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1. 发明授权

US08828178B2 Sealing device 有权
标题翻译：密封装置
公开(公告)号：US08828178B2
公开(公告)日：2014-09-09
申请号：US13417530
申请日：2012-03-12
申请人： Hironori Yamamoto , Koki Ishida , Tatsuo Katayama , Tadashi Kasamoto , Yoshihiko Yamaguchi , Chihiro Asanuma
发明人： Hironori Yamamoto , Koki Ishida , Tatsuo Katayama , Tadashi Kasamoto , Yoshihiko Yamaguchi , Chihiro Asanuma
IPC分类号： B29C65/00 , B32B37/00 , B32B38/00 , B31B1/60 , F16C32/00 , F16C41/04 , F16C33/76 , F01B25/00 , F03B15/00 , F04D15/00 , F04D27/00 , F16J15/34 , F16J15/32 , H03M1/22 , G01P3/48 , G01P3/54 , F16C41/00 , F16C33/78 , F16C19/18
CPC分类号： F16C41/007 , F16C19/186 , F16C33/7883 , F16C2326/02 , Y10T156/10
摘要： A sealing device which comprises a slinger fixedly fitted to the rotary side member, a core member fixedly fitted to the stationary side member, and an elastic sealing member fixed to the core member and having a seal lip which elastically and slidably contacts the slinger. The slinger comprises a fitting cylindrical portion to be fitted into the rotary side member, a brim portion extending its radial direction at one end of its outside relative to a sealed portion of the fitting cylindrical portion, and a rotary side fixing member fixed to the brim portion. Further, the slinger is made in such a manner that an adhesive layer is formed on its whole surface including a contacting side surface where the seal lip contacts by applying adhesive agent thereon, then the fixing member is integrally fixed thereto, thereafter the adhesive layer is partially removed only in the contacting side surface.
摘要翻译：一种密封装置，其特征在于，包括固定在所述旋转侧部件上的挡泥板，固定在所述固定侧部件上的芯部件，以及弹性密封部件，该弹性密封部件固定于所述芯部部件，并且具有与所述抛油环弹性且可滑动接触的密封唇部。抛油环包括装配到旋转侧构件中的装配圆柱形部分，在其外侧的一端处相对于配合圆柱形部分的密封部分沿其径向方向延伸的边缘部分，以及固定到边缘的旋转侧固定构件一部分。此外，抛油环的制造方式是在其整个表面上形成粘合剂层，该整个表面包括通过在其上施加粘合剂而使密封唇接触的接触侧面，然后将固定部件一体地固定在其上，然后粘合剂层为仅在接触侧表面部分除去。

2. 发明授权

US07579216B2 Method of manufacturing a semiconductor device 有权
标题翻译：制造半导体器件的方法
公开(公告)号：US07579216B2
公开(公告)日：2009-08-25
申请号：US12118752
申请日：2008-05-12
申请人： Tadashi Munakata , Shingo Oosaka , Mitsuru Kinoshita , Yoshihiko Yamaguchi , Noriyuki Takahashi
发明人： Tadashi Munakata , Shingo Oosaka , Mitsuru Kinoshita , Yoshihiko Yamaguchi , Noriyuki Takahashi
IPC分类号： H01L21/58
CPC分类号： H01L21/78 , H01L21/02076 , H01L21/561 , H01L21/565 , H01L21/67092 , H01L21/67126 , H01L21/67333 , H01L21/6838 , H01L23/3128 , H01L24/73 , H01L24/97 , H01L2224/32225 , H01L2224/45144 , H01L2224/48091 , H01L2224/48225 , H01L2224/48227 , H01L2224/48465 , H01L2224/73265 , H01L2224/97 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01009 , H01L2924/01033 , H01L2924/01039 , H01L2924/01057 , H01L2924/01075 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/14 , H01L2924/15183 , H01L2924/15311 , H01L2924/181 , H01L2924/3025 , H01L2224/85 , H01L2924/00014 , H01L2224/83 , H01L2924/00012 , H01L2924/00
摘要： A semiconductor device manufacturing method comprising the steps of providing a matrix substrate having a main surface with plural device areas formed thereon, fixing plural semiconductor chips to the plural device areas respectively, then sealing the plural semiconductor chips all together with resin to form a block sealing member, dividing the block sealing member and the matrix substrate for each of the device areas by dicing, thereafter rubbing a surface of each of the diced sealing member portions with a brush, then storing semiconductor devices formed by the dicing once into pockets respectively of a tray, and conveying the semiconductor devices each individually from the tray. Since the substrate dividing work after block molding is performed by dicing while vacuum-chucking the surface of the block sealing member, the substrate division can be done without imposing any stress on an external terminal mounting surface of the matrix substrate.
摘要翻译：一种半导体器件制造方法，包括以下步骤：提供具有形成在其上的多个器件区域的主表面的矩阵衬底，将多个半导体芯片分别固定到多个器件区域，然后将多个半导体芯片与树脂一起密封以形成块密封通过切割将每个设备区域的块状密封构件和矩阵基板分开，然后用刷子擦拭每个切割的密封构件部分的表面，然后将通过切割形成的半导体器件分别存储到一个托盘，并且分别从托盘传送半导体器件。由于在模块密封部件的表面进行真空夹紧的同时通过切割进行块模塑后的基板分割作业，所以可以在不对矩阵基板的外部端子安装面施加任何应力的情况下进行基板分割。

