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1. 发明授权

US07175408B2 Mold monitoring apparatus for injection molding machine 有权
标题翻译：注塑机模具监控设备
公开(公告)号：US07175408B2
公开(公告)日：2007-02-13
申请号：US10411273
申请日：2003-04-11
申请人： Yoshio Watanabe , Hirokazu Ihara
发明人： Yoshio Watanabe , Hirokazu Ihara
IPC分类号： B29C45/76
CPC分类号： B29C45/76 , B29C2945/76167 , B29C2945/76394 , B29C2945/76418 , B29C2945/76461
摘要： A mold monitoring apparatus for an injection molding machine captures an image of a cavity portion of an opened mold, and determines the state of the cavity portion by means of image processing. The apparatus includes a light emitting unit, an image capturing unit, and an image processing unit. The light emitting unit projects onto the cavity portion light rays other than visible light rays. The image capturing unit includes an image sensor for capturing reflection light rays that travel from the cavity portion to the image sensor via a filter for blocking visible light rays. The image processing unit determines the state of the cavity portion on the basis of an image signal output from the image sensor and through image processing.
摘要翻译：用于注射成型机的模具监控装置捕获打开的模具的空腔部分的图像，并且通过图像处理确定空腔部分的状态。该装置包括发光单元，图像捕获单元和图像处理单元。发光单元突出到可见光线以外的空腔部分的光线。图像拍摄单元包括图像传感器，用于捕获通过用于阻挡可见光线的滤光器从空腔部分传播到图像传感器的反射光线。图像处理单元基于从图像传感器输出的图像信号和图像处理来确定空腔部分的状态。

2. 发明申请

US20080303175A1 Electronic circuit package 失效
标题翻译：电子电路封装
公开(公告)号：US20080303175A1
公开(公告)日：2008-12-11
申请号：US12222329
申请日：2008-08-07
申请人： Nobuyasu Kanekawa , Hirokazu Ihara , Masatsugu Akiyama , Kiyoshi Kawabata , Hisayoshi Yamanaka , Tetsuya Okishima
发明人： Nobuyasu Kanekawa , Hirokazu Ihara , Masatsugu Akiyama , Kiyoshi Kawabata , Hisayoshi Yamanaka , Tetsuya Okishima
IPC分类号： H01L23/52
CPC分类号： H01L24/49 , G11C5/04 , G11C5/06 , H01L23/50 , H01L23/538 , H01L23/5386 , H01L24/48 , H01L25/0652 , H01L25/18 , H01L2224/48091 , H01L2224/48227 , H01L2224/49433 , H01L2224/73265 , H01L2924/00014 , H01L2924/01005 , H01L2924/01007 , H01L2924/01013 , H01L2924/01019 , H01L2924/01039 , H01L2924/01055 , H01L2924/01074 , H01L2924/014 , H01L2924/12041 , H01L2924/14 , H01L2924/1433 , H01L2924/15183 , H01L2924/15787 , H01L2924/00 , H01L2224/45099 , H01L2224/05599
摘要： An electronic apparatus which includes a wiring substrate which includes wiring conductors, and a plurality of semiconductor bare chips that are formed on the wiring substrate. The semiconductor bare chips include a processor for processing data and a circuit having a checking function for detecting faults of the processor
摘要翻译：一种电子设备，其包括布线基板和布线基板上形成的多个半导体裸芯片。半导体裸芯片包括用于处理数据的处理器和具有用于检测处理器的故障的检查功能的电路

3. 发明授权

US06666675B2 Injection molding nozzle for resin of highly temperature-dependent viscosity 有权
标题翻译：高温依赖粘度树脂注塑喷嘴
公开(公告)号：US06666675B2
公开(公告)日：2003-12-23
申请号：US10059504
申请日：2002-01-29
申请人： Hirokazu Ihara , Nobuyuki Kawahara
发明人： Hirokazu Ihara , Nobuyuki Kawahara
IPC分类号： B29C4520
CPC分类号： B29C45/27
摘要： The purpose of the present invention is to provide a nozzle for resins having a highly temperature-dependent viscosity by dividing the nozzle into a nozzle tip and a nozzle main body, and limiting a passage of a tapered hole formed in the nozzle main body, a gradient of a nozzle port, a passage volume, or the like within specific ranges. The passage 13 in the nozzle main body 1 is formed of a tapered hole with a gentle gradient without a step. The nozzle tip is made of low thermal conductivity metal. The nozzle port at the center of the nozzle tip is formed of a tapered hole. The internal side diameter and the diameter of the front end hole 13a of the passage 13 are set within the range of 0.9-1.5 mm capable of preventing a dropping phenomenon without causing a large pressure loss. The passage volume is limited to 1.0 cm3 or less within the range of 70-115 mm in length of the nozzle main body 1.
摘要翻译：本发明的目的是提供一种通过将喷嘴分成喷嘴头和喷嘴主体而具有高温度依赖性粘度的树脂喷嘴，并且限制形成在喷嘴主体中的锥形孔的通道，在特定范围内的喷嘴口的梯度，通道体积等。喷嘴主体1中的通道13由没有台阶的温和梯度的锥形孔形成。喷嘴尖由低导热性金属制成。喷嘴尖端中心的喷嘴口由锥孔形成。通道13的前端孔13a的内侧直径和直径设定在0.9-1.5mm的范围内，能够防止掉落现象，而不会造成大的压力损失。通道体积在喷嘴主体1的长度为70-115mm的范围内被限制为1.0cm 3以下。

