aryl group; (B) a branched-chain organopolysiloxane with siloxane units represented by the following general formula: RSiO3/2, where R is a substituted or unsubstituted monovalent hydrocarbon group, and having per molecule at least one silicon-bonded alkenyl group and at least one silicon-bonded aryl group; (C) an organopolysiloxane having in one molecule at least two silicon-bonded hydrogen atoms; and (D) a hydrosilylation catalyst; and a semiconductor device with a semiconductor element coated with a cured body of the aforementioned composition.
摘要翻译：可固化的有机聚硅氧烷组合物包括：（A）每分子具有至少两个硅键合的烯基和至少一个与硅键合的芳基的直链有机聚硅氧烷; （B）具有由以下通式表示的硅氧烷单元的支链有机聚硅氧烷：其中R是取代或未取代的单价烃基，并且每分子具有至少一个硅 - 键合的烯基和至少一个与硅键合的芳基; （C）在一个分子中具有至少两个与硅键合的氢原子的有机聚硅氧烷; 和（D）氢化硅烷化催化剂; 以及具有涂覆有上述组成的固化体的半导体元件的半导体器件。

5. 发明授权

US07405251B2 Flame retardant compositions 有权
标题翻译：阻燃组合物
公开(公告)号：US07405251B2
公开(公告)日：2008-07-29
申请号：US10512733
申请日：2003-05-15
申请人： David Joseph Romenesko , Randall Gene Schmidt , Atsushi Togashi , Gary Michael Wieber
发明人： David Joseph Romenesko , Randall Gene Schmidt , Atsushi Togashi , Gary Michael Wieber
IPC分类号： C08L83/05 , C08L69/00 , C08L55/02
CPC分类号： C08L101/00 , C08G77/12 , C08G77/16 , C08G77/18 , C08G77/20 , C08G77/44 , C08G77/70 , C08L83/04 , C08L2666/14 , C08L2666/02
摘要： This invention relates to a flame retardant composition comprising: (a) 81 to 99.99 weight percent of a thermoplastic resin, thermoset resin, thermoplastic resin blend, or thermoset resin blend which upon burning forms a char and (b) 0.01-19 weight percent of a silsesquioxane resin having a weight average molecular weight of greater than 300.
摘要翻译：本发明涉及一种阻燃剂组合物，其包含：（a）81至99.99重量％的热塑性树脂，热固性树脂，热塑性树脂共混物或热固树脂共混物，其在燃烧时形成炭，（b）0.01-19重量％重均分子量大于300的倍半硅氧烷树脂。

6. 发明授权

US5708046A Silicone release coating compostions 失效
标题翻译：硅胶脱模涂料组合物
公开(公告)号：US5708046A
公开(公告)日：1998-01-13
申请号：US716981
申请日：1996-09-20
申请人： John Darrell Jones , Michael Ward Skinner , Nobuo Kaiya , Atsushi Togashi , Takateru Yamada
发明人： John Darrell Jones , Michael Ward Skinner , Nobuo Kaiya , Atsushi Togashi , Takateru Yamada
IPC分类号： C08L83/05 , C08F2/46 , C08K5/00 , C08K5/05 , C08L83/04 , C08L83/07 , C09D183/04
CPC分类号： C08K5/05 , C08K5/0008 , C09D183/04 , Y10T428/31663
摘要： The present invention relates to a curable silicone release coating composition comprising a mixture of an organopolysiloxane containing at least two alkenyl groups per compound, an organohydrogensilicon compound, inhibitors having a boiling point of up to 130.degree. C. at atmospheric pressure, inhibitors having a boiling point of at least 170.degree. C. at atmospheric pressure a platinum group metal-containing catalyst, and optionally a diluent. The silicone release coating compositions are stable when stored at room temperature, especially when the composition is used on a coating roll for the production of a thin films. The compositions of this invention also quickly form a cured film having good release properties for adhesive materials at a comparatively low temperatures.
摘要翻译：本发明涉及可固化的有机硅剥离涂料组合物，其包含每种化合物含有至少两个烯基的有机聚硅氧烷，有机氢硅化合物，在大气压下沸点高达130℃的抑制剂，沸点在大气压下至少170℃的含铂族金属的催化剂和任选的稀释剂。当在室温下储存时，有机硅剥离涂料组合物是稳定的，特别是当该组合物用于制造薄膜的涂布辊上时。本发明的组合物也可在较低温度下快速形成具有良好的粘合剂材料剥离性能的固化膜。

