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1. 发明授权

US08163120B2 Adhesive for production of IC card, process for producing IC card, and IC card 有权
标题翻译：用于生产IC卡的粘合剂，IC卡的制造工艺和IC卡
公开(公告)号：US08163120B2
公开(公告)日：2012-04-24
申请号：US11883132
申请日：2006-01-26
申请人： Koichiro Higasa , Yoshinori Ito , Masahiko Oota , Yoshinori Igarashi
发明人： Koichiro Higasa , Yoshinori Ito , Masahiko Oota , Yoshinori Igarashi
IPC分类号： B29C65/00
CPC分类号： C09J175/04 , B05C5/0254 , B05C5/027 , B32B37/1284 , B32B37/153 , B32B2309/02 , B32B2425/00 , B42D25/47 , C08G18/12 , C08G18/4812 , G06K19/077 , G06K19/07718 , Y10T156/1052 , Y10T428/263 , Y10T428/264 , Y10T428/269 , Y10T428/31551 , C08G18/3206
摘要： A process for producing an IC card comprising: an application/bonding step of applying an adhesive having a curing rate ratio (80° C./40° C.) of 30 or more on the surface of an inlet film, on which a number of IC modules are mounted, and/or a skin film for covering at least one surface of the inlet film, and bonding the inlet film and the skin film together to form a laminate film; a curing step of curing the adhesive to form a cured resin layer between the inlet film and the skin film of the laminate film; and a card forming step of forming a number of IC cards by dividing the laminate film for each IC module.
摘要翻译：一种用于制造IC卡的方法，包括：施加/粘合步骤，其在入口膜的表面上施加具有30或更高固化速率比（80℃/ 40℃）的粘合剂，的IC模块，和/或用于覆盖入口膜的至少一个表面的皮肤膜，并将入口膜和皮肤膜结合在一起以形成层压膜; 固化步骤，使所述粘合剂固化以在所述层压膜的所述入口膜和所述皮膜之间形成固化树脂层; 以及卡形成步骤，通过分割每个IC模块的层叠膜形成多个IC卡。

2. 发明授权

US08846809B2 Urethane adhesive composition 有权
标题翻译：聚氨酯粘合剂组成
公开(公告)号：US08846809B2
公开(公告)日：2014-09-30
申请号：US12681109
申请日：2008-09-10
申请人： Yoshinori Igarashi , Koichiro Higasa
发明人： Yoshinori Igarashi , Koichiro Higasa
IPC分类号： C08G18/08 , C08L75/00 , C08K5/34 , C08K5/3477 , C07C261/00 , C07C269/00 , C07C249/00 , C07C251/00 , C07C257/00 , C07C265/00 , C09K3/00 , C08G18/00 , C08G18/10 , C08G18/16 , C08G18/70 , C09J175/04 , C08G18/48 , C09J175/08 , C08G18/76 , C08G18/79 , C08K3/00 , C08K3/26
CPC分类号： C08G18/0885 , C08G18/10 , C08G18/4808 , C08G18/4833 , C08G18/7664 , C08G18/797 , C08K3/013 , C08K3/26 , C09J175/04 , C09J175/08 , C08G18/48 , C08G18/6674
摘要： A urethane adhesive composition includes a first liquid and a second liquid, the first liquid containing a prepolymer obtained by reacting a polyisocyanate and a high-molecular-weight polyol (I), and at least one filler selected from talc and calcium carbonate, and containing 20 parts by mass or more of talc, 0 to 40 parts by mass of calcium carbonate, and 10 parts by mass or more of zeolite based on 100 parts by mass of the polyisocyanate, the high-molecular-weight polyol (I), and the prepolymer in total, the second liquid containing a high-molecular-weight polyol (II) and a low-molecular-weight polyol, the ratio of the number of moles of hydroxyl groups derived from the low-molecular-weight polyol to the total number of moles of hydroxyl groups derived from the high-molecular-weight polyol (I) and the high-molecular-weight polyol (II) being four or more.
摘要翻译：聚氨酯粘合剂组合物包括第一液体和第二液体，所述第一液体含有通过使多异氰酸酯和高分子量多元醇（I）反应获得的预聚物和至少一种选自滑石和碳酸钙的填料，并且含有 20质量份以上的滑石，0〜40质量份的碳酸钙，10质量份以上的沸石，相对于100质量份的多异氰酸酯，高分子量多元醇（I）和总共预聚物，含有高分子量多元醇（II）和低分子量多元醇的第二液体，由低分子量多元醇衍生的羟基的摩尔数与总共衍生自高分子量多元醇（I）和高分子量多元醇（II）的羟基的摩尔数为4以上。