4. 发明授权

US5372340A Spacecraft system 失效
标题翻译：航天器系统
公开(公告)号：US5372340A
公开(公告)日：1994-12-13
申请号：US972766
申请日：1992-11-05
申请人： Hirokazu Ihara , Masaya Yamamoto , Kouhei Kato , Shigehiro Tomita , Masaharu Tadauchi
发明人： Hirokazu Ihara , Masaya Yamamoto , Kouhei Kato , Shigehiro Tomita , Masaharu Tadauchi
IPC分类号： B64G1/10 , B64G4/00 , B64G1/22
CPC分类号： B64G4/00 , B64G1/1085 , B64G1/1007
摘要： A plurality of spacecrafts having their own functions are each provided with a communication controller and its own mission, and communicate with each other to perform specific operations. In addition, a plurality of units having particular functions are housed in a system dock, and arbitrary ones of these units are combined to constitute a spacecraft according to the use. Units responsible for performing the specific operations are interchangeably connected, so as to be separable from the individual spacecraft.
摘要翻译：具有各自功能的多个航天器各自设置有通信控制器及其自己的任务，并且彼此通信以执行特定的操作。此外，具有特定功能的多个单元被容纳在系统坞中，并且这些单元中的任意单元被组合以构成根据用途的航天器。负责执行特定操作的单元可互换连接，以便与单个航天器分离。

5. 发明授权

US4834638A Apparatus for molding a head end an a tubular container 失效
标题翻译：用于模制头端的管状容器的装置
公开(公告)号：US4834638A
公开(公告)日：1989-05-30
申请号：US36560
申请日：1987-04-09
申请人： Masaaki Miyahara , Atsuo Matsui , Koh Shimizu , Hirokazu Ihara , Teruo Miyazawa
发明人： Masaaki Miyahara , Atsuo Matsui , Koh Shimizu , Hirokazu Ihara , Teruo Miyazawa
IPC分类号： B29C45/14 , B29C45/26 , B29D23/20 , B29L31/00
CPC分类号： B29C45/14598 , B29D23/20 , B29L2023/20
摘要： A tube container molding apparatus in which a cylindrical tube is inserted into a split mold in its closed state so that the end section of the tube comes into contact with a cavity face of the split mold. A core is then advanced to fit into the tube from its rear end, and finally a resin melt is introduced into the cavity formed by the cavity face of the split mold and the end face of the core.When the resin melt is injected into the cavity, a tube holding piece pushes the tube against the core to prevent the tube from being drawn out of the cavity.Midway during the advance of the core into the tube, the tube is held by the tube holding piece and the further advance of the tube is made together with the core. Thus, the forward end section of the tube is bent inward to a prescribed width.
摘要翻译：一种管状容器成形装置，其中，圆筒形管在其闭合状态下插入到分开模具中，使得管的端部与分模的空腔面接触。然后将芯从其后端推进到管中，最后将树脂熔体引入由分模的空腔面和芯的端面形成的空腔中。当树脂熔体被注入空腔中时，管保持件将管推到芯上以防止管从腔中拉出。在核心进入管道的过程中途，管被管夹持件保持，并且管的进一步前进与芯一起制成。因此，管的前端部向内弯曲到规定的宽度。

