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1. 发明授权

US6144280A Wire wound electronic component and method of manufacturing the same 失效
标题翻译：绕线电子元件及其制造方法
公开(公告)号：US6144280A
公开(公告)日：2000-11-07
申请号：US967786
申请日：1997-11-10
申请人： Yoshihiro Amada , Hideo Aoba , Kazuhiko Otsuka , Nobuhiro Umeyama , Katsuo Koizumi , Nobuo Mamada , Iwao Fujikawa , Nobuyasu Shiba , Takayuki Uehara
发明人： Yoshihiro Amada , Hideo Aoba , Kazuhiko Otsuka , Nobuhiro Umeyama , Katsuo Koizumi , Nobuo Mamada , Iwao Fujikawa , Nobuyasu Shiba , Takayuki Uehara
IPC分类号： H01F17/04 , H01F27/29 , H01F41/10 , H01F41/12
CPC分类号： H01F41/127 , H01F17/045 , H01F27/292 , H01F41/10 , Y10T29/4902 , Y10T29/49071 , Y10T29/49076
摘要： A wire wound electronic component of the present invention includes a bobbin having a core 1a having a substantially circular cross-section and rectangular flanges 1b formed at both ends of the core. A groove 2 is formed in each side of each flange 1b. A conductive film or external electrode 3 is formed on each flange 1b. A coil or wire 4 is wound round the core 1a and has a conductor protruding from opposite stripped ends thereof. The opposite ends 5 of the conductor are respectively received in the grooves 2 of the flanges 1b and connected to the conductive films 3. A coating or armor 6 is formed on the coil 4 and has a flat surface 6a. The coating 6 has a rectangular figuration complementary to the configuration of the flanges 1b.
摘要翻译：本发明的绕线电子元件包括具有大致圆形横截面的芯1a和形成在芯的两端的矩形凸缘1b的线轴。在每个凸缘1b的每一侧形成有槽2。在每个凸缘1b上形成导电膜或外部电极3。线圈或线4绕芯体1a缠绕，并且具有从相对的剥离端突出的导体。导体的相对端5分别容纳在凸缘1b的槽2中并连接到导电膜3.在线圈4上形成涂层或装甲6，并具有平坦表面6a。涂层6具有与凸缘1b的构造互补的矩形形状。

2. 发明授权

US06727792B2 Method of manufacturing wire wound electronic component 失效
标题翻译：绕线电子元件的制造方法
公开(公告)号：US06727792B2
公开(公告)日：2004-04-27
申请号：US10229074
申请日：2002-08-28
申请人： Yoshihiro Amada , Hideo Aoba , Kazuhiko Otsuka , Nobuhiro Umeyama , Katsuo Koizumi , Nobuo Mamada , Iwao Fujikawa , Nobuyasu Shiba , Takayuki Uehara
发明人： Yoshihiro Amada , Hideo Aoba , Kazuhiko Otsuka , Nobuhiro Umeyama , Katsuo Koizumi , Nobuo Mamada , Iwao Fujikawa , Nobuyasu Shiba , Takayuki Uehara
IPC分类号： H01F2729
CPC分类号： H01F41/127 , H01F17/045 , H01F27/292 , H01F41/10 , Y10T29/4902 , Y10T29/49071 , Y10T29/49076
摘要： A wire wound electronic component of the present invention includes a bobbin having a core 1a having a substantially circular cross-section and rectangular flanges 1b formed at both ends of the core. A groove 2 is formed in each side of each flange 1b. A conductive film or external electrode 3 is formed on each flange 1b. A coil or wire 4 is wound round the core 1a and has a conductor protruding from opposite stripped ends thereof. The opposite ends 5 of the conductor are respectively received in the grooves 2 of the flanges 1b and connected to the conductive films 3. A coating or armor 6 is formed on the coil 4 and has a flat surface 6a. The coating 6 has a rectangular configuration complementary to the configuration of the flanges 1b.
摘要翻译：本发明的绕线电子元件包括具有大致圆形横截面的芯1a和形成在芯的两端的矩形凸缘1b的线轴。在每个凸缘1b的每一侧形成有槽2。在每个凸缘1b上形成导电膜或外部电极3。线圈或线4绕芯体1a缠绕，并且具有从相对的剥离端突出的导体。导体的相对端5分别容纳在凸缘1b的槽2中并连接到导电膜3.在线圈4上形成涂层或装甲6，并具有平坦表面6a。涂层6具有与凸缘1b的构造互补的矩形构造。

