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1. 发明授权

US4194229A Mode selecting assembly for recording and/or reproducing apparatus 失效
标题翻译：用于记录和/或再现装置的模式选择组件
公开(公告)号：US4194229A
公开(公告)日：1980-03-18
申请号：US941090
申请日：1978-09-11
申请人： Yoshinori Yamamoto , Hideo Imai , Yoshikazu Ishimatsu
发明人： Yoshinori Yamamoto , Hideo Imai , Yoshikazu Ishimatsu
IPC分类号： G11B15/02 , G11B15/10 , G11B19/00
CPC分类号： G11B15/10
摘要： A mode selecting assembly for a recording and/or reproducing apparatus includes at least one operating member, which is displaced to change the apparatus over to an operating mode. The operating member is displaced by the revolution of an operating gear having a toothless portion and the operating gear is driven by a pinion. The engagement of the operating gear with the pinion is triggered by a trigger member responsive to the depression of a corresponding operating push button. The operating gear is prevented from further rotation after the establishment of the selected operating mode by a locking member when the selected operating push-button is continuously depressed. The mode selecting assembly further includes timed recording capability wherein the pinion in engagement with the end of the toothed portion of the operating gear maintains the trigger means in an inactive state to place the apparatus in a preparing mode for timed recording. At the preset time, the preparing mode is released by a releasing member and the operating gear is rotated to its original inoperative position where the toothless portion faces the pinion to disengage the operating gear from the pinion.
摘要翻译：用于记录和/或再现装置的模式选择组件包括至少一个操作构件，其被移动以将装置改变为操作模式。操作构件通过具有无齿部分的操作齿轮的旋转而移位，并且操作齿轮由小齿轮驱动。操作齿轮与小齿轮的接合由响应于对应的操作按钮的按下的触发构件触发。当所选择的操作按钮被连续按压时，通过锁定构件建立所选择的操作模式后，防止操作齿轮进一步旋转。模式选择组件还包括定时记录能力，其中与操作齿轮的齿形部分的端部接合的小齿轮将触发装置保持在非活动状态，以将装置置于用于定时记录的准备模式。在预设时间，通过释放构件释放准备模式，并且操作齿轮旋转到其无齿部分面向小齿轮的原始非工作位置，从而将操作齿轮与小齿轮分离。

2. 发明授权

US07825518B2 Semiconductor device and method of manufacturing the same 有权
公开(公告)号：US07825518B2
公开(公告)日：2010-11-02
申请号：US12685169
申请日：2010-01-11
申请人： Hideo Imai , Shuichi Tanaka
发明人： Hideo Imai , Shuichi Tanaka
IPC分类号： H01L23/52
CPC分类号： H01L24/13 , H01L24/11 , H01L2224/05022 , H01L2224/05024 , H01L2224/05124 , H01L2224/05147 , H01L2224/13099 , H01L2224/1319 , H01L2224/136 , H01L2924/0001 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01018 , H01L2924/01022 , H01L2924/01029 , H01L2924/01033 , H01L2924/01074 , H01L2924/01079 , H01L2924/14 , H01L2924/19041 , H01L2924/19043 , H01L2924/0665 , H01L2924/00014
摘要： A semiconductor device including: a semiconductor substrate including an electrode; a resin protrusion formed on the semiconductor substrate; and an interconnect electrically connected to the electrode and formed to extend over the resin protrusion. The interconnect includes a first portion formed on a top surface of the resin protrusion and a second portion formed on a side of a lower portion of the resin protrusion. The second portion has a width smaller than a width of the first portion.

3. 发明授权

US07671476B2 Semiconductor device and method of manufacturing the same 有权
标题翻译：半导体装置及其制造方法
公开(公告)号：US07671476B2
公开(公告)日：2010-03-02
申请号：US11444271
申请日：2006-05-31
申请人： Hideo Imai , Shuichi Tanaka
发明人： Hideo Imai , Shuichi Tanaka
IPC分类号： H01L23/52
CPC分类号： H01L24/13 , H01L24/11 , H01L2224/05022 , H01L2224/05024 , H01L2224/05124 , H01L2224/05147 , H01L2224/13099 , H01L2224/1319 , H01L2224/136 , H01L2924/0001 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01018 , H01L2924/01022 , H01L2924/01029 , H01L2924/01033 , H01L2924/01074 , H01L2924/01079 , H01L2924/14 , H01L2924/19041 , H01L2924/19043 , H01L2924/0665 , H01L2924/00014
摘要： A semiconductor device including: a semiconductor substrate including an electrode; a resin protrusion formed on the semiconductor substrate; and an interconnect electrically connected to the electrode and formed to extend over the resin protrusion. The interconnect includes a first portion formed on a top surface of the resin protrusion and a second portion formed on a side of a lower portion of the resin protrusion. The second portion has a width smaller than a width of the first portion.
摘要翻译：一种半导体器件，包括：包括电极的半导体衬底; 形成在所述半导体基板上的树脂突起; 以及电连接到电极并且形成为在树脂突起上延伸的互连。互连包括形成在树脂突起的顶表面上的第一部分和形成在树脂突起的下部一侧的第二部分。第二部分的宽度小于第一部分的宽度。