6. 发明授权

US4763254A Information processing system with data storage on plural loop transmission line 失效
标题翻译：具有数据存储在多个回路传输线上的信息处理系统
公开(公告)号：US4763254A
公开(公告)日：1988-08-09
申请号：US498553
申请日：1983-05-26
申请人： Kinji Mori , Yuko Kunai , Masakazu Akiyama , Tadaaki Kadoya , Katsumi Kawano , Shoji Miyamoto , Makoto Nohmi , Sadanori Shingai , Hirokazu Ihara
发明人： Kinji Mori , Yuko Kunai , Masakazu Akiyama , Tadaaki Kadoya , Katsumi Kawano , Shoji Miyamoto , Makoto Nohmi , Sadanori Shingai , Hirokazu Ihara
IPC分类号： G06F13/40 , G06F15/173 , H04L12/42 , G06F13/02
CPC分类号： G06F13/4027 , G06F15/17337 , H04L12/42
摘要： An information processing system includes a loop-shaped signal transmission line for transmitting data to be stored, a plurality of transmission control processors disposed around the transmission line, and information processing units for inputting and outputting data to and from the signal transmission line through the corresponding transmission control processors. Each of the transmission control processors is adapted to variably control the signal amplitude of data flowing around the signal transmission line in accordance with the utilization of the data in the corresponding information processing unit.
摘要翻译：一种信息处理系统，包括用于发送要存储的数据的环形信号传输线，设置在传输线周围的多个传输控制处理器，以及用于通过相应的信号传输线路输入和输出数据的信息处理单元传输控制处理器。每个传输控制处理器适于根据相应的信息处理单元中的数据的利用来可变地控制围绕信号传输线流动的数据的信号幅度。

7. 发明授权

US4486829A Method and apparatus for detecting a faulty computer in a multicomputer system 失效
标题翻译：用于检测多计算机系统中的故障计算机的方法和装置
公开(公告)号：US4486829A
公开(公告)日：1984-12-04
申请号：US363841
申请日：1982-03-31
申请人： Kinji Mori , Hirokazu Ihara
发明人： Kinji Mori , Hirokazu Ihara
IPC分类号： G06F13/00 , G06F11/00 , G06F11/20 , H04L12/437
CPC分类号： H04L12/437
摘要： In a method of controlling a multicomputer system which includes a plurality of computers connected to a common transfer bus, each of the plurality of computers decides whether or not the adjacent computer is abnormal, and the computer which has decided that the adjacent computer is abnormal cuts off this adjacent computer from the transfer bus.
摘要翻译：在一种控制多计算机系统的方法中，所述多计算机系统包括连接到公共传输总线的多个计算机，所述多个计算机中的每一个计算机判定相邻的计算机是否异常，并且所述计算机判定相邻的计算机是异常的从传输总线关闭这个相邻的计算机。

8. 发明授权

US4354267A Data transmission system utilizing loop transmission lines between terminal units 失效
标题翻译：数据传输系统利用终端单元之间的环路传输线路
公开(公告)号：US4354267A
公开(公告)日：1982-10-12
申请号：US149632
申请日：1980-05-14
申请人： Kinji Mori , Hirokazu Ihara , Makoto Nohmi
发明人： Kinji Mori , Hirokazu Ihara , Makoto Nohmi
IPC分类号： G06F13/00 , H04L12/437 , G06F11/20 , H04J3/14
CPC分类号： H04L12/437
摘要： There is disclosed a data transmission system comprising a first and a second loop transmission line for transferring data in its clockwise and counterclockwise directions, respectively. In each loop transmission line a plurality of transmission control units are connected in series. Further, a plurality of terminal units each are interconnected with its associated first and second transmission control units correspondingly and respectively located in the first and second loop transmission lines. Each of the transmission control units in the first loop transmission line is interconnected to a corresponding one of the transmission control units in the second loop transmission line by a bypass line so as to make a pair, so that a fault in the loop transmission line may be detected and a loop transmission line bypassing the fault point may be established without using any master transmission control unit.
摘要翻译：公开了一种数据传输系统，包括用于分别沿其顺时针和逆时针方向传送数据的第一和第二环路传输线。在每个环路传输线中，多个传输控制单元串联连接。此外，多个终端单元各自与相关联的第一和第二传输控制单元相互连接并分别位于第一和第二环路传输线路中。第一环路传输线路中的每个传输控制单元通过旁路线路互连到第二环路传输线路中的相应一个传输控制单元，以便成对，使得环路传输线路中的故障可以并且可以在不使用任何主传输控制单元的情况下建立绕过故障点的环路传输线。