3. 发明申请

US20090095937A1 Magnetic rubber composition for encoder 审中-公开
公开(公告)号：US20090095937A1
公开(公告)日：2009-04-16
申请号：US12314013
申请日：2008-12-02
申请人： Yoshihiko Yamaguchi
发明人： Yoshihiko Yamaguchi
IPC分类号： H01F1/10
CPC分类号： H01F1/117 , C08K3/22 , C08K5/548 , C08K2201/01 , G01D5/244 , C08L15/005
摘要： A magnetic rubber composition for encoder having a magnetic characteristic in sufficient application range, used as encoder after magnetization as well as heat resistance, water resistance and oil resistance required for use as encoder, and excellent processing property, and capable of being bonded by vulcanization with a metal, is provided. Furthermore, a magnetic rubber composition for encoder capable of obtaining sufficient magnetic force required for encoder on a circumference of the molded encoder as well as capable of effectively restraining variation of the level of magnetic force, is provided. It is provided by comprising 300 to 1,800 parts of strontium-ferrite, or 300 to 1,800 parts of barium-ferrite, or 300 to 1,800 parts of a mixture of strontium-ferrite and barium-ferrite, 0.5 to 2 parts of silane coupling agent, and 1 to 10 parts of lubricating agent, per 100 parts of a hydrogenated nitrile butadiene rubber with 15 to 50% of acrylonitrile amount and 80 to 99% of hydrogenation ratio.

4. 发明授权

US06897097B2 Semiconductor device and a method of manufacturing the same 失效
标题翻译：半导体装置及其制造方法
公开(公告)号：US06897097B2
公开(公告)日：2005-05-24
申请号：US10669564
申请日：2003-09-25
申请人： Takao Matsuura , Yoshihiko Yamaguchi , Shouichi Kobayashi , Kouji Tsuchiya
发明人： Takao Matsuura , Yoshihiko Yamaguchi , Shouichi Kobayashi , Kouji Tsuchiya
IPC分类号： H01L23/12 , H01L21/301 , H01L21/48 , H01L21/56 , H01L23/31 , H01L23/48 , H01L23/50 , H01I21/44 , H01L21/50 , H01I21/48
CPC分类号： H01L23/3107 , H01L21/4835 , H01L21/4842 , H01L21/565 , H01L2224/32014 , H01L2224/32245 , H01L2224/45144 , H01L2224/48091 , H01L2224/48247 , H01L2224/73265 , H01L2924/01019 , H01L2924/01046 , H01L2924/01057 , H01L2924/01078 , H01L2924/01079 , H01L2924/1433 , H01L2924/181 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： The semiconductor device comprises: a tub for supporting a semiconductor chip; a sealing body formed by sealing the semiconductor chip with a resin; a plurality of leads made of a copper alloy, exposed to the back face of the sealing body, and having a soldered layer on the exposed mounted face; and wires for connecting the pads of the semiconductor chip and the corresponding leads. In the manufacture method, the sealing body is polished, after resin-molded, at its back face with a brush to form the two widthwise edge portions, as exposed from the back face of the sealing body, of the lead into rounded faces, and the mounted face of the lead including the rounded faces is protruded at its central portion from the back face of the sealing body thereby to improve the connection reliability at the packaging time.
摘要翻译：半导体器件包括：用于支撑半导体芯片的桶; 通过用树脂密封半导体芯片形成的密封体; 多个由铜合金制成的引线，暴露于密封体的背面，并且在暴露的安装面上具有焊接层; 以及用于连接半导体芯片的焊盘和相应引线的导线。在制造方法中，密封体在树脂成形后用刷子在其背面进行抛光，以形成从密封体的背面露出的两个宽度方向的边缘部分，使其成为圆形面，以及包括圆形面的引线的安装面在其中心部分处从密封体的背面突出，从而提高了封装时的连接可靠性。

