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    • 3. 发明授权
    • Method for producing hollow structual body
    • 生产中空结构体的方法
    • US08366980B2
    • 2013-02-05
    • US12668950
    • 2008-07-30
    • Terunori YamaguchiShinji HashiguchiMitsuo Ueno
    • Terunori YamaguchiShinji HashiguchiMitsuo Ueno
    • C04B40/00B27N3/08F16L9/00B29C47/00
    • D01F11/04B29C67/0014D01D5/24D06M11/09D06M11/11D06M11/17D06M11/22
    • It is intended to provide a method of producing a hollow construct, which may be in various shapes such as a fiber or a film as well as in various sizes and has chemical resistance, made of a fluorinated hydrocarbon polymer, a fluorinated carbon polymer or a polymer carrying a nitrogen-containing group, a silicon-containing group, an oxygen-containing group, a phosphorus-containing group or a sulfur-containing group having been introduced into the above-described polymer; and a hollow construct obtained by this method. The method of producing a hollow construct as described above is characterized by comprising the fluorination step wherein a construct made of a hydrocarbon polymer or a polymer carrying a nitrogen-containing group, a silicon-containing group, an oxygen-containing group, a phosphorus-containing group or a sulfur-containing group having been introduced into the above-described polymer is brought into contact with a treating gas containing fluorine under definite conditions and thus the treating gas is allowed to penetrate from the outer surface of the construct toward the inside thereof to thereby fluorinate the construct excluding the core part, and the removal step wherein the core part having been not fluorinated as described above is removed.
    • 本发明提供一种中空构造体的制造方法,该中空构造体可以是各种形状,例如纤维或膜,以及各种尺寸,并且具有耐化学性,由氟化烃聚合物,氟化碳聚合物或 携带含氮基团的聚合物,含有导入到上述聚合物中的含氮基团,含氧基团,含磷基团或含硫基团; 和通过该方法获得的中空构造。 如上所述的制造中空构造体的方法的特征在于包括氟化步骤,其中由烃聚合物或携带含氮基团的聚合物,含硅基团,含氧基团, 导入上述聚合物的含氟基团或含硫基团在一定条件下与含氟处理气体接触,从而允许处理气体从构造体的外表面向其内部渗透 除去核心部分以外的构造物氟化,除去上述未被氟化的芯部的除去工序。
    • 4. 发明授权
    • Apparatus for manufacturing circuit modules
    • 用于制造电路模块的装置
    • US06441339B1
    • 2002-08-27
    • US09667675
    • 2000-09-22
    • Mitsuo Ueno
    • Mitsuo Ueno
    • B23K2600
    • H05K3/3494B23K1/0056B23K2101/40H05K3/3442H05K2201/0108H05K2201/10636H05K2203/0475H05K2203/107H05K2203/108Y02P70/611
    • A manufacturing method of circuit modules comprising steps of melting a solder on a land by an energy of irradiating laser beam, and pressing an external electrode of an electronic component to a melted solder before the melted solder hardens. This method is capable of connecting the electrode of the component to the land of the substrate using the solder sufficiently heated and melted. A manufacturing apparatus of circuit modules comprises an adsorbing nozzle which adsorbs an electronic component and mounts it on a substrate, an optical system which projects laser beams to a solder preliminarily applied to an electrode of a substrates, and a control device which controls a component mounting and a laser beam irradiation so that the electrode of the electronic component is pressed to the solder melted by an energy of a irradiating laser beam before the melted solder hardens. This apparatus is capable of connecting the component with the above laser beam while controlling the component mounting and the laser beam irradiation.