4. 发明申请

US20070001200A1 Semiconductor device and method of manufacturing the same 有权
标题翻译：半导体装置及其制造方法
公开(公告)号：US20070001200A1
公开(公告)日：2007-01-04
申请号：US11444271
申请日：2006-05-31
申请人： Hideo Imai , Shuichi Tanaka
发明人： Hideo Imai , Shuichi Tanaka
IPC分类号： H01L29/76
CPC分类号： H01L24/13 , H01L24/11 , H01L2224/05022 , H01L2224/05024 , H01L2224/05124 , H01L2224/05147 , H01L2224/13099 , H01L2224/1319 , H01L2224/136 , H01L2924/0001 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01018 , H01L2924/01022 , H01L2924/01029 , H01L2924/01033 , H01L2924/01074 , H01L2924/01079 , H01L2924/14 , H01L2924/19041 , H01L2924/19043 , H01L2924/0665 , H01L2924/00014
摘要： A semiconductor device including: a semiconductor substrate including an electrode; a resin protrusion formed on the semiconductor substrate; and an interconnect electrically connected to the electrode and formed to extend over the resin protrusion. The interconnect includes a first portion formed on a top surface of the resin protrusion and a second portion formed on a side of a lower portion of the resin protrusion. The second portion has a width smaller than a width of the first portion.
摘要翻译：一种半导体器件，包括：包括电极的半导体衬底; 形成在所述半导体基板上的树脂突起; 以及电连接到电极并且形成为在树脂突起上延伸的互连。互连包括形成在树脂突起的顶表面上的第一部分和形成在树脂突起的下部一侧的第二部分。第二部分的宽度小于第一部分的宽度。

5. 发明授权

US07474525B2 Electronic device 失效
标题翻译：电子设备
公开(公告)号：US07474525B2
公开(公告)日：2009-01-06
申请号：US11981905
申请日：2007-11-01
申请人： Kiyoshi Watanabe , Hiroaki Aikyo , Hideo Imai
发明人： Kiyoshi Watanabe , Hiroaki Aikyo , Hideo Imai
IPC分类号： G06G1/16
CPC分类号： G06F1/1616 , G06F1/1635 , G06F2200/1632
摘要： A clamshell type electronic device includes: a first case; a second case; a hinge portion that rotatably couples the first case and the second case to be foldable; a battery chamber that is provided in the hinge portion for accommodating a battery; a battery cover that covers the battery chamber; and a stylus holder that is provided on an inner face of the battery cover for accommodating a stylus to be removable therefrom by drawing out the stylus from the stylus holder.
摘要翻译：蛤壳型电子设备包括：第一壳体; 第二种情况铰链部分，其可旋转地联接所述第一壳体和所述第二壳体以使其可折叠; 电池室，设置在所述铰链部分中，用于容纳电池; 覆盖电池室的电池盖; 以及设置在电池盖的内表面上的触控笔支架，用于通过从触笔支架拉出触针来容纳可以从中移除的触笔。