5. 发明授权

US06602571B2 Method for manufacturing magnetic encoders and magnetic encoders manufactured by using such method 失效
标题翻译：使用这种方法制造磁编码器和磁编码器的方法
公开(公告)号：US06602571B2
公开(公告)日：2003-08-05
申请号：US09983400
申请日：2001-10-24
申请人： Yoshihiko Yamaguchi
发明人： Yoshihiko Yamaguchi
IPC分类号： B32B2502
CPC分类号： G01D5/244 , H01F1/117 , Y10T29/49021 , Y10T29/49032 , Y10T29/49034 , Y10T29/49036 , Y10T428/11 , Y10T428/218 , Y10T428/24273 , Y10T428/24322
摘要： An unvulcanized raw rubber is provided, to which magnetic ferrite powder is added. A resulting mixture composed of the unvulcanized raw rubber and magnetic ferrite powder is passed through a rolling machine or an extruding machine such that the mixture is formed into a sheet blank that contains the magnetic ferrite powder aligned regularly in a particular orientation. Alternatively, the resulting mixture may be first passed through an extruding machine and then through a rolling machine. The sheet blank is then stamped across a planar direction such that a ring-like sheet is formed. The ring-like sheet, along with a supplemental ring, is placed inside a metal mold, where the ring-like sheet and supplemental ring are compressed in an axial direction, while applying heat thereto, so that the ring-like sheet is vulcanized and joined to the supplemental ring. Finally, the vulcanized ring-like sheet is magnetized so that S poles and N poles appear alternately around its circumference.
摘要翻译：提供未硫化的生橡胶，加入磁性铁氧体粉末。将由未硫化的生橡胶和磁性铁氧体粉末组成的混合物通过轧制机或挤出机，使得混合物形成为含有以特定取向定期排列的磁性铁氧体粉末的片状坯料。或者，可以首先将所得混合物通过挤出机，然后通过轧制机。然后将片材坯料冲压在平面方向上，使得形成环状片材。环状片材与辅助环一起放置在金属模具内，其中环状片材和补充环沿轴向压缩，同时向其施加热量，使得环状片材硫化，并且加入了补充戒指。最后，硫化环状片材被磁化，使得S极和N极在其周围交替出现。

6. 发明授权

US06590276B2 Semiconductor device and a method of manufacturing the same 有权
标题翻译：半导体装置及其制造方法
公开(公告)号：US06590276B2
公开(公告)日：2003-07-08
申请号：US10108483
申请日：2002-03-29
申请人： Takao Matsuura , Yoshihiko Yamaguchi , Shouichi Kobayashi , Kouji Tsuchiya
发明人： Takao Matsuura , Yoshihiko Yamaguchi , Shouichi Kobayashi , Kouji Tsuchiya
IPC分类号： H01L23495
CPC分类号： H01L23/3107 , H01L21/4835 , H01L21/4842 , H01L21/565 , H01L2224/32014 , H01L2224/32245 , H01L2224/45144 , H01L2224/48091 , H01L2224/48247 , H01L2224/73265 , H01L2924/01019 , H01L2924/01046 , H01L2924/01057 , H01L2924/01078 , H01L2924/01079 , H01L2924/1433 , H01L2924/181 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： The semiconductor device comprises: a tub for supporting a semiconductor chip; a sealing body formed by sealing the semiconductor chip with a resin; a plurality of leads made of a copper alloy, exposed to the back face of the sealing body, and having a soldered layer on the exposed mounted face; and wires for connecting the pads of the semiconductor chip and the corresponding leads. In the manufacture method, the sealing body is polished, after resin-molded, at its back face with a brush to form the two widthwise edge portions, as exposed from the back face of the sealing body, of the lead into rounded faces, and the mounted face of the lead including the rounded faces is protruded at its central portion from the back face of the sealing body thereby to improve the connection reliability at the packaging time.
摘要翻译：半导体器件包括：用于支撑半导体芯片的桶; 通过用树脂密封半导体芯片形成的密封体; 多个由铜合金制成的引线，暴露于密封体的背面，并且在暴露的安装面上具有焊接层; 以及用于连接半导体芯片的焊盘和相应引线的导线。在制造方法中，密封体在树脂成形后用刷子在其背面进行抛光，以形成从密封体的背面露出的两个宽度方向的边缘部分，使其成为圆形面，以及包括圆形面的引线的安装面在其中心部分处从密封体的背面突出，从而提高了封装时的连接可靠性。