3. 发明授权

US06449830B1 Method of manufacturing wire wound electronic component 失效
标题翻译：绕线电子元件的制造方法
公开(公告)号：US06449830B1
公开(公告)日：2002-09-17
申请号：US09664720
申请日：2000-09-19
申请人： Yoshihiro Amada , Hideo Aoba , Kazuhiko Otsuka , Nobuhiro Umeyama , Katsuo Koizumi , Nobuo Mamada , Iwao Fujikawa , Nobuyasu Shiba , Takayuki Uehara
发明人： Yoshihiro Amada , Hideo Aoba , Kazuhiko Otsuka , Nobuhiro Umeyama , Katsuo Koizumi , Nobuo Mamada , Iwao Fujikawa , Nobuyasu Shiba , Takayuki Uehara
IPC分类号： H01F706
CPC分类号： H01F41/127 , H01F17/045 , H01F27/292 , H01F41/10 , Y10T29/4902 , Y10T29/49071 , Y10T29/49076
摘要： A wire wound electronic component includes a bobbin having a core 1a having a substantially circular cross-section and rectangular flanges 1b formed at both ends of the core. A groove 2 is formed in each side of each flange 1b. A conductive film or external electrode 3 is formed on each flange 1b. A coil or wire 4 is wound round the core 1a and has a conductor protruding from opposite stripped ends thereof. The opposite ends 5 of the conductor are respectively received in the grooves 2 of the flanges 1b and connected to the conductive films 3. A coating or armor 6 is formed on the coil 4 and has a flat surface 6a. The coating 6 has a rectangular configuration complementary to the configuration of the flanges 1b.
摘要翻译：绕线电子部件包括具有大致圆形截面的芯1a和形成在芯的两端的矩形凸缘1b的线轴。在每个凸缘1b的每一侧形成有槽2。在每个凸缘1b上形成导电膜或外部电极3。线圈或线4绕芯体1a缠绕，并且具有从相对的剥离端突出的导体。导体的相对端5分别容纳在凸缘1b的槽2中并连接到导电膜3.在线圈4上形成涂层或装甲6，并具有平坦表面6a。涂层6具有与凸缘1b的构造互补的矩形构造。

4. 发明授权

US06362713B1 Chip inductor, chip inductor array and method of manufacturing same 失效
标题翻译：芯片电感，芯片电感阵列及其制造方法
公开(公告)号：US06362713B1
公开(公告)日：2002-03-26
申请号：US08916257
申请日：1997-08-22
申请人： Hiroyuki Masuda , Kinya Iri , Kenichiro Nogi , Nobuo Mamada
发明人： Hiroyuki Masuda , Kinya Iri , Kenichiro Nogi , Nobuo Mamada
IPC分类号： H01F2702
CPC分类号： H01F17/045 , H01F41/046 , H01F41/064
摘要： A chip inductor is made up of a coiled conducting wire and a magnetic member which is formed by sintering and in which the coiled conducting wire is embedded. Both end portions of the coiled conducting wire are exposed to both end surfaces of the magnetic member. External electrodes are formed with conducting thin films and are connected to respective end portions of the coiled conducting wire. An inorganic material is interposed in a clearance between winds of both end portions of the conducting wire and external surfaces of the magnetic member and a clearance between adjoining winds of the conducting wire.
摘要翻译：片状电感器由线圈导线和通过烧结形成的磁性构件组成，其中嵌有线圈导线。线圈导线的两端部暴露于磁性部件的两端面。外部电极形成有导电薄膜并连接到线圈导线的相应端部。导电线的两端部的风与磁性体的外表面之间的间隙和导线的相邻风之间的间隙插入无机材料。

5. 发明授权

US06304425B1 Circuit board having thereon coupled ceramic capacitors and method for the manufacture thereof 有权
标题翻译：具有耦合陶瓷电容器的电路板及其制造方法
公开(公告)号：US06304425B1
公开(公告)日：2001-10-16
申请号：US09441960
申请日：1999-11-17
申请人： Nobuo Mamada
发明人： Nobuo Mamada
IPC分类号： H01G406
CPC分类号： H05K1/181 , H05K1/0237 , H05K2201/10545 , H05K2201/10636 , H05K2201/2045 , Y02P70/611 , Y10T29/4913
摘要： A circuit board having coupled multilayered ceramic capacitors mounted thereon considerably reduces the generation of sounds developed by piezoelectric effects in the capacitors. A method for mounting the capacitors on the circuit board includes the step of forming lands for mounting the capacitors thereon at substantially plane-symmetrical positions on the front surface and the back surface of the circuit board, two lands at their substantially plane-symmetrical positions being connected each other. The capacitors, which are substantially identical each other, are then mounted on the lands of the front and the back surfaces such that the capacitors are disposed at substantially plane-symmetrical positions and electrically coupled to the lands. As a result, vibrations being transferred from the capacitors to the circuit board are cancelled out with each other and the resonance of the circuit board due to the vibrations from the capacitors is prevented, resulting in the generation of audible sounds with high sound pressure levels being considerably reduced compared to that of the prior art.
摘要翻译：具有安装在其上的耦合多层陶瓷电容器的电路板显着地减少了由电容器中的压电效应产生的声音。用于将电容器安装在电路板上的方法包括以下步骤：在电路板的前表面和背面上的基本上平面对称的位置处形成用于将电容器安装在其上的平台，其基本平面对称位置处的两个平台相互连接然后将彼此基本相同的电容器安装在前表面和后表面的焊盘上，使得电容器被布置在基本上平面对称的位置并电耦合到焊盘。结果，从电容器传递到电路板的振动彼此抵消，并且防止了由于电容器的振动引起的电路板的谐振，导致产生具有高声压级的可听见的声音与现有技术相比显着降低。

