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1. 发明授权

US09929220B2 Light emitting device and electronic device 有权
公开(公告)号：US09929220B2
公开(公告)日：2018-03-27
申请号：US12651734
申请日：2010-01-04
申请人： Shunpei Yamazaki , Masahiro Katayama , Shingo Eguchi , Yoshiaki Oikawa , Ami Nakamura , Satoshi Seo , Kaoru Hatano
发明人： Shunpei Yamazaki , Masahiro Katayama , Shingo Eguchi , Yoshiaki Oikawa , Ami Nakamura , Satoshi Seo , Kaoru Hatano
IPC分类号： H01L27/32 , H05B33/02 , H05B33/04 , H05B33/12 , H01L27/12 , H01L29/786 , H01L51/00 , H01L51/52
CPC分类号： H01L27/3246 , H01L27/1214 , H01L27/1218 , H01L27/1266 , H01L29/7869 , H01L51/003 , H01L51/52 , H01L51/524 , H01L51/5253 , H01L2251/5338 , H05B33/02 , H05B33/04 , H05B33/12
摘要： Thinned and highly reliable light emitting elements are provided. Further, light emitting devices in which light emitting elements are formed over flexible substrates are manufactured with high yield. One light emitting device includes a flexible substrate, a light emitting element formed over the flexible substrate, and a resin film covering the light emitting element, and in the light emitting element, an insulating layer serving as a partition has a convex portion and the convex portion is embedded in the resin film, that is, the resin film covers an entire surface of the insulating layer and an entire surface of the second electrode, whereby the light emitting element can be thinned and highly reliable. In addition, a light emitting device can be manufactured with high yield in a manufacturing process thereof.

2. 发明授权

US08803298B2 Semiconductor device and manufacturing method of the same 有权
标题翻译：半导体器件及其制造方法相同
公开(公告)号：US08803298B2
公开(公告)日：2014-08-12
申请号：US13354635
申请日：2012-01-20
申请人： Yoshiaki Oikawa , Shingo Eguchi
发明人： Yoshiaki Oikawa , Shingo Eguchi
IPC分类号： H01L23/02
CPC分类号： H01L23/60 , H01L23/3107 , H01L23/66 , H01L2223/6677 , H01L2924/0002 , H01L2924/12044 , H01L2924/3025 , H01L2924/00
摘要： With the use of a conductive shield formed on the top or bottom side of a semiconductor integrated circuit, an electrostatic breakdown (malfunctions of the circuit or damages of a semiconductor element) of the semiconductor integrated circuit due to electrostatic discharge is prevented, and sufficient communication capability is obtained. With the use of a pair of insulators which sandwiches the semiconductor integrated circuit, a highly reliable semiconductor device that is reduced in thickness and size and has resistance to an external stress can be provided. A semiconductor device can be manufactured with high yield while defects of shapes and characteristics due to an external stress or electrostatic discharge are prevented in the manufacturing process.
摘要翻译：通过使用形成在半导体集成电路的顶部或底部的导电屏蔽，防止由静电放电引起的半导体集成电路的静电击穿（电路的故障或半导体元件的损坏），并且充分的通信获得能力。通过使用夹持半导体集成电路的一对绝缘体，可以提供厚度和尺寸减小并且具有耐外部应力的高度可靠的半导体器件。可以以高产率制造半导体器件，同时在制造过程中防止由外部应力或静电放电引起的形状和特性的缺陷。

3. 发明申请

US20110001146A1 Light-Emitting Device, Lighting Device, and Electronic Device 有权
标题翻译：发光装置，照明装置和电子装置
公开(公告)号：US20110001146A1
公开(公告)日：2011-01-06
申请号：US12824795
申请日：2010-06-28
申请人： Shunpei Yamazaki , Kaoru Hatano , Masahiro Katayama , Shingo Eguchi , Yoshiaki Oikawa , Ami Nakamura
发明人： Shunpei Yamazaki , Kaoru Hatano , Masahiro Katayama , Shingo Eguchi , Yoshiaki Oikawa , Ami Nakamura
IPC分类号： H01L33/00
CPC分类号： H01L51/5246 , H01L27/14609 , H01L27/1463 , H01L27/14689 , H01L27/322 , H01L27/3244 , H01L27/3276 , H01L33/08 , H01L33/48 , H01L51/5243 , H01L51/5253 , H01L51/5278 , H01L2227/323 , H01L2251/5338 , H01L2251/5361 , H05B33/04 , H05B33/10 , H05B33/22
摘要： It is an object to provide a flexible light-emitting device with high reliability in a simple way. Further, it is an object to provide an electronic device or a lighting device each mounted with the light-emitting device. A light-emitting device with high reliability can be obtained with the use of a light-emitting device having the following structure: an element portion including a light-emitting element is interposed between a substrate having flexibility and a light-transmitting property with respect to visible light and a metal substrate; and insulating layers provided over and under the element portion are in contact with each other in the outer periphery of the element portion to seal the element portion. Further, by mounting an electronic device or a lighting device with a light-emitting device having such a structure, an electronic device or a lighting device with high reliability can be obtained.
摘要翻译：本发明的目的是以简单的方式提供高可靠性的柔性发光装置。此外，其目的是提供一种每个安装有发光装置的电子装置或照明装置。通过使用具有以下结构的发光装置，可以获得高可靠性的发光装置：包括发光元件的元件部分介于具有柔性的基板和相对于可见光和金属基板; 并且设置在元件部分之上和之下的绝缘层在元件部分的外周彼此接触以密封元件部分。此外，通过使用具有这种结构的发光装置安装电子装置或照明装置，可以获得具有高可靠性的电子装置或照明装置。

