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1. 发明申请

US20120228560A1 CONDUCTIVE ADHESIVE, METHOD FOR MANUFACTURING THE SAME, AND ELECTRONIC DEVICE INCLUDING THE SAME 审中-公开
标题翻译：导电粘合剂，其制造方法和包括其的电子设备
公开(公告)号：US20120228560A1
公开(公告)日：2012-09-13
申请号：US13465738
申请日：2012-05-07
申请人： Yong Un Jang , Sung Chul Kim , Yong Cheol Chu , Seung Jun Jang , Yoon Sang Son , Soon Ho Joeng
发明人： Yong Un Jang , Sung Chul Kim , Yong Cheol Chu , Seung Jun Jang , Yoon Sang Son , Soon Ho Joeng
IPC分类号： H01B1/02 , B82Y30/00
CPC分类号： C09J9/02 , C08K3/04 , C08K3/041 , C08K3/042 , C08K3/08 , C08K7/00 , C08K9/02 , C08K2003/0806 , C08K2003/0837 , C08K2003/085 , C08K2003/0893 , C08K2201/011 , C09J11/04
摘要： The present invention relates to a conductive adhesive, a method for manufacturing the same, and an electronic device including the same. The conductive adhesive includes: a conductive particle; a low-melting alloy powder including an alloy including Sn and at least one material selected from the group consisting of Ag, Cu, Bi, Zn, In, and Pb; a nano powder; a first binder including a thermosetting resin; and a second binder including a rosin compound.
摘要翻译：导电胶粘剂及其制造方法技术领域本发明涉及导电性粘合剂及其制造方法以及具备该导电性粘接剂的电子设备。导电粘合剂包括：导电颗粒; 包括含有Sn和选自Ag，Cu，Bi，Zn，In和Pb中的至少一种材料的合金的低熔点合金粉末; 纳米粉末; 包含热固性树脂的第一粘合剂; 和包含松香化合物的第二粘合剂。

2. 发明申请

US20120067629A1 SOLDER ADHESIVE AND A PRODUCTION METHOD FOR THE SAME, AND AN ELECTRONIC DEVICE COMPRISING THE SAME 审中-公开
标题翻译：焊膏及其制造方法以及包含该方法的电子设备
公开(公告)号：US20120067629A1
公开(公告)日：2012-03-22
申请号：US13240764
申请日：2011-09-22
申请人： Yong Un Jang , Sung Chul Kim , Yong Cheol Chu , Seung Jun Jang , Yoon Sang Son
发明人： Yong Un Jang , Sung Chul Kim , Yong Cheol Chu , Seung Jun Jang , Yoon Sang Son
IPC分类号： H05K1/09 , H05K1/03 , H05K1/11 , B23K35/26 , B23K35/36
CPC分类号： B23K35/262 , B23K35/0244 , B23K35/3613 , B23K2101/36
摘要： The present invention relates to a solder adhesive and a production method for the same, and to an electronic device comprising the same, and more specifically it relates to a solder adhesive comprising an alloy including tin and having a melting point of from 130 to 300° C., a first binder including a rosin compound, and a second binder having a thermosetting resin, as well as to a production method for the same and an electronic device comprising the same.
摘要翻译：本发明涉及一种焊料粘合剂及其制备方法，以及涉及包含该焊料粘合剂的电子器件，更具体地说，涉及一种焊料粘合剂，其包括含锡的合金，熔点为130-300℃ C.，包含松香化合物的第一粘合剂和具有热固性树脂的第二粘合剂，以及其制备方法和包含该固化性树脂的电子设备。

3. 发明申请

US20120309866A1 SOLDER INK AND ELECTRONIC DEVICE PACKAGE USING SAME 审中-公开
标题翻译：焊锡和电子设备包装使用相同
公开(公告)号：US20120309866A1
公开(公告)日：2012-12-06
申请号：US13579521
申请日：2010-03-10
申请人： Yong Un Jang , Sung Chul Kim , Yong Cheol Chu , Seung Jun Jang , Yoon Sang Son
发明人： Yong Un Jang , Sung Chul Kim , Yong Cheol Chu , Seung Jun Jang , Yoon Sang Son
IPC分类号： C09D11/10 , C08K13/02
CPC分类号： B23K35/262 , B23K35/0244 , B23K35/264 , B23K35/3613 , C09D11/52 , C22C1/0483 , C22C12/00 , C22C13/00 , H01L24/11 , H01L24/13 , H01L2224/11334 , H01L2924/12041 , H01L2924/12044 , H01L2924/14 , H01L2924/00
摘要： The present invention relates to a solder ink and an electronic device package using the same. The solder ink includes: a solder powder including an alloy including tin (Sn); a binder including a first resin comprising rosin resin or rosin modified resin; an active agent; and a solvent.
摘要翻译：本发明涉及一种焊料墨水和使用其的电子器件封装。焊锡墨水包括：包含锡（Sn）的合金的焊料粉末; 包含包含松香树脂或松香改性树脂的第一树脂的粘合剂; 活性剂; 和溶剂。