    • 一种电路模块的制造方法,包括以下步骤:通过照射激光束的能量在焊盘上熔化焊料,并且在熔化的焊料硬化之前将电子部件的外部电极按压到熔化的焊料。 该方法能够使用充分加热和熔化的焊料将部件的电极连接到基板的焊盘。 电路模块的制造装置包括吸附电子部件并将其安装在基板上的吸附喷嘴,将激光束投射到预先施加到基板的电极上的焊料的光学系统,以及控制部件安装 以及激光束照射,使得在熔化的焊料硬化之前,将电子部件的电极按压到由照射激光束的能量熔化的焊料。 该装置能够在控制部件安装和激光束照射的同时将部件与上述激光束连接。
    • 6. 发明申请
    • METHOD FOR PRODUCING HOLLOW STRUCTUAL BODY
    • 生产中空结构体的方法
    • US20100196645A1
    • 2010-08-05
    • US12668950
    • 2008-07-30
    • Terunori YamaguchiShinji HashiguchiMitsuo Ueno
    • Terunori YamaguchiShinji HashiguchiMitsuo Ueno
    • B32B1/08B29D23/00
    • D01F11/04B29C67/0014D01D5/24D06M11/09D06M11/11D06M11/17D06M11/22
    • It is intended to provide a method of producing a hollow construct, which may be in various shapes such as a fiber or a film as well as in various sizes and has chemical resistance, made of a fluorinated hydrocarbon polymer, a fluorinated carbon polymer or a polymer carrying a nitrogen-containing group, a silicon-containing group, an oxygen-containing group, a phosphorus-containing group or a sulfur-containing group having been introduced into the above-described polymer; and a hollow construct obtained by this method. The method of producing a hollow construct as described above is characterized by comprising the fluorination step wherein a construct made of a hydrocarbon polymer or a polymer carrying a nitrogen-containing group, a silicon-containing group, an oxygen-containing group, a phosphorus-containing group or a sulfur-containing group having been introduced into the above-described polymer is brought into contact with a treating gas containing fluorine under definite conditions and thus the treating gas is allowed to penetrate from the outer surface of the construct toward the inside thereof to thereby fluorinate the construct excluding the core part, and the removal step wherein the core part having been not fluorinated as described above is removed.
    • 本发明提供一种中空构造体的制造方法,该中空构造体可以是各种形状,例如纤维或膜,以及各种尺寸,并且具有耐化学性,由氟化烃聚合物,氟化碳聚合物或 携带含氮基团的聚合物,含有导入到上述聚合物中的含氮基团,含氧基团,含磷基团或含硫基团; 和通过该方法获得的中空构造。 如上所述的制造中空构造体的方法的特征在于包括氟化步骤,其中由烃聚合物或携带含氮基团的聚合物,含硅基团,含氧基团, 导入上述聚合物的含氟基团或含硫基团在一定条件下与含氟处理气体接触,从而允许处理气体从构造体的外表面向其内部渗透 除去核心部分以外的构造物氟化,除去上述未被氟化的芯部的除去工序。
    • 10. 发明授权
    • Non-magnetic one-component developer
    • 非磁性单组分显影剂
    • US5215849A
    • 1993-06-01
    • US640498
    • 1991-01-14
    • Yoshihiro MakutaMitsuo UenoMinoru IsobeHiroshi KikuchiKatsuyuki Ito
    • Yoshihiro MakutaMitsuo UenoMinoru IsobeHiroshi KikuchiKatsuyuki Ito
    • G03G9/097
    • G03G9/09716
    • A non-magnetic one-component developer suitable for use in a contact or non-contact development system. The developer comprises 100 parts by weight of colored fine particles, which comprises a binder resin and a colorant, and 0.3-10 parts by weight of at least one fine inorganic powder selected from (i) a fine inorganic powder (I) obtained by subjecting a fine inorganic powder having an average particle size of 0.1-10 .mu.m and a heating loss (under drying conditions of 150.degree. C. and 1 hour) of at most 1 wt.% to a hydrophobicity-imparting treatment with a silicone oil and (ii) a fine inorganic powder (II) obtained by subjecting a fine inorganic powder having an average particle size of 0.1-10 .mu.m to a two-step hydrophobicity-imparting treatment with at least one compound selected from silane coupling agents and silazane compounds and then further with a silicone oil.
    • 适合用于接触或非接触显影系统的非磁性单组分显影剂。 显影剂包含100重量份的着色细颗粒,其包含粘合剂树脂和着色剂,以及0.3-10重量份的至少一种选自(i)无机细粉末(I)的至少一种无机细粉末,其通过 平均粒径为0.1-10μm的无机细粉和至少1重量%的热损失(在150℃和1小时的干燥条件下)与使用硅油的疏水性处理相比,以及 (ii)通过使平均粒径为0.1-10μm的无机细粉末与至少一种选自硅烷偶联剂和硅氮烷化合物的化合物进行两步疏水性处理而获得的无机细粉末(II) 然后再用硅油。