4. 发明授权

US08766269B2 Light-emitting device, lighting device, and electronic device 有权
标题翻译：发光装置，照明装置和电子装置
公开(公告)号：US08766269B2
公开(公告)日：2014-07-01
申请号：US12824795
申请日：2010-06-28
申请人： Shunpei Yamazaki , Kaoru Hatano , Masahiro Katayama , Shingo Eguchi , Yoshiaki Oikawa , Ami Nakamura
发明人： Shunpei Yamazaki , Kaoru Hatano , Masahiro Katayama , Shingo Eguchi , Yoshiaki Oikawa , Ami Nakamura
IPC分类号： H01L27/14 , H01L29/04 , H01L29/15 , H01L31/036
CPC分类号： H01L51/5246 , H01L27/14609 , H01L27/1463 , H01L27/14689 , H01L27/322 , H01L27/3244 , H01L27/3276 , H01L33/08 , H01L33/48 , H01L51/5243 , H01L51/5253 , H01L51/5278 , H01L2227/323 , H01L2251/5338 , H01L2251/5361 , H05B33/04 , H05B33/10 , H05B33/22
摘要： It is an object to provide a flexible light-emitting device with high reliability in a simple way. Further, it is an object to provide an electronic device or a lighting device each mounted with the light-emitting device. A light-emitting device with high reliability can be obtained with the use of a light-emitting device having the following structure: an element portion including a light-emitting element is interposed between a substrate having flexibility and a light-transmitting property with respect to visible light and a metal substrate; and insulating layers provided over and under the element portion are in contact with each other in the outer periphery of the element portion to seal the element portion. Further, by mounting an electronic device or a lighting device with a light-emitting device having such a structure, an electronic device or a lighting device with high reliability can be obtained.
摘要翻译：本发明的目的是以简单的方式提供具有高可靠性的柔性发光装置。此外，其目的是提供一种每个安装有发光装置的电子装置或照明装置。通过使用具有以下结构的发光装置，可以获得高可靠性的发光装置：包括发光元件的元件部分介于具有柔性的基板和相对于可见光和金属基板; 并且设置在元件部分之上和之下的绝缘层在元件部分的外周彼此接触以密封元件部分。此外，通过使用具有这种结构的发光装置安装电子装置或照明装置，可以获得具有高可靠性的电子装置或照明装置。

5. 发明授权

US08643020B2 Light-emitting device, lighting device, and electronic device 有权
公开(公告)号：US08643020B2
公开(公告)日：2014-02-04
申请号：US12824795
申请日：2010-06-28
申请人： Shunpei Yamazaki , Kaoru Hatano , Masahiro Katayama , Shingo Eguchi , Yoshiaki Oikawa , Ami Nakamura
发明人： Shunpei Yamazaki , Kaoru Hatano , Masahiro Katayama , Shingo Eguchi , Yoshiaki Oikawa , Ami Nakamura
IPC分类号： H01L27/14 , H01L29/04 , H01L29/15 , H01L31/036
摘要： It is an object to provide a flexible light-emitting device with high reliability in a simple way. Further, it is an object to provide an electronic device or a lighting device each mounted with the light-emitting device. A light-emitting device with high reliability can be obtained with the use of a light-emitting device having the following structure: an element portion including a light-emitting element is interposed between a substrate having flexibility and a light-transmitting property with respect to visible light and a metal substrate; and insulating layers provided over and under the element portion are in contact with each other in the outer periphery of the element portion to seal the element portion. Further, by mounting an electronic device or a lighting device with a light-emitting device having such a structure, an electronic device or a lighting device with high reliability can be obtained.

