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    • 1. 发明授权
    • Plate thickness measuring method and apparatus
    • 板厚测量方法及装置
    • US4564296A
    • 1986-01-14
    • US305374
    • 1981-09-24
    • Yoshitada OshidaHiroshi MakiharaNobuhiko Aoki
    • Yoshitada OshidaHiroshi MakiharaNobuhiko Aoki
    • G01B11/00G01B11/06H01L21/66
    • G01B11/06
    • A plate thickness measuring method and apparatus, is provided wherein a fine pattern is projected on the front and rear surfaces of an object to be measured via object lenses oppositely provided on the front and rear surfaces of the object to be measured in its thickness. The image of the projected pattern on the object to be measured is formed via said object lenses, and the contrast of the formed pattern image is detected. Then the object lenses are moved slightly to achieve the maximum of the contrast, or to perform an automatic focusing control. The thickness of the object to be measured can then be estimated from the difference of the positions of the object lenses at which the maximum contrast, or the focused condition, are obtained.
    • 提供了一种板厚测量方法和装置,其中精细图案通过相对设置在被测量物体的前表面和后表面上的物镜在其厚度上投影在被测量物体的前表面和后表面上。 通过所述物镜形成待测物体上的投影图案的图像,并且检测形成的图案图像的对比度。 然后物镜稍微移动以达到对比度的最大值,或进行自动对焦控制。 然后可以从获得最大对比度或聚焦条件的物镜的位置的差异来估计被测量物体的厚度。