专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明授权

US07795118B2 Gallium nitride based compound semiconductor device including compliant substrate and method for manufacturing the same 失效
标题翻译：包括柔性衬底的氮化镓基化合物半导体器件及其制造方法
公开(公告)号：US07795118B2
公开(公告)日：2010-09-14
申请号：US11989008
申请日：2006-07-21
申请人： Yong Sung Jin , Jae Hak Lee
发明人： Yong Sung Jin , Jae Hak Lee
IPC分类号： H01L21/20 , H01L21/36 , H01L31/0256
CPC分类号： C30B29/403 , C30B25/02 , H01L21/0237 , H01L21/0254 , H01L21/0262 , H01L21/02631 , H01L33/007
摘要： A gallium nitride based compound semiconductor device including a compliant substrate having a reduced stress and a method for manufacturing the same are disclosed. The compliant substrate included in the gallium nitride based compound semiconductor device is manufactured by heating a substrate and a group III metal including at least one of an aluminum, a gallium and an indium, and a chloride based compound generated by introducing a HCl gas to the melted group III metal reacts with a NH3 gas to form a nitride based thin film on the wafer.
摘要翻译：公开了一种包括具有减小的应力的柔性衬底的氮化镓基化合物半导体器件及其制造方法。包括在氮化镓基化合物半导体器件中的兼容衬底通过加热衬底和包括铝，镓和铟中的至少一种的III族金属和通过将HCl气体引入到熔融的III族金属与NH 3气体反应以在晶片上形成氮化物基薄膜。

2. 发明申请

US20090261345A1 METHOD FOR MANUFACTURING COMPLIANT SUBSTRATE, COMPLIANT SUBSTRATE MANUFACTURED THEREBY, GALLIUM NITRIDE BASED COMPOUND SEMICONDUCTOR DEVICE HAVING THE COMPLIANT SUBSTRATE AND MANUFACTURING METHOD THEREOF 失效
标题翻译：制造合格基板的方法，其制造的合适基板，具有合金基板的基于氮化镓的化合物半导体器件及其制造方法
公开(公告)号：US20090261345A1
公开(公告)日：2009-10-22
申请号：US11989008
申请日：2006-07-21
申请人： Yong Sung Jin , Jae Hak Lee
发明人： Yong Sung Jin , Jae Hak Lee
IPC分类号： H01L29/24 , H01L21/20 , C30B19/00 , C23C14/34
CPC分类号： C30B29/403 , C30B25/02 , H01L21/0237 , H01L21/0254 , H01L21/0262 , H01L21/02631 , H01L33/007
摘要： A compliant substrate having a reduced stress, a method for manufacturing the same having a reduced manufacturing time, a gallium nitride based compound semiconductor device including the compliant substrate and a method for manufacturing the same are disclosed. The compliant substrate is manufactured by heating a substrate and a group III metal including at least one of an aluminum, a gallium and an indium, and a chloride based compound generated by introducing a HCl gas to the melted group III metal reacts with a NH3 gas to form a nitride based thin film on the wafer.
摘要翻译：公开了具有减小的应力的柔性衬底，其制造时间缩短的制造方法，包括柔性衬底的氮化镓基化合物半导体器件及其制造方法。通过加热衬底和包括铝，镓和铟中的至少一种的III族金属以及通过将HCl气体引入熔融的III族金属而产生的氯化物基化合物来制造柔性衬底与NH 3气体反应以在晶片上形成氮化物基薄膜。

3. 发明授权

US08278642B2 Resistive random access memory device and method of same 有权
标题翻译：电阻随机存取存储器件及其方法
公开(公告)号：US08278642B2
公开(公告)日：2012-10-02
申请号：US12682547
申请日：2008-10-10
申请人： Kyung-Hwa Yoo , Sung In Kim , Jae Hak Lee , Young Wook Chang
发明人： Kyung-Hwa Yoo , Sung In Kim , Jae Hak Lee , Young Wook Chang
IPC分类号： H01L47/00
CPC分类号： G11C13/0007 , B82Y10/00 , G11C2213/16 , G11C2213/32 , H01L27/2463 , H01L45/04 , H01L45/146 , H01L45/1608
摘要： Disclosed are a resistive random access memory device (ReRAM) and a method for manufacturing the same. The ReRAM includes a cell array including a metal oxide nanowire formed inside a micropore array of a porous template, a first electrode electrically connected to an upper protrusion of the metal oxide nanowire, the upper protrusion being exposed to an upper portion of the porous template, and located in an upper portion of the cell array, and a second electrode electrically connected to a lower protrusion of the metal oxide nanowire, the lower protrusion being exposed to a lower portion of the porous template, and located in a lower portion of the cell array.
摘要翻译：公开了一种电阻随机存取存储器件（ReRAM）及其制造方法。 ReRAM包括在多孔模板的微孔阵列内形成的金属氧化物纳米线的单元阵列，与金属氧化物纳米线的上突起电连接的第一电极，上突起暴露于多孔模板的上部，并且位于电池阵列的上部，以及电连接到金属氧化物纳米线的下突起的第二电极，下突起暴露于多孔模板的下部，并且位于电池的下部数组。

4. 发明申请

US20120200024A1 INSERT FOR HANDLER