4. 发明授权

US08221560B2 Lead free solder alloy 有权
标题翻译：无铅焊料合金
公开(公告)号：US08221560B2
公开(公告)日：2012-07-17
申请号：US12309382
申请日：2008-09-04
申请人： Kang Hee Kim , Yong Cheol Chu , Myoung Ho Chun , Sang Ho Jeon , Hyun Kyu Lee
发明人： Kang Hee Kim , Yong Cheol Chu , Myoung Ho Chun , Sang Ho Jeon , Hyun Kyu Lee
IPC分类号： B23K35/22
CPC分类号： B23K35/262 , B23K35/40 , C22C1/02 , C22C13/00 , H05K3/3463
摘要： Disclosed herein are a lead-free solder alloy and a manufacturing method thereof. More specifically, disclosed are: a lead-free solder alloy, which comprises 0.8-1.2 wt % silver (Ag), 0.8-1.2 wt % copper (Cu), 0.01-1.0 wt % palladium (Pd), 0.001-0.1 wt % tellurium (Te), and a balance of tin (Sn), and thus has a melting point similar to those of prior lead-free solder alloys, excellent wettability, very low segregation ratio, and excellent weldability with a welding base metal, such that it improves temperature cycle performance and drop impact resistance simultaneously, when it is applied to electronic devices and printed circuit boards; a manufacturing method of the above alloy; and electronic devices and printed circuit boards which include the same.
摘要翻译：本发明公开了一种无铅焊料合金及其制造方法。更具体地，公开了：无铅焊料合金，其包含0.8-1.2重量％的银（Ag），0.8-1.2重量％的铜（Cu），0.01-1.0重量％的钯（Pd），0.001-0.1重量％碲（Te）和锡（Sn）的平衡，因此具有与现有无铅焊料合金相似的熔点，优异的润湿性，极低的偏析比和与焊接母材具有优异的焊接性，使得当它应用于电子设备和印刷电路板时，同时提高温度循环性能和降低耐冲击性; 上述合金的制造方法; 以及包括其的电子设备和印刷电路板。

5. 发明申请

US20100272598A1 LEAD FREE SOLDER ALLOY AND MANUFACTURING METHOD THEREOF 有权
标题翻译：无铅焊接合金及其制造方法
公开(公告)号：US20100272598A1
公开(公告)日：2010-10-28
申请号：US12309382
申请日：2008-09-04
申请人： Kang Hee Kim , Yong Cheol Chu , Myoung Ho Chun , Sang Ho Jeon , Hyun Kyu Lee
发明人： Kang Hee Kim , Yong Cheol Chu , Myoung Ho Chun , Sang Ho Jeon , Hyun Kyu Lee
IPC分类号： C22C13/00 , C22C1/02
CPC分类号： B23K35/262 , B23K35/40 , C22C1/02 , C22C13/00 , H05K3/3463
摘要： Disclosed herein are a lead-free solder alloy and a manufacturing method thereof. More specifically, disclosed are: a lead-free solder alloy, which comprises 0.8-1.2 wt % silver (Ag), 0.8-1.2 wt % copper (Cu), 0.01-1.0 wt % palladium (Pd), 0.001-0.1 wt % tellurium (Te), and a balance of tin (Sn), and thus has a melting point similar to those of prior lead-free solder alloys, excellent wettability, very low segregation ratio, and excellent weldability with a welding base metal, such that it improves temperature cycle performance and drop impact resistance simultaneously, when it is applied to electronic devices and printed circuit boards; a manufacturing method of the above alloy; and electronic devices and printed circuit boards which include the same.
摘要翻译：本发明公开了一种无铅焊料合金及其制造方法。更具体地，公开了：无铅焊料合金，其包含0.8-1.2重量％的银（Ag），0.8-1.2重量％的铜（Cu），0.01-1.0重量％的钯（Pd），0.001-0.1重量％碲（Te）和锡（Sn）的平衡，因此具有与现有的无铅焊料合金相似的熔点，优异的润湿性，极低的偏析比和与焊接母材具有优异的焊接性，使得当它应用于电子设备和印刷电路板时，同时提高温度循环性能和降低耐冲击性; 上述合金的制造方法; 以及包括其的电子设备和印刷电路板。

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