6. 发明授权

US08144389B2 Electronic paper 有权
标题翻译：电子纸
公开(公告)号：US08144389B2
公开(公告)日：2012-03-27
申请号：US12986443
申请日：2011-01-07
申请人： Yoshiaki Oikawa , Shingo Eguchi , Mitsuo Mashiyama , Masatoshi Kataniwa , Hironobu Shoji , Masataka Nakada
发明人： Yoshiaki Oikawa , Shingo Eguchi , Mitsuo Mashiyama , Masatoshi Kataniwa , Hironobu Shoji , Masataka Nakada
IPC分类号： G02B26/00 , G09G3/34 , G03G17/04 , C02F1/40
CPC分类号： G02F1/167 , G02F2201/50 , G02F2201/503 , G02F2202/22
摘要： An object of the present invention is to increase the resistance of electronic paper to external stress. The resistance to external stress is increased by providing an element formation layer, which includes an integrated circuit portion, a first electrode, a second electrode, and a charged particle-containing layer, between a first insulating film including a first structure body in which a first fibrous body is impregnated with a first organic resin, and a second insulating film including a second structure body in which a second fibrous body is impregnated with a second organic resin.
摘要翻译：本发明的目的是增加电子纸对外部应力的阻力。通过在包括第一结构体的第一绝缘膜之间提供包括集成电路部分，第一电极，第二电极和带电粒子的层的元件形成层来增加对外部应力的抵抗性，其中第一纤维体浸渍有第一有机树脂，第二绝缘膜包括第二结构体，其中第二纤维体浸渍有第二有机树脂。

7. 发明申请

US20100124795A1 METHOD FOR MANUFACTURING FLEXIBLE SEMICONDUCTOR DEVICE 有权
标题翻译：制造柔性半导体器件的方法
公开(公告)号：US20100124795A1
公开(公告)日：2010-05-20
申请号：US12619776
申请日：2009-11-17
申请人： Shingo Eguchi , Yoshiaki Oikawa , Masahiro Katayama , Ami Nakamura , Yohei Monma
发明人： Shingo Eguchi , Yoshiaki Oikawa , Masahiro Katayama , Ami Nakamura , Yohei Monma
IPC分类号： H01L21/28 , H01L21/20 , H01L21/306
CPC分类号： H01L27/1266 , H01L21/32134 , H01L27/1214
摘要： It is an object of one embodiment of the preset invention to conduct separation without damaging a semiconductor element when the semiconductor element is made flexible. Further, it is another object of one embodiment of the preset invention to provide a technique for weakening adhesion between a separation layer and a buffer layer. Furthermore, it is another object of one embodiment of the preset invention to provide a technique for preventing generation of the bending stress on a semiconductor element due to separation. A semiconductor element formed over a separation layer with a buffer layer interposed therebetween is separated by dissolving the separation layer by using an etchant. Alternatively, separation is conducted by inserting a film into a region where a separation layer is dissolved by being in contact with an etchant and moving the film in a direction toward a region where the separation layer is not dissolved.
摘要翻译：本发明的一个实施例的目的是当半导体元件变得柔性时进行分离而不损坏半导体元件。此外，本发明的一个实施方案的另一个目的是提供一种削弱分离层和缓冲层之间粘附性的技术。此外，本发明的一个实施例的另一个目的是提供一种用于防止由于分离而在半导体元件上产生弯曲应力的技术。通过使用蚀刻剂溶解分离层来分离形成在分离层上的缓冲层之间的半导体元件。或者，通过与蚀刻剂接触并将膜沿朝向分离层不溶解的区域的方向移动而将膜插入到分离层溶解的区域中进行分离。