7. 发明授权

US5300607A Method for preparing silicone resins 失效
标题翻译：硅树脂制备方法
公开(公告)号：US5300607A
公开(公告)日：1994-04-05
申请号：US944141
申请日：1992-09-11
申请人： Junji Nakanishi , Toshio Saruyama , Atsushi Togashi
发明人： Junji Nakanishi , Toshio Saruyama , Atsushi Togashi
IPC分类号： C08G77/08 , C08G77/06 , C08G77/10 , C08G77/22 , C08G77/24
CPC分类号： C08G77/10 , C08G77/06
摘要： Silicone resins containing monorganosiloxane and diorganosiloxane units and exhibiting reproducible values of molecular weight and dispersity are prepared by condensing a mixture of hydrolyzed silanes, adjusting the solids content of the condensed resin and then subjecting the resultant product to a re-equilibration reaction in the presence of an alkali metal compound.
摘要翻译：含有单有机硅氧烷和二有机硅氧烷单元的硅氧烷树脂并显示出可重现的分子量和分散性值，通过将水解硅烷的混合物冷凝，调节冷凝树脂的固体含量，然后在所存在的条件下进行再平衡反应碱金属化合物。

8. 发明授权

US5232959A Organohydrogenpolysiloxanes and curable organosiloxane compositions containing same 失效
标题翻译：组氨酸聚合物和可固化的有机硅氧烷组合物
公开(公告)号：US5232959A
公开(公告)日：1993-08-03
申请号：US703956
申请日：1991-05-22
申请人： Atsushi Togashi , Akira Kasuya
发明人： Atsushi Togashi , Akira Kasuya
IPC分类号： C08G77/48 , C08G77/50 , C08L83/04 , C08L83/07
CPC分类号： C08G77/50 , C08G77/485 , C08L83/04 , C08G77/12 , C08G77/14 , C08G77/20 , C08G77/24 , C08G77/70
摘要： This invention provides a novel class of organohydrogenpolysiloxanes that function as curing agents for organosiloxane compositions curable by a hydrosilylation reaction in addition to imparting excellent adhesion to the cured composition. This invention also provides curable organosiloxane compositions containing these novel organohydrogen-polysiloxanes. The compositions exhibit excellent adhesion to a variety of organic and inorganic substrates, including but not limited to metals, glasses, and plastics.

