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    • 5. 发明授权
    • Multilayer printed circuit board
    • 多层印刷电路板
    • US5726863A
    • 1998-03-10
    • US591687
    • 1996-01-25
    • Kouji NakayamaTsutomu Imai
    • Kouji NakayamaTsutomu Imai
    • H05K3/46H05K1/02H05K1/11H05K1/18
    • H05K1/115H05K1/0218H05K1/18H05K2201/09536H05K2201/09627H05K2201/09781H05K2201/10689H05K3/4623
    • A high-density multilayer printed circuit board is provided such that crosstalk noise between through holes is avoided and wiring efficiency is increased. Power supply through holes which connect to power supply pins of component parts are combined to make room for via holes in certain portions of the multilayer printed circuit board. These power supply through holes are subsequently restored into their original form. This permits via holes to exist at certain locations so that certain wiring layers can be interconnected. Additionally, by restoring the power supply through holes, crosstalk noise is reduced as the rear side of the multilayer printed circuit board is approached. Finally, dummy power supply lines can be provided to further reduce crosstalk noise. These dummy power supply lines are not connected to power supply pins of the component parts.
    • 提供高密度多层印刷电路板,以避免通孔之间的串扰噪声,提高布线效率。 与组件的电源引脚连接的电源通孔被组合,为多层印刷电路板的某些部分的通孔留出空间。 这些电源通孔随后恢复到原来的形式。 这允许在某些位置存在通孔,使得某些布线层可以互连。 此外,通过孔恢复电源,随着接近多层印刷电路板的后侧,串扰噪声减小。 最后,可以提供虚拟电源线以进一步减少串扰噪声。 这些虚拟电源线不连接到组件的电源引脚。