6. 发明授权

US06860954B2 Circuit board having thereon coupled ceramic capacitors and method for the manufacture thereof 有权
标题翻译：具有耦合陶瓷电容器的电路板及其制造方法
公开(公告)号：US06860954B2
公开(公告)日：2005-03-01
申请号：US09934495
申请日：2001-08-22
申请人： Nobuo Mamada
发明人： Nobuo Mamada
IPC分类号： H01G4/12 , H01G2/06 , H05K1/02 , H05K1/18 , C03B29/00
CPC分类号： H05K1/181 , H05K1/0237 , H05K2201/10545 , H05K2201/10636 , H05K2201/2045 , Y02P70/611 , Y10T29/4913
摘要： A circuit board having coupled multilayered ceramic capacitors mounted thereon considerably reduces the generation of sounds developed by piezoelectric effects in the capacitors. A method for mounting the capacitors on the circuit board includes the step of forming lands for mounting the capacitors thereon at substantially plane-symmetrical positions on the front surface and the back surface of the circuit board, two lands at their substantially plane-symmetrical positions being connected each other. The capacitors, which are substantially identical each other, are then mounted on the lands of the front and the back surfaces such that the capacitors are disposed at substantially plane-symmetrical positions and electrically coupled to the lands. As a result, vibrations being transferred from the capacitors to the circuit board are cancelled out with each other and the resonance of the circuit board due to the vibrations from the capacitors is prevented, resulting in the generation of audible sounds with high sound pressure levels being considerably reduced compared to that of the prior art.
摘要翻译：具有安装在其上的耦合多层陶瓷电容器的电路板显着地减少了由电容器中的压电效应产生的声音。用于将电容器安装在电路板上的方法包括以下步骤：在电路板的前表面和背面上的基本上平面对称的位置处形成用于将电容器安装在其上的平台，其基本平面对称位置处的两个平台相互连接然后将彼此基本相同的电容器安装在前表面和后表面的焊盘上，使得电容器被布置在基本上平面对称的位置并电耦合到焊盘。结果，从电容器传递到电路板的振动彼此抵消，并且防止了由于电容器的振动引起的电路板的谐振，导致产生具有高声压级的可听见的声音与现有技术相比显着降低。

7. 发明授权

US06189202B1 Method of manufacturing chip inductors and chip inductor arrays 失效
标题翻译：芯片电感和芯片电感阵列的制造方法
公开(公告)号：US06189202B1
公开(公告)日：2001-02-20
申请号：US09207678
申请日：1998-12-09
申请人： Hiroyuki Masuda , Kinya Iri , Kenichiro Nogi , Nobuo Mamada
发明人： Hiroyuki Masuda , Kinya Iri , Kenichiro Nogi , Nobuo Mamada
IPC分类号： H01F4106
CPC分类号： H01F17/045 , H01F41/046 , H01F41/064 , Y10T29/49071 , Y10T29/49076
摘要： A chip inductor is made up of a coiled conducting wire and a magnetic member which is formed by sintering and in which the coiled conducting wire is embedded. Both end portions of the coiled conducting wire are exposed to both end surfaces of the magnetic member. External electrodes are formed with conducting thin films and are connected to respective end portions of the coiled conducting wire. An inorganic material is interposed in a clearance between winds of both end portions of the conducting wire and external surfaces of the magnetic member and a clearance between adjoining winds of the conducting wire.
摘要翻译：片状电感器由线圈导线和通过烧结形成的磁性构件组成，其中嵌有线圈导线。线圈导线的两端部暴露于磁性部件的两端面。外部电极形成有导电薄膜并连接到线圈导线的相应端部。导电线的两端部的风与磁性体的外表面之间的间隙和导线的相邻风之间的间隙插入无机材料。

