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    • 1. 发明申请
    • DYE-SENSITIZED SOLAR CELL AND METHOD OF MANUFACTURING THE SAME
    • 透明的太阳能电池及其制造方法
    • US20080078443A1
    • 2008-04-03
    • US11751674
    • 2007-05-22
    • Yongseok JUNMangu KANGJong Dae KIM
    • Yongseok JUNMangu KANGJong Dae KIM
    • H01L31/0224H01L31/0216
    • H01G9/2031H01L51/0086Y02E10/542Y02P70/521
    • A dye-sensitized solar cell in which an insulating layer is formed on exposed surfaces of a semiconductor oxide layer in a semiconductor electrode and a conductive substrate, and a method of manufacturing the dye-sensitized solar cell are provided. The dye-sensitized solar cell includes a semiconductor electrode and an opposing electrode disposed to face each other, and an electrolyte solution interposed between the electrodes. The semiconductor electrode includes a conductive substrate, a semiconductor oxide layer formed on the semiconductor electrode, a dye molecule layer adhered to the surface of the semiconductor oxide layer, and an insulating layer formed on the surfaces of the semiconductor oxide layer exposed through the dye molecule layer and the conductive substrate. The insulating layer is formed of a self-assembling organic layer which is self-assembled on the surfaces of the semiconductor oxide layer and the conductive substrate by a chemical bond.
    • 提供了在半导体电极和导电性基板中的半导体氧化物层的露出面上形成绝缘层的染料敏化太阳能电池,以及染料敏化太阳能电池的制造方法。 染料敏化太阳能电池包括设置成彼此面对的半导体电极和相对电极,以及插在电极之间的电解质溶液。 半导体电极包括导电基板,形成在半导体电极上的半导体氧化物层,粘附到半导体氧化物层的表面的染料分子层,以及形成在通过染料分子暴露的半导体氧化物层的表面上的绝缘层 层和导电基板。 绝缘层由自组装有机层形成,其通过化学键自组装在半导体氧化物层和导电基板的表面上。
    • 4. 发明申请
    • METHOD OF FABRICATING ELECTRONIC DEVICE USING NANOWIRES
    • 使用纳米级制造电子器件的方法
    • US20080132052A1
    • 2008-06-05
    • US11947139
    • 2007-11-29
    • Seung Eon MOONEun Kyoung KIMHong Yeol LEEJong Hyurk PARKKang Ho PARKJong Dae KIMSo Jeong PARKGyu Tae KIM
    • Seung Eon MOONEun Kyoung KIMHong Yeol LEEJong Hyurk PARKKang Ho PARKJong Dae KIMSo Jeong PARKGyu Tae KIM
    • H01L21/44
    • H01L21/76892H01L2221/1094
    • A method of fabricating an electronic device using nanowires, minimizing the number of E-beam processing steps and thus improving a yield, includes the steps of: forming electrodes on a substrate; depositing a plurality of nanowires on the substrate including the electrodes; capturing an image of the substrate including the nanowires and the electrodes; drawing virtual connection lines for connecting the nanowires with the electrodes on the image using an electrode pattern simulated through a computer program, after capturing the image; coating an E-beam photoresist on the substrate; removing the photoresist from regions corresponding to the virtual connection lines and the electrode pattern using E-beam lithography; depositing a metal layer on the substrate after removing the photoresist from the regions of the virtual connection lines; and removing remaining photoresist from the substrate using a lift-off process. It is possible to reduce the time and cost associated with fabricating electronic devices with nanowires because the number of E-beam processing steps remarkably decreases compared to the conventional method that fabricates electronic devices only by means of the E-beam lithography processes. After calling upon an image of the substrate having nanowires on a computer program, the electronic devices are fabricated with reference to the substrate image, thus enhancing the product yield.
    • 使用纳米线制造电子器件的方法,使电子束处理步骤的数量最小化并因此提高产量,包括以下步骤:在衬底上形成电极; 在包括电极的基板上沉积多个纳米线; 捕获包括纳米线和电极的衬底的图像; 绘制虚拟连接线,用于在捕获图像之后,使用通过计算机程序模拟的电极图案将纳米线与图像上的电极连接; 在基板上涂覆电子束光致抗蚀剂; 使用电子束光刻从与虚拟连接线对应的区域和电极图案中去除光致抗蚀剂; 在从虚拟连接线的区域去除光致抗蚀剂之后,在基板上沉积金属层; 以及使用剥离工艺从衬底去除剩余的光致抗蚀剂。 与仅通过电子束光刻工艺制造电子器件的常规方法相比,电子束处理步骤的数量显着降低,可以减少与制造具有纳米线的电子器件相关联的时间和成本。 在计算机程序上调用具有纳米线的衬底的图像之后,参考衬底图像制造电子器件,从而提高产品产量。