7. 发明授权

US08049645B2 Cylindrical cover-attached encoder apparatus 失效
标题翻译：圆柱盖附编码器装置
公开(公告)号：US08049645B2
公开(公告)日：2011-11-01
申请号：US12885880
申请日：2010-09-20
申请人： Ai Shiotsuka , Yoshihiko Yamaguchi
发明人： Ai Shiotsuka , Yoshihiko Yamaguchi
IPC分类号： H03M1/22
CPC分类号： G01D5/00 , F16C41/007 , G01D5/14 , G01D5/145 , G01P3/443 , G01P3/487
摘要： A cylindrical cover-attached encoder apparatus, including a magnetic metal-based body having a cylindrical shape, a magnetic rubber-based encoder having a cylindrical shape and formed around the outer peripheral surface of said magnetic metal-based cylindrical body, and a nonmagnetic material-based cover having a cylindrical shape and adapted to be mounted on said magnetic rubber-based encoder for covering the outer peripheral surface of the cylindrical portion of said magnetic rubber-based encoder.
摘要翻译：一种圆柱形盖式编码器装置，包括具有圆柱形状的磁性金属基体，形成在所述磁性金属基圆柱体的外周表面周围的具有圆柱形形状的磁性橡胶基编码器，以及非磁性材料的盖，其具有圆筒形状并且适于安装在所述基于磁性橡胶的编码器上，用于覆盖所述基于磁性橡胶的编码器的圆柱形部分的外周表面。

8. 发明申请

US20110068781A1 RUBBER COMPOSITION FOR MAGNETIC ENCODER AND MAGNETIC ENCODER USING THE SAME 审中-公开
标题翻译：使用磁体编码器和磁编码器的橡胶组合物
公开(公告)号：US20110068781A1
公开(公告)日：2011-03-24
申请号：US12954746
申请日：2010-11-26
申请人： Yoshihiko Yamaguchi
发明人： Yoshihiko Yamaguchi
IPC分类号： G01B7/30 , H01F1/01
CPC分类号： H01F1/0578 , C08K3/20 , C08K2201/01 , F16C41/007 , G01D5/244 , H01F1/059 , C08L15/02 , C08L27/12
摘要： The invention provides a rubber composition for a magnetic encoder being excellent in durability such as heat resistance, oil resistance and chemical resistance, having high magnetic characteristics and being excellent in processability and a magnetic encoder using the rubber composition. The magnetic rubber composition for the magnetic encoder includes a fluorinated rubber with a Mooney viscosity (ML1+10, 121° C.) of 20 to 100 and a magnetic powder, and the magnetic powder is blended in a proportion of 230 to 1900 parts by weight relative to 100 parts by weight of the fluorinated rubber. The magnetic encoder is provided by vulcanizing and molding the rubber composition.
摘要翻译：本发明提供一种磁性编码器用橡胶组合物，其耐久性，耐油性，耐化学性，耐磁特性高，加工性优异，使用了橡胶组合物的磁编码器。磁性编码器用磁性橡胶组合物包括门尼粘度（ML1 + 10，121℃）为20〜100的氟化橡胶和磁性粉末，磁粉以230〜1900份的比例混合相对于100重量份的氟化橡胶。通过硫化和成型橡胶组合物来提供磁性编码器。