6. 发明申请

US20050127504A1 Semiconductor device, semiconductor chip, method for manufacturing semiconductor device, and electronic apparatus 失效
标题翻译：半导体装置，半导体芯片，半导体装置的制造方法以及电子装置
公开(公告)号：US20050127504A1
公开(公告)日：2005-06-16
申请号：US11000516
申请日：2004-11-30
申请人： Hideo Imai
发明人： Hideo Imai
IPC分类号： H01L21/00 , H01L21/28 , H01L21/60 , H01L23/02 , H01L23/12 , H01L23/48 , H01L23/498 , H01L29/40 , H01R11/01 , H05K3/32
CPC分类号： H01L24/12 , H01L23/49811 , H01L24/11 , H01L24/16 , H01L24/28 , H01L24/83 , H01L2224/05567 , H01L2224/05573 , H01L2224/05624 , H01L2224/05647 , H01L2224/13099 , H01L2224/2919 , H01L2224/73204 , H01L2224/81191 , H01L2224/81192 , H01L2224/83205 , H01L2224/83851 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/01078 , H01L2924/01079 , H01L2924/0665 , H01L2924/0781 , H01L2924/14 , H01L2924/15787 , H05K3/323 , H05K2201/023 , H05K2201/10674 , H01L2924/00 , H01L2924/3512 , H01L2924/00014
摘要： A semiconductor device including: a semiconductor chip including a substrate, an outer-connection electrode, and a bump, wherein the bump has a first conductive layer and a second conductive layer provided on the first conductive layer, and the second conductive layer is made of copper; a wiring board having a land; and an insulating material dispersed with conductive particles, wherein the conductive particles connect between the bump and the land, wherein an electrical connection is established by the conductive particles having penetrated to both the second conductive layer and the land.
摘要翻译：一种半导体器件，包括：包括衬底，外部连接电极和凸块的半导体芯片，其中所述凸块具有设置在所述第一导电层上的第一导电层和第二导电层，并且所述第二导电层由铜; 具有焊盘的布线板; 以及分散有导电颗粒的绝缘材料，其中所述导电颗粒连接在所述凸块和所述焊盘之间，其中通过已经穿过所述第二导电层和所述焊盘两者的所述导电颗粒建立电连接。

7. 发明授权

US09000575B2 Semiconductor device having stacked substrates with protruding and recessed electrode connection 有权
公开(公告)号：US09000575B2
公开(公告)日：2015-04-07
申请号：US13403338
申请日：2012-02-23
申请人： Hideo Imai
发明人： Hideo Imai
IPC分类号： H01L23/02 , H01L23/48 , H01L23/52 , H01L29/40 , H01L21/768 , H01L25/065
CPC分类号： H01L23/481 , H01L21/76898 , H01L23/562 , H01L25/0657 , H01L25/074 , H01L2224/03462 , H01L2224/0401 , H01L2224/05009 , H01L2224/05553 , H01L2224/05567 , H01L2224/0557 , H01L2224/05571 , H01L2224/05609 , H01L2224/05611 , H01L2224/05613 , H01L2224/05616 , H01L2224/05618 , H01L2224/05624 , H01L2224/05639 , H01L2224/05647 , H01L2224/05655 , H01L2224/06181 , H01L2224/11462 , H01L2224/11464 , H01L2224/13007 , H01L2224/13017 , H01L2224/13022 , H01L2224/13144 , H01L2224/16146 , H01L2224/16147 , H01L2224/16237 , H01L2224/8114 , H01L2224/81191 , H01L2224/81895 , H01L2225/06513 , H01L2225/06517 , H01L2225/06541 , H01L2924/01327 , H01L2924/00
摘要： A first substrate with a penetration electrode formed thereon is stacked on a second substrate with a protruding electrode formed thereon. The penetration electrode has a recessed portion. The substrates are stacked with the protruding electrode entered in the recessed portion. A distal width of the protruding electrode is smaller than an opening width of the recessed portion.

8. 发明授权

US08174110B2 Semiconductor device having at least two terminals among the plurality of terminals electrically connected to each other while not being adjacent to one other and not being connected to internal circuit 有权
标题翻译：所述多个端子中具有至少两个端子的半导体器件彼此电连接而不彼此相邻并且不连接到内部电路
公开(公告)号：US08174110B2
公开(公告)日：2012-05-08
申请号：US12203199
申请日：2008-09-03
申请人： Hideo Imai
发明人： Hideo Imai
IPC分类号： H01L23/48
CPC分类号： H01L24/10 , G02F1/133308 , H01L23/3114 , H01L24/13 , H01L24/83 , H01L24/90 , H01L2224/05001 , H01L2224/05008 , H01L2224/05022 , H01L2224/05024 , H01L2224/05124 , H01L2224/05548 , H01L2224/05569 , H01L2224/05624 , H01L2224/05644 , H01L2224/05655 , H01L2224/05664 , H01L2224/05666 , H01L2224/05671 , H01L2224/05684 , H01L2224/13 , H01L2224/13008 , H01L2224/13099 , H01L2224/16225 , H01L2224/2919 , H01L2224/73204 , H01L2224/83101 , H01L2224/838 , H01L2924/01005 , H01L2924/01013 , H01L2924/01022 , H01L2924/01024 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01046 , H01L2924/01049 , H01L2924/0105 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/014 , H01L2924/0665 , H01L2924/13091 , H01L2924/14 , H01L2924/15788 , H01L2924/19041 , H01L2924/19043 , H01L2924/00 , H01L2924/01023 , H01L2924/01028 , H01L2924/00014
摘要： A semiconductor device includes a base substrate including an internal circuit, a resin protrusion part that is disposed to protrude on an active face side of the base substrate, and a plurality of terminals that are formed by including an island-shaped conductive film disposed on the resin protrusion part. The plurality of terminals includes a terminal that a conductive state with the internal circuit, and a wiring line that electrically connects at least two terminals among the plurality of terminals is disposed on the active face side.
摘要翻译：一种半导体器件包括：基底基板，包括内部电路;突出于基底基板的有源面侧的树脂突出部;以及多个端子，所述多个端子包括：岛状导电膜，树脂突出部。多个端子包括在主动面侧设置有内部电路的导通状态的端子和将多个端子中的至少两个端子电连接的布线。