9. 发明授权

US07233534B2 Electronic circuit package 失效
标题翻译：电子电路封装
公开(公告)号：US07233534B2
公开(公告)日：2007-06-19
申请号：US11180733
申请日：2005-07-14
申请人： Nobuyasu Kanekawa , Hirokazu Ihara , Masatsugu Akiyama , Kiyoshi Kawabata , Hisayoshi Yamanaka , Tetsuya Okishima
发明人： Nobuyasu Kanekawa , Hirokazu Ihara , Masatsugu Akiyama , Kiyoshi Kawabata , Hisayoshi Yamanaka , Tetsuya Okishima
IPC分类号： G11C7/00
CPC分类号： H01L24/49 , G11C5/04 , G11C5/06 , H01L23/50 , H01L23/538 , H01L23/5386 , H01L24/48 , H01L25/0652 , H01L25/18 , H01L2224/48091 , H01L2224/48227 , H01L2224/49433 , H01L2224/73265 , H01L2924/00014 , H01L2924/01005 , H01L2924/01007 , H01L2924/01013 , H01L2924/01019 , H01L2924/01039 , H01L2924/01055 , H01L2924/01074 , H01L2924/014 , H01L2924/12041 , H01L2924/14 , H01L2924/1433 , H01L2924/15183 , H01L2924/15787 , H01L2924/00 , H01L2224/45099 , H01L2224/05599
摘要： An electronic apparatus which includes a wiring substrate which includes wiring conductors, and a plurality of semiconductor bare chips that are formed on the wiring substrate. The semiconductor bare chips include a processor for processing data and a circuit having a checking function for detecting faults of the processor.
摘要翻译：一种电子设备，其包括布线基板和布线基板上形成的多个半导体裸芯片。半导体裸芯片包括用于处理数据的处理器和具有用于检测处理器的故障的检查功能的电路。

10. 发明授权

US06728904B2 Electronic circuit package 失效
标题翻译：电子电路封装
公开(公告)号：US06728904B2
公开(公告)日：2004-04-27
申请号：US10370518
申请日：2003-02-24
申请人： Nobuyasu Kanekawa , Hirokazu Ihara , Masatsugu Akiyama , Kiyoshi Kawabata , Hisayoshi Yamanaka , Tetsuya Okishima
发明人： Nobuyasu Kanekawa , Hirokazu Ihara , Masatsugu Akiyama , Kiyoshi Kawabata , Hisayoshi Yamanaka , Tetsuya Okishima
IPC分类号： H01L2338
CPC分类号： H01L24/49 , G11C5/04 , G11C5/06 , H01L23/50 , H01L23/538 , H01L23/5386 , H01L24/48 , H01L25/0652 , H01L25/18 , H01L2224/48091 , H01L2224/48227 , H01L2224/49433 , H01L2224/73265 , H01L2924/00014 , H01L2924/01005 , H01L2924/01007 , H01L2924/01013 , H01L2924/01019 , H01L2924/01039 , H01L2924/01055 , H01L2924/01074 , H01L2924/014 , H01L2924/12041 , H01L2924/14 , H01L2924/1433 , H01L2924/15183 , H01L2924/15787 , H01L2924/00 , H01L2224/45099 , H01L2224/05599
摘要： An electronic circuit package having a wiring substrate, at least two semiconductor chips and a bus line. All the semiconductor chips to be connected by means of the bus line are bare chip packaged on a wiring substrate, and the semiconductor chips and the wiring substrate are connected by wiring bonding between wire bonding pads formed on the semiconductor chips and the wiring substrate. The wiring substrate may be a multilayered substrate. Preferably, there is an insulating layer partially formed on the surface of the multilayer wiring substrate and a die bonding ground formed on the surface of the insulating layer, in order to use a portion of the multilayer wiring substrate under the die bonding ground as a wiring or a via hole region, and at least one of the semiconductor chips is formed on the die bonding ground. The bus line preferably includes two data bus lines, the semiconductor chips connected with one data bus line are formed on one side of the wiring substrate and the semiconductor chips connected with the other data bus line are formed on the other side of the wiring substrate.
摘要翻译：一种具有布线基板，至少两个半导体芯片和总线的电子电路封装。通过总线连接的所有半导体芯片都是裸线封装在布线基板上，并且半导体芯片和布线基板通过在半导体芯片上形成的引线键合焊盘和布线基板之间的布线接合来连接。布线基板可以是多层基板。优选地，在多层布线基板的表面上形成绝缘层和形成在绝缘层的表面上的管芯接合接地，以便在芯片接合地下使用多层布线基板的一部分作为布线或通孔区域，并且在芯片接合地上形成至少一个半导体芯片。总线优选地包括两条数据总线，与一条数据总线连接的半导体芯片形成在布线基板的一侧，并且在另一条数据总线上连接的半导体芯片形成在布线基板的另一侧。

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