9. 发明申请

US20060252890A1 Flame retardant compositions 有权
标题翻译：阻燃组合物
公开(公告)号：US20060252890A1
公开(公告)日：2006-11-09
申请号：US10512733
申请日：2003-05-15
申请人： David Romenesko , Randall Schmidt , Atsushi Togashi , Gary Wieber
发明人： David Romenesko , Randall Schmidt , Atsushi Togashi , Gary Wieber
IPC分类号： C08L83/00
CPC分类号： C08L101/00 , C08G77/12 , C08G77/16 , C08G77/18 , C08G77/20 , C08G77/44 , C08G77/70 , C08L83/04 , C08L2666/14 , C08L2666/02
摘要： This invention relates to a flame retardant composition comprising: (a) 81 to 99.99 weight percent of a thermoplastic resin, thermoset resin, thermoplastic resin blend, or thermoset resin blend which upon burning forms a char and (b) 0.01-19 weight percent of a silsesquioxane resin having a weight average molecular weight of greater than 300 and having the average molecular formula: (R3SiO1/2)a (R2SiO2/2)b (RSiO3/2)c (SiO4/2)d(RO1/2)e (OH1/2)f wherein each R is hydrogen, an alkyl group, an alkenyl group, or an aryl group having from 6 to 12 carbon atoms, a and b are zero or positive numbers and the value of a+b is greater than zero, c is a positive number, d, e and f are zero or positive numbers with the provisos that the copolymer comprises at least 40 mole percent of RSiO3/2 units, the copolymer comprises less than 10 mole percent SiO4/2 units, greater than 30 mole percent of the silicon-bonded R groups are silicon-bonded aryl groups, greater than 0.5 mole percent of the silicon-bonded R groups are silicon-bonded hydrogen atoms, the content of silicon-bonded hydroxyl groups is equal to or less than 2 weight percent, and the content of silicon-bonded alkoxy groups where the alkoxy group is methoxy or ethoxy is equal to or less than 5 weight percent.
摘要翻译：本发明涉及一种阻燃剂组合物，其包含：（a）81至99.99重量％的热塑性树脂，热固性树脂，热塑性树脂共混物或热固树脂共混物，其在燃烧时形成炭，（b）0.01-19重量％重均分子量大于300且具有以下平均分子式的倍半硅氧烷树脂：（R 3 3 SiO 1/2）（R 2 SiO 2/2/2）b（RS 3 O 3/2））C（N 2）（SiO 2/2/2）2（SiO 2/2）（OH 1/2）其中每个R是氢，烷基，烯基或具有6至12个碳原子的芳基，a和b 是零或正数，a + b的值大于零，c是正数，d，e和f是零或正数，条件是共聚物包含至少40摩尔％的RSiO 3/2个单元，共聚物包括较少超过10摩尔％的SiO 2/2/2单位，大于30摩尔％的与硅键合的R基团是硅键合的芳基，大于0.5摩尔％的与硅键合的R基团是硅键合的氢原子的含量等于或小于2重量％，烷氧基为甲氧基或乙氧基的硅键合烷氧基的含量等于或小于5重量％。

10. 发明授权

US5914192A Silicone release coating compositions 失效
标题翻译：硅酮脱模涂料组合物
公开(公告)号：US5914192A
公开(公告)日：1999-06-22
申请号：US976700
申请日：1997-11-24
申请人： Nobuo Kaiya , Taku Koyama , Atsushi Togashi
发明人： Nobuo Kaiya , Taku Koyama , Atsushi Togashi
IPC分类号： C09K3/00 , C08K5/05 , C08K5/5415 , C08K5/5419 , C08L83/05 , C08L83/07 , C09D5/00 , C09D183/04 , C09D183/05 , C09D183/07 , C09J7/02 , C08G77/08
CPC分类号： C08K5/5419 , C08K5/05 , C09D183/04 , Y10T428/31663
摘要： This invention relates to a silicone release coating composition comprising an organopolysiloxane having at least 2 alkenyl groups in each molecule, an organopolysiloxane having at least 3 silicon-bonded hydrogen atoms in each molecule, a carbon-carbon triple bond-functional alcohol having a boiling point at ambient pressure of at least 140.degree. C., an organosilicon compound having at least 3 carbon-carbon triple bond-functional hydrocarbon groups bonded across oxygen to silicon, and a platinum catalyst. The silicone release coating compositions of this invention have excellent bath stability, form a very stable thin film on applicator rolls, cure rapidly even at relatively low temperatures, have stable curing characteristics during the course of bath aging, and exhibit stable release values during the course of bath aging.
摘要翻译：本发明涉及一种有机硅剥离涂料组合物，其包含在每个分子中具有至少2个烯基的有机聚硅氧烷，每个分子中具有至少3个与硅键合的氢原子的有机聚硅氧烷，具有沸点的碳 - 碳三键官能醇在至少140℃的环境压力下，具有至少3个碳 - 碳三键官能团的氧与硅结合的有机硅化合物和铂催化剂。本发明的有机硅剥离涂料组合物具有优异的浴稳定性，在涂布辊上形成非常稳定的薄膜，即使在相对较低的温度下也能快速固化，在浴老化过程中具有稳定的固化特性，并且在该过程中显示出稳定的释放值的浴老化。

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