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    • 1. 发明授权
    • Integrated circuits having plugs in conductive layers therein and related methods
    • 具有导电层中的插塞的集成电路及其相关方法
    • US06545358B2
    • 2003-04-08
    • US09388901
    • 1999-09-02
    • Yong-sang Jeong
    • Yong-sang Jeong
    • H01L2348
    • H01L21/76895H01L23/5226H01L23/53223H01L23/53228H01L2924/0002H01L2924/00
    • An integrated circuit structure includes a first conductive layer, a first plug, an insulating layer, a second plug, and a second conductive layer. The first conductive layer is on a substrate wherein the first conductive layer has a recess in a surface thereof opposite the substrate, and the first plug is in the recess. The insulating layer is on the first conductive layer and on the first plug wherein the first insulating layer has a hole therein that exposes a portion of the first plug, and the second plug is in the hole. The second conductive layer is on the insulating layer and on the second plug in the hole opposite the substrate. In particular, a size of the recess can be greater than a size of the hole. An electrical resistance between the first and second conductive layers can thus be reduced. Related methods are also discussed.
    • 集成电路结构包括第一导电层,第一插塞,绝缘层,第二插塞和第二导电层。 第一导电层在基板上,其中第一导电层在与基板相对的表面中具有凹槽,并且第一插塞位于凹部中。 所述绝缘层位于所述第一导电层上和所述第一插塞上,其中所述第一绝缘层在其中具有暴露所述第一插头的一部分的孔,并且所述第二插头位于所述孔中。 第二导电层位于与衬底相对的孔中的绝缘层上和第二插塞上。 特别地,凹部的尺寸可以大于孔的尺寸。 因此可以减小第一和第二导电层之间的电阻。 还讨论了相关方法。