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    • 6. 发明申请
    • Solid-state infrared imager
    • 固态红外成像仪
    • US20050029454A1
    • 2005-02-10
    • US10957623
    • 2004-10-05
    • Yoshinori IidaKeitaro ShigenakaNaoya Mashio
    • Yoshinori IidaKeitaro ShigenakaNaoya Mashio
    • H01L27/14H01L27/146H04N5/33H04N5/335H04N5/355H04N5/357H04N5/369H04N5/374G01J5/20
    • H01L27/14649H04N5/33
    • A solid-state infrared imager comprises a matrix array of infrared sensing pixels which are formed as an imaging area on a semiconductor substrate and each of which contains a pn-junction thermoelectric converter element to sense incident infrared radiation, row selection lines each connected to the pixels of a corresponding row, signal lines each connected to the pixels of a corresponding column, a row selection circuit which selects and drives one of the row selection lines, and a signal readout circuit which reads out signal currents output to the signal lines from the pixels corresponding to the row selection line driven by the row selection circuit. Particularly, the signal readout circuit includes a signal line potential stabilizer which stabilizes the potential of the signal line to a constant level, and a current-voltage converter which converts the signal current flowing in a signal line to a signal voltage.
    • 固体红外成像器包括红外感测像素的矩阵阵列,其形成为半导体衬底上的成像区域,并且每个都包含用于感测入射的红外辐射的pn结热电转换器元件,每个连接到 相应行的像素,各自连接到相应列的像素的信号线,选择并驱动行选择行中的一个的行选择电路,以及读出从信号线输出到信号线的信号电流的信号读出电路 对应于由行选择电路驱动的行选择线的像素。 特别地,信号读出电路包括使信号线的电位稳定到恒定电平的信号线势势稳定器,以及将在信号线中流动的信号电流转换为信号电压的电流 - 电压转换器。
    • 7. 发明授权
    • Method for manufacturing an infrared sensor device
    • 红外线传感器装置的制造方法
    • US07045785B2
    • 2006-05-16
    • US10960987
    • 2004-10-12
    • Yoshinori IidaKeitaro ShigenakaNaoya Mashio
    • Yoshinori IidaKeitaro ShigenakaNaoya Mashio
    • G01J5/20
    • G01J5/08G01J5/0853G01J5/20H01L27/14649H01L27/16
    • A method for manufacturing an infrared sensor, including preparing a substrate including a supporting member made of single crystalline silicon, a first layer made of silicon oxide formed on the supporting member, and a second layer made of single crystalline silicon formed on the first layer, embedding a silicon oxide layer over the second layer, forming an infrared detection pixel in the second layer, the infrared detection pixel having a function of converting heat into an electric signal, fanning a supporting beam line including a U-shaped electric conductor on the silicon oxide layer, while forming a gate electrode of a MOS transistor of a peripheral circuit on the second layer, the gate electrode having an electric conductor with U-shaped cross section, forming an infrared absorption layer on the second layer, the infrared absorption layer having a function of converting an infrared ray into heat, and etching the second layer to form a hole for isolating the infrared detection pixel from of the substrate and suspending the infrared detection pixel within the hole by the supporting beam line.
    • 一种制造红外线传感器的方法,包括制备包括由单晶硅制成的支撑构件的基板,形成在支撑构件上的由氧化硅制成的第一层和形成在第一层上的单晶硅制成的第二层, 在所述第二层上嵌入氧化硅层,在所述第二层中形成红外检测像素,所述红外检测像素具有将热量转换为电信号的功能,在所述硅上扇出包括U形导电体的支撑束线 氧化层,同时在第二层上形成外围电路的MOS晶体管的栅电极,栅电极具有U形横截面的导电体,在第二层上形成红外吸收层,红外线吸收层具有 将红外线转换为热的功能,以及蚀刻第二层以形成用于隔离红外线检测pi的孔 从衬底起xel并通过支撑束线将红外检测像素悬挂在孔内。
    • 10. 发明授权
    • Infrared sensor
    • US06770881B2
    • 2004-08-03
    • US10726583
    • 2003-12-04
    • Yoshinori IidaKeitaro Shigenaka
    • Yoshinori IidaKeitaro Shigenaka
    • G01T116
    • H04N5/33H01L27/14634H01L27/14649
    • A low noise, high sensitivity and wide dynamic range uncooled type infrared sensor can effectively reduce the influence of fluctuations of the gate of the amplifier transistor. The infrared sensor comprises an imaging region containing thermoelectric conversion pixels arranged two-dimensionally in the form of a matrix of a plurality of row and a plurality of columns on a semiconductor substrate to detect incident infrared rays, column selection lines, vertical signal lines, said column selection lines and said vertical signal lines being arranged the imaging region, amplifier transistors configured to be modulated by the respective signal voltages generated in the signal lines, storage capacities connected respectively to the drains of the amplifier transistors and configured to store signal charges from the transistors, a plurality of reset circuits for resetting the drain potentials of said amplifier transistors and read circuits for reading the respective signal charges stored in said storage capacities, coupling capacitors being arranged between the vertical signal lines and the gate of amplifier transistors, sampling transistors being connected between the drains and the gates of said amplifier transistors.