9. 发明授权

US07816185B2 Method of manufacturing a semiconductor device 有权
标题翻译：制造半导体器件的方法
公开(公告)号：US07816185B2
公开(公告)日：2010-10-19
申请号：US12534183
申请日：2009-08-03
申请人： Tadashi Munakata , Shingo Oosaka , Mitsuru Kinoshita , Yoshihiko Yamaguchi , Noriyuki Takahashi
发明人： Tadashi Munakata , Shingo Oosaka , Mitsuru Kinoshita , Yoshihiko Yamaguchi , Noriyuki Takahashi
IPC分类号： H01L23/485
CPC分类号： H01L21/78 , H01L21/02076 , H01L21/561 , H01L21/565 , H01L21/67092 , H01L21/67126 , H01L21/67333 , H01L21/6838 , H01L23/3128 , H01L24/73 , H01L24/97 , H01L2224/32225 , H01L2224/45144 , H01L2224/48091 , H01L2224/48225 , H01L2224/48227 , H01L2224/48465 , H01L2224/73265 , H01L2224/97 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01009 , H01L2924/01033 , H01L2924/01039 , H01L2924/01057 , H01L2924/01075 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/14 , H01L2924/15183 , H01L2924/15311 , H01L2924/181 , H01L2924/3025 , H01L2224/85 , H01L2924/00014 , H01L2224/83 , H01L2924/00012 , H01L2924/00
摘要： A semiconductor device manufacturing method comprising the steps of providing a matrix substrate having a main surface with plural device areas formed thereon, fixing plural semiconductor chips to the plural device areas respectively, then sealing the plural semiconductor chips all together with resin to form a block sealing member, dividing the block sealing member and the matrix substrate for each of the device areas by dicing, thereafter rubbing a surface of each of the diced sealing member portions with a brush, then storing semiconductor devices formed by the dicing once into pockets respectively of a tray, and conveying the semiconductor devices each individually from the tray. Since the substrate dividing work after block molding is performed by dicing while vacuum-chucking the surface of the block sealing member, the substrate division can be done without imposing any stress on an external terminal mounting surface of the matrix substrate.
摘要翻译：一种半导体器件制造方法，包括以下步骤：提供具有形成在其上的多个器件区域的主表面的矩阵衬底，将多个半导体芯片分别固定到多个器件区域，然后将多个半导体芯片与树脂一起密封以形成块密封通过切割将每个设备区域的块状密封构件和矩阵基板分开，然后用刷子擦拭每个切割的密封构件部分的表面，然后将通过切割形成的半导体器件分别存储到一个托盘，并且分别从托盘传送半导体器件。由于在模块密封部件的表面进行真空夹紧的同时通过切割进行块模塑后的基板分割作业，所以可以在不对矩阵基板的外部端子安装面施加任何应力的情况下进行基板分割。

10. 发明授权

US07384820B2 Method of manufacturing a semiconductor device 失效
标题翻译：制造半导体器件的方法
公开(公告)号：US07384820B2
公开(公告)日：2008-06-10
申请号：US11360512
申请日：2006-02-24
申请人： Tadashi Munakata , Shingo Oosaka , Mitsuru Kinoshita , Yoshihiko Yamaguchi , Noriyuki Takahashi
发明人： Tadashi Munakata , Shingo Oosaka , Mitsuru Kinoshita , Yoshihiko Yamaguchi , Noriyuki Takahashi
IPC分类号： H01L21/00
CPC分类号： H01L21/78 , H01L21/02076 , H01L21/561 , H01L21/565 , H01L21/67092 , H01L21/67126 , H01L21/67333 , H01L21/6838 , H01L23/3128 , H01L24/73 , H01L24/97 , H01L2224/32225 , H01L2224/45144 , H01L2224/48091 , H01L2224/48225 , H01L2224/48227 , H01L2224/48465 , H01L2224/73265 , H01L2224/97 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01009 , H01L2924/01033 , H01L2924/01039 , H01L2924/01057 , H01L2924/01075 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/14 , H01L2924/15183 , H01L2924/15311 , H01L2924/181 , H01L2924/3025 , H01L2224/85 , H01L2924/00014 , H01L2224/83 , H01L2924/00012 , H01L2924/00
摘要： A semiconductor device manufacturing method comprising the steps of providing a matrix substrate having a main surface with plural device areas formed thereon, fixing plural semiconductor chips to the plural device areas respectively, then sealing the plural semiconductor chips all together with resin to form a block sealing member, dividing the block sealing member and the matrix substrate for each of the device areas by dicing, thereafter rubbing a surface of each of the diced sealing member portions with a brush, then storing semiconductor devices formed by the dicing once into pockets respectively of a tray, and conveying the semiconductor devices each individually from the tray. Since the substrate dividing work after block molding is performed by dicing while vacuum-chucking the surface of the block sealing member, the substrate division can be done without imposing any stress on an external terminal mounting surface of the matrix substrate.
摘要翻译：一种半导体器件制造方法，包括以下步骤：提供具有形成在其上的多个器件区域的主表面的矩阵衬底，将多个半导体芯片分别固定到多个器件区域，然后将多个半导体芯片与树脂一起密封以形成块密封通过切割将每个设备区域的块状密封构件和矩阵基板分开，然后用刷子擦拭每个切割的密封构件部分的表面，然后将通过切割形成的半导体器件分别存储到一个托盘，并且分别从托盘传送半导体器件。由于在模块密封部件的表面进行真空夹紧的同时通过切割进行块模塑后的基板分割作业，所以可以在不对矩阵基板的外部端子安装面施加任何应力的情况下进行基板分割。

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