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    • 10. 发明申请
    • POSITIVE PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM FORMED FROM THE SAME, AND DEVICE HAVING CURED FILM
    • 阳性感光树脂组合物,由其形成的固化膜和具有固化膜的装置
    • US20120237873A1
    • 2012-09-20
    • US13513270
    • 2010-12-20
    • Takenori FujiwaraKeiichi UchidaYugo TanigakiMitsuhito Suwa
    • Takenori FujiwaraKeiichi UchidaYugo TanigakiMitsuhito Suwa
    • G03F7/075
    • C08G77/14C08G77/70C09D183/06G03F7/0757
    • Disclosed is a positive photosensitive resin composition which contains a polisiloxane, a naphthoquinone diazide compound, and a solvent. The positive photosensitive resin composition is characterized in that the polysiloxane has: an organosilane-derived structure represented by the general formula (1): at a content ration of 20-80% inclusive of Si relative to the overall number of moles of Si atoms in the polysiloxane; and an organosilane-derived structure represented by general formula (2): The positive photosensitive resin composition exhibits high heat resistance, high transparency, and enables high sensitivity, high resolution patterning. The positive photosensitive resin composition can be used to form cured films such as planarization films used in TFT substrates, interlayer insulating films, core materials and cladding materials, and can be used in elements having cured films such as display elements, semiconductor elements, solid-state imaging elements, and optical waveguide elements.
    • 公开了含有聚硅氧烷,萘醌二叠氮化合物和溶剂的正型感光性树脂组合物。 正型感光性树脂组合物的特征在于,聚硅氧烷具有:由通式(1)表示的有机硅烷衍生结构:相对于Si原子的总摩尔数,含量为20〜80%,包括Si的含量 聚硅氧烷; 和由通式(2)表示的有机硅烷衍生物结构:正型感光性树脂组合物的耐热性高,透明性高,能够实现高灵敏度,高分辨率图案化。 正型感光性树脂组合物可以用于形成用于TFT基板,层间绝缘膜,芯材料和包层材料的平坦化膜等固化膜,并且可以用于具有固化膜的元件,例如显示元件,半导体元件, 状态成像元件和光波导元件。