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1. 发明授权

US06693751B2 Member mounting structure and member mounting apparatus 有权
公开(公告)号：US06693751B2
公开(公告)日：2004-02-17
申请号：US10077937
申请日：2002-02-20
申请人： Yoshihiro Morii , Shigeru Fujita , Shigeo Kobayashi , Tatsuya Tsuyuki , Hiroshi Takemoto , Jun Ando
发明人： Yoshihiro Morii , Shigeru Fujita , Shigeo Kobayashi , Tatsuya Tsuyuki , Hiroshi Takemoto , Jun Ando
IPC分类号： G02B702
CPC分类号： G02B7/00
摘要： Disclosed is a member mounting structure and a member mounting apparatus for mounting a member such as a solid state image input unit in which mounting of the solid state image input unit can be achieved with high accuracy after positioning adjustment along five axes, yield of production can be increased, and at the same time, decrease of fixing force of the solid state image input unit after production (after adhesive material has been hardened) does not occur by means that positioning adjustment of the solid state image input unit along five axes is easily performed before adhering and fixing of the solid state image input unit. An intermediate holding member is disposed between a frame and the solid state image input unit so that a first adhered surface between the frame and the intermediate holding member, and a second adhered surface between the solid state image input unit and intermediate holding member are arranged parallely with pixel lines and at the same time, the first adhered surface and second adhered surface are arranged to make a right angle.

2. 发明授权

US06740949B2 Supporting structure for a solid state image sensing device 有权
标题翻译：支持固态摄像装置的结构
公开(公告)号：US06740949B2
公开(公告)日：2004-05-25
申请号：US10231282
申请日：2002-08-30
申请人： Jun Andoh , Tatsuya Tsuyuki
发明人： Jun Andoh , Tatsuya Tsuyuki
IPC分类号： H01L310232
CPC分类号： H01L31/0203 , H01L2224/48247 , H01L2224/48465 , H01L2924/16195 , H01L2224/48091 , H01L2924/00014 , H01L2924/00
摘要： Disclosed is a solid state image sensing device. The solid state image sensing device comprises a semiconductor chip for image sensing which has at least one of photoelectric conversion element line; and a package into which the semiconductor chip is received. The package is composed of an insulating package body which has the semiconductor chip mounted on a flat inner bottom surface of a concave portion; a transparent cover glass to be fixed on an upper surface of an outer frame of the concave portion for sealing the concave portion; and a lead frame which is brought out to the outside of the package body. The solid state image sensing device has a reference plane for attaching onto an image input apparatus is arranged on the package. The reference plane for attaching is made parallel to the inner bottom surface of the concave portion on which the semiconductor chip is mounted.
摘要翻译：公开了一种固态图像感测装置。该固态图像感测装置包括：具有光电转换元件线中至少一个的用于图像感测的半导体芯片; 以及接收半导体芯片的封装。封装由绝缘封装体组成，绝缘封装体具有安装在凹部的平坦的内底面上的半导体芯片; 固定在所述凹部的外框的上表面的透明盖玻璃，用于密封所述凹部; 以及引出框架，其被引出到包装体的外部。固态图像感测装置具有用于附着到图像输入装置上的参考平面布置在包装上。用于安装的参考平面与安装有半导体芯片的凹部的内底表面平行。

3. 发明授权

US07170653B2 Fixing structure for solid state image forming device, image data input unit and image data input apparatus including the same 有权
标题翻译：固态成像装置，图像数据输入单元和包括其的图像数据输入装置的固定结构
公开(公告)号：US07170653B2
公开(公告)日：2007-01-30
申请号：US09888599
申请日：2001-06-26
申请人： Tatsuya Tsuyuki
发明人： Tatsuya Tsuyuki
IPC分类号： H04N1/04
CPC分类号： H04N1/03 , H04N2201/02414 , H04N2201/02429 , H04N2201/02443 , H04N2201/02449 , H04N2201/02458 , H04N2201/0247 , H04N2201/02481 , H04N2201/04798
摘要： The present invention is made to provide a fixing structure for solid state image forming device made inexpensively and easily by simple caulking adhering method with keeping high positional accuracy, by which it is achieved that the solid state image forming device can be separated easily from the image focusing lens holding member when the image focusing lens holding member has a defect. In the fixing structure of present invention, an image focusing lens holding member 3 and an intermediate holding member 6 are adhered by caulking adhering method. Because one or more projecting portion 3c for painting adhesive material formed on the image focusing lens holding member 3, have smaller area than that of bottom surface 6a of the intermediate holding member 6, a space 10 is formed between the image focusing lens holding member 3 and the intermediate holding member 6, the solid state image forming device 1 fixed on the intermediate holding member 6 can be easily separated from the image focusing lens holding member 3 by inserting and turning a tool 11 whose width of top portion is smaller than the width of space 10.
摘要翻译：本发明提供一种通过简单的铆接粘合方法廉价且容易地制造的固态成像装置的固定结构，并且保持高位置精度，通过该固定结构可以使固体图像形成装置容易地从图像中分离当图像聚焦透镜保持构件具有缺陷时，聚焦透镜保持构件。在本发明的固定结构中，通过铆接粘合方法粘合图像聚焦透镜保持部件3和中间保持部件6。由于形成在图像聚焦透镜保持部件3上的涂布粘合剂材料的一个或多个突出部分3c具有比中间保持部件6的底面面积小的面积，所以在图像聚焦透镜保持部件构件3和中间保持构件6，固定在中间保持构件6上的固态图像形成装置1能够容易地从图像聚焦透镜保持构件3与顶部的宽度小于空间宽度10。

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