8. 发明授权

US06791444B1 Chip inductor, chip inductor array and method of manufacturing same 失效
标题翻译：芯片电感，芯片电感阵列及其制造方法
公开(公告)号：US06791444B1
公开(公告)日：2004-09-14
申请号：US09635098
申请日：2000-08-09
申请人： Hiroyuki Masuda , Kinya Iri , Kenichiro Nogi , Nobuo Mamada
发明人： Hiroyuki Masuda , Kinya Iri , Kenichiro Nogi , Nobuo Mamada
IPC分类号： H01F2702
CPC分类号： H01F41/046 , H01F17/045 , H01F41/064
摘要： A chip inductor is made up of a coiled conducting wire and a magnetic member which is formed by sintering and in which the coiled conducting wire is embedded. Both end portions of the coiled conducting wire are exposed to both end surfaces of the magnetic member. External electrodes are formed with conducting thin films and are connected to respective end portions of the coiled conducting wire. An inorganic material is interposed in a clearance between winds of both end portions of the conducting wire and external surfaces of the magnetic member and a clearance between adjoining winds of the conducting wire.
摘要翻译：片状电感器由线圈导线和通过烧结形成的磁性构件组成，其中嵌有线圈导线。线圈导线的两端部暴露于磁性部件的两端面。外部电极形成有导电薄膜并连接到线圈导线的相应端部。导电线的两端部的风与磁性体的外表面之间的间隙和导线的相邻风之间的间隙插入无机材料。

9. 发明授权

US06343413B1 Method of manufacturing a chip inductor 失效
标题翻译：制造芯片电感的方法
公开(公告)号：US06343413B1
公开(公告)日：2002-02-05
申请号：US09650755
申请日：2000-08-30
申请人： Hiroyuki Masuda , Kinya Iri , Kenichiro Nogi , Nobuo Mamada
发明人： Hiroyuki Masuda , Kinya Iri , Kenichiro Nogi , Nobuo Mamada
IPC分类号： H01F4106
CPC分类号： H01F17/045 , H01F41/046 , H01F41/064 , Y10T29/49071 , Y10T29/49076
摘要： A chip inductor is made up of a coiled conducting wire and a magnetic member which is formed by sintering and in which the coiled conducting wire is embedded. Both end portions of the coiled conducting wire are exposed to both end surfaces of the magnetic member. External electrodes are formed with conducting thin films and are connected to respective end portions of the coiled conducting wire. An inorganic material is interposed in a clearance between winds of both end portions of the conducting wire and external surfaces of the magnetic member and a clearance between adjoining winds of the conducting wire.
摘要翻译：片状电感器由线圈导线和通过烧结形成的磁性构件组成，其中嵌有线圈导线。线圈导线的两端部暴露于磁性部件的两端面。外部电极形成有导电薄膜并连接到线圈导线的相应端部。导电线的两端部的风与磁性体的外表面之间的间隙和导线的相邻风之间的间隙插入无机材料。

10. 发明授权

US6055721A Method of manufacturing a chip inductor 失效
标题翻译：制造芯片电感的方法
公开(公告)号：US6055721A
公开(公告)日：2000-05-02
申请号：US231486
申请日：1999-01-14
申请人： Nobuo Mamada , Masataka Kohara
发明人： Nobuo Mamada , Masataka Kohara
IPC分类号： H01F17/04 , H01F27/02 , H01F27/29 , H01F41/00 , H01F41/02 , H01F41/04 , H01F7/06
CPC分类号： H01F17/045 , H01F27/292 , H01F41/0246 , H01F41/046 , H01F27/027 , H01F41/005 , Y10T29/49071 , Y10T29/49076
摘要： A chip inductor has a magnetic member which is formed by sintering and a coiled conducting wire which is embedded in the magnetic member. The magnetic member has a clearance in each axial end portion thereof such that each terminal end portion of the coiled conducting wire is exposed to an outside of the magnetic member in a linear configuration. An external electrode is formed on each end portion of the magnetic member such that the external electrode penetrates into the clearance into contact with the terminal end portions of the coiled conducting wire.
摘要翻译：芯片电感器具有通过烧结形成的磁性部件和嵌入在磁性部件中的线圈导线。磁性构件在其每个轴向端部具有间隙，使得线圈导线的每个末端部分以线性构型暴露于磁性构件的外部。外部电极形成在磁性部件的每个端部上，使得外部电极穿过间隙而与线圈导线的端部接触。

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