8. 发明申请

US20100007829A1 LIQUID CRYSTAL DISPLAY DEVICE AND METHOD FOR MANUFACTURING THE SAME 有权
标题翻译：液晶显示装置及其制造方法
公开(公告)号：US20100007829A1
公开(公告)日：2010-01-14
申请号：US12498589
申请日：2009-07-07
申请人： Yoshiaki Oikawa , Shingo Eguchi , Mitsuo Mashiyama , Masatoshi Kataniwa , Hironobu Shoji , Masataka Nakada
发明人： Yoshiaki Oikawa , Shingo Eguchi , Mitsuo Mashiyama , Masatoshi Kataniwa , Hironobu Shoji , Masataka Nakada
IPC分类号： G02F1/1333 , G02F1/1339
CPC分类号： G02F1/133305 , G02F2201/503 , G02F2202/22
摘要： A flexible and highly reliable liquid crystal display device which is not easily damaged even if subjected to external pressure is provided. A method for manufacturing, with high yield, a flexible and highly reliable liquid crystal display device which is not easily damaged even if subjected to external pressure is also provided. A liquid crystal display device including a first structure body including a first fibrous body and a first organic resin, a second structure body including a second fibrous body and a second organic resin, a liquid crystal interposed between the first and second structure bodies, and a seal member for fixing the first and second structure bodies and for enclosing the liquid crystal. The first and second fibrous bodies are impregnated with the first and second organic resins, respectively, and the first structure body and the second structure body are in contact with each other.
摘要翻译：提供了即使受到外部压力也不容易损坏的柔性且高度可靠的液晶显示装置。也提供了即使经受外部压力也不容易损坏的柔性高可靠性液晶显示装置的制造方法。一种液晶显示装置，包括：第一结构体，包括第一纤维体和第一有机树脂;第二结构体，包括第二纤维体和第二有机树脂;液晶，介于所述第一和第二结构体之间，用于固定第一和第二结构体并封闭液晶的密封构件。第一和第二纤维体分别浸渍有第一和第二有机树脂，并且第一结构体和第二结构体彼此接触。

9. 发明授权

US08860306B2 Display device having a fibrous encapsulating structure 有权
标题翻译：具有纤维封装结构的显示装置
公开(公告)号：US08860306B2
公开(公告)日：2014-10-14
申请号：US13604028
申请日：2012-09-05
申请人： Yoshiaki Oikawa , Shingo Eguchi , Mitsuo Mashiyama , Masatoshi Kataniwa , Hironobu Shoji , Masataka Nakada , Satoshi Seo
发明人： Yoshiaki Oikawa , Shingo Eguchi , Mitsuo Mashiyama , Masatoshi Kataniwa , Hironobu Shoji , Masataka Nakada , Satoshi Seo
IPC分类号： H01L33/00 , H01L51/52 , H01L51/00
CPC分类号： H01L33/44 , H01L51/003 , H01L51/5237 , H01L51/524 , H01L51/5253 , H01L51/56 , H01L2227/323 , H01L2227/326
摘要： An object is to provide a highly reliable light emitting device which is thin and is not damaged by external local pressure. Further, another object is to manufacture a light emitting device with a high yield by preventing defects of a shape and characteristics due to external stress in a manufacture process. A light emitting element is sealed between a first structure body in which a fibrous body is impregnated with an organic resin and a second structure body in which a fibrous body is impregnated with an organic resin, whereby a highly reliable light emitting device which is thin and has intensity can be provided. Further, a light emitting device can be manufactured with a high yield by preventing defects of a shape and characteristics in a manufacture process.
摘要翻译：目的是提供一种非常可靠的发光装置，该发光装置薄且不被外部局部压力损坏。此外，另一个目的是通过在制造过程中防止由于外部应力引起的形状和特性的缺陷而以高产率制造发光器件。发光元件被密封在其中纤维体浸渍有机树脂的第一结构体和其中纤维体浸渍有机树脂的第二结构体之间，由此可靠的发光器件是薄的和可以提供强度。此外，通过防止制造过程中的形状和特性的缺陷，可以以高产率制造发光器件。

10. 发明授权

US08698172B2 Light emitting device and electronic device 有权
公开(公告)号：US08698172B2
公开(公告)日：2014-04-15
申请号：US12651734
申请日：2010-01-04
申请人： Shunpei Yamazaki , Masahiro Katayama , Shingo Eguchi , Yoshiaki Oikawa , Ami Nakamura , Satoshi Seo , Kaoru Hatano
发明人： Shunpei Yamazaki , Masahiro Katayama , Shingo Eguchi , Yoshiaki Oikawa , Ami Nakamura , Satoshi Seo , Kaoru Hatano
IPC分类号： H01L33/00
摘要： Thinned and highly reliable light emitting elements are provided. Further, light emitting devices in which light emitting elements are formed over flexible substrates are manufactured with high yield. One light emitting device includes a flexible substrate, a light emitting element formed over the flexible substrate, and a resin film covering the light emitting element, and in the light emitting element, an insulating layer serving as a partition has a convex portion and the convex portion is embedded in the resin film, that is, the resin film covers an entire surface of the insulating layer and an entire surface of the second electrode, whereby the light emitting element can be thinned and highly reliable. In addition, a light emitting device can be manufactured with high yield in a manufacturing process thereof.

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