9. 发明授权

US07676913B2 Wiring board, method of manufacturing wiring board, and electronic device 有权
标题翻译：接线板，制造布线板的方法和电子设备
公开(公告)号：US07676913B2
公开(公告)日：2010-03-16
申请号：US12016826
申请日：2008-01-18
申请人： Hideo Imai , Kazuaki Sakurada
发明人： Hideo Imai , Kazuaki Sakurada
IPC分类号： H05K3/30
CPC分类号： H05K3/4664 , H05K1/0393 , H05K3/108 , H05K3/125 , H05K3/184 , H05K3/4685 , H05K2201/09881 , H05K2203/013 , Y10T29/49124 , Y10T29/49128 , Y10T29/4913 , Y10T29/49155
摘要： A method of manufacturing a wiring board includes steps of: providing a substrate; forming a first wiring layer on the substrate by photolithography; forming a first insulating layer by ink jetting so as to cover a part of the first wiring layer and expose an exposed section of the first wiring layer; and forming a second wiring layer by ink jetting partly over the first wiring layer, with the first insulating layer being between the part of the first wiring layer and a part of the second wiring layer. A wider variety of conductive material and insulating material can be used for forming the wiring layers and the insulating layers on the substrate by ink jetting, while the wiring board has a first wiring layer having high density.
摘要翻译：制造布线板的方法包括以下步骤：提供基板; 通过光刻在基板上形成第一布线层; 通过喷墨形成第一绝缘层，以覆盖第一布线层的一部分并暴露第一布线层的暴露部分; 以及通过部分地在所述第一布线层上的喷墨形成第二布线层，所述第一绝缘层位于所述第一布线层的所述部分和所述第二布线层的一部分之间。可以使用更多种导电材料和绝缘材料来通过喷墨形成布线层和基板上的绝缘层，同时布线板具有高密度的第一布线层。

10. 发明授权

US07528487B2 Semiconductor device having insulating material dispersed with conductive particles which establish electrical connection by penetrating to both copper conductive layer and land of wiring board 失效
标题翻译：具有分散有导电颗粒的绝缘材料的半导体器件，其通过穿透铜导电层和布线板的焊盘而建立电连接
公开(公告)号：US07528487B2
公开(公告)日：2009-05-05
申请号：US11000516
申请日：2004-11-30
申请人： Hideo Imai
发明人： Hideo Imai
IPC分类号： H01L23/52 , H01L23/48 , H01L23/40 , H01L23/485 , H01L23/498
CPC分类号： H01L24/12 , H01L23/49811 , H01L24/11 , H01L24/16 , H01L24/28 , H01L24/83 , H01L2224/05567 , H01L2224/05573 , H01L2224/05624 , H01L2224/05647 , H01L2224/13099 , H01L2224/2919 , H01L2224/73204 , H01L2224/81191 , H01L2224/81192 , H01L2224/83205 , H01L2224/83851 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/01078 , H01L2924/01079 , H01L2924/0665 , H01L2924/0781 , H01L2924/14 , H01L2924/15787 , H05K3/323 , H05K2201/023 , H05K2201/10674 , H01L2924/00 , H01L2924/3512 , H01L2924/00014
摘要： A semiconductor device including: a semiconductor chip including a substrate, an outer-connection electrode, and a bump, wherein the bump has a first conductive layer and a second conductive layer provided on the first conductive layer, and the second conductive layer is made of copper; a wiring board having a land; and an insulating material dispersed with conductive particles, wherein the conductive particles connect between the bump and the land, wherein an electrical connection is established by the conductive particles having penetrated to both the second conductive layer and the land.
摘要翻译：一种半导体器件，包括：包括衬底，外部连接电极和凸块的半导体芯片，其中所述凸块具有设置在所述第一导电层上的第一导电层和第二导电层，并且所述第二导电层由铜; 具有焊盘的布线板; 以及分散有导电颗粒的绝缘材料，其中所述导电颗粒连接在所述凸块和所述焊盘之间，其中通过已经穿过所述第二导电层和所述焊盘两者的所述导电颗粒建立电连接。

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