3. 发明申请

US20100292384A1 URETHANE ADHESIVE COMPOSITION 有权
标题翻译： URETHANE粘合剂组合物
公开(公告)号：US20100292384A1
公开(公告)日：2010-11-18
申请号：US12681109
申请日：2008-09-10
申请人： Yoshinori Igarashi , Koichiro Higasa
发明人： Yoshinori Igarashi , Koichiro Higasa
IPC分类号： C08K3/34 , C08K3/26
CPC分类号： C08G18/0885 , C08G18/10 , C08G18/4808 , C08G18/4833 , C08G18/7664 , C08G18/797 , C08K3/013 , C08K3/26 , C09J175/04 , C09J175/08 , C08G18/48 , C08G18/6674
摘要： A urethane adhesive composition includes a first liquid and a second liquid, the first liquid containing a prepolymer obtained by reacting a polyisocyanate and a high-molecular-weight polyol (I), and at least one filler selected from talc and calcium carbonate, and containing 20 parts by mass or more of talc, 0 to 40 parts by mass of calcium carbonate, and 10 parts by mass or more of zeolite based on 100 parts by mass of the polyisocyanate, the high-molecular-weight polyol (I), and the prepolymer in total, the second liquid containing a high-molecular-weight polyol (II) and a low-molecular-weight polyol, the ratio of the number of moles of hydroxyl groups derived from the low-molecular-weight polyol to the total number of moles of hydroxyl groups derived from the high-molecular-weight polyol (I) and the high-molecular-weight polyol (II) being four or more.
摘要翻译：聚氨酯粘合剂组合物包括第一液体和第二液体，所述第一液体含有通过使多异氰酸酯和高分子量多元醇（I）反应获得的预聚物和至少一种选自滑石和碳酸钙的填料，并且含有 20质量份以上的滑石，0〜40质量份的碳酸钙，10质量份以上的沸石，相对于100质量份的多异氰酸酯，高分子量多元醇（I）和总共预聚物，含有高分子量多元醇（II）和低分子量多元醇的第二液体，由低分子量多元醇衍生的羟基的摩尔数与总共衍生自高分子量多元醇（I）和高分子量多元醇（II）的羟基的摩尔数为4以上。

4. 发明申请

US20080102268A1 Adhesive for Production of Ic Card, Process for Producing Ic Card, and Ic Card 有权
标题翻译：用于生产Ic卡的粘合剂，用于生产Ic卡和Ic卡的工艺
公开(公告)号：US20080102268A1
公开(公告)日：2008-05-01
申请号：US11883132
申请日：2006-01-26
申请人： Koichiro Higasa , Yoshinori Ito , Masahiko Oota , Yoshinori Igarashi
发明人： Koichiro Higasa , Yoshinori Ito , Masahiko Oota , Yoshinori Igarashi
IPC分类号： B32B27/40 , C08G18/00 , B32B5/00 , B32B38/04
CPC分类号： C09J175/04 , B05C5/0254 , B05C5/027 , B32B37/1284 , B32B37/153 , B32B2309/02 , B32B2425/00 , B42D25/47 , C08G18/12 , C08G18/4812 , G06K19/077 , G06K19/07718 , Y10T156/1052 , Y10T428/263 , Y10T428/264 , Y10T428/269 , Y10T428/31551 , C08G18/3206
摘要： A process for producing an IC card comprising: an application/bonding step of applying an adhesive having a curing rate ratio (80° C./40° C.) of 30 or more on the surface of an inlet film, on which a number of IC modules are mounted, and/or a skin film for covering at least one surface of the inlet film, and bonding the inlet film and the skin film together to form a laminate film; a curing step of curing the adhesive to form a cured resin layer between the inlet film and the skin film of the laminate film; and a card forming step of forming a number of IC cards by dividing the laminate film for each IC module.
摘要翻译：一种用于制造IC卡的方法，包括：施加/粘合步骤，其在入口膜的表面上施加具有30或更高固化速率比（80℃/ 40℃）的粘合剂，的IC模块，和/或用于覆盖入口膜的至少一个表面的皮肤膜，并将入口膜和皮肤膜结合在一起以形成层压膜; 固化步骤，使所述粘合剂固化以在所述层压膜的所述入口膜和所述皮膜之间形成固化树脂层; 以及卡形成步骤，通过分割每个IC模块的层叠膜形成多个IC卡。

5. 发明申请

US20130030085A1 ONE-PACK TYPE RESIN COMPOSITION FOR USE IN BACKING 审中-公开
标题翻译：一次性树脂组合物用于背衬
公开(公告)号：US20130030085A1
公开(公告)日：2013-01-31
申请号：US13640062
申请日：2010-04-14
申请人： Koichiro Higasa , Minoru Kato
发明人： Koichiro Higasa , Minoru Kato
IPC分类号： C08L63/10 , C08K3/22
CPC分类号： C08L33/068 , C08G18/6237 , C08G18/706 , C08G18/8077 , C08G59/3209 , C08L2201/02 , C08L2666/84
摘要： Provided is the one-pack type backing resin composition which exhibits excellent fall-off resistance, excellent storage stability, and high flame retardancy. A one-pack type backing resin composition includes 100 parts by mass of (A) a (meth)acrylic polymer, and 50 to 500 parts by mass of (B) a flame retardant, the (meth)acrylic polymer (A) being produced by emulsion polymerization of a monomer component, and having a solvent-insoluble content of 0 to 85 mass %, the monomer component including 0.5 to 25 mass % of (a) glycidyl methacrylate, 0.2 to 10 mass % of (b) an unsaturated carboxylic acid monomer, and 70 to 99.3 mass % of (c) an additional copolymerizable monomer (provided that (a)+(b)+(c)=100 mass %).
摘要翻译：提供具有优异的耐脱落性，优异的储存稳定性和高阻燃性的单组分型背衬树脂组合物。单组分型背衬树脂组合物包含（A）（甲基）丙烯酸类聚合物100质量份，（B）阻燃剂50〜500质量份，制造的（甲基）丙烯酸系聚合物（A）通过单体成分的乳液聚合，溶剂不溶成分为0〜85质量％，单体成分为（a）甲基丙烯酸缩水甘油酯0.5〜25质量％，（b）不饱和羧酸酸性单体，（c）另外的可共聚单体为70〜99.3质量％（条件是（a）+（b）+（c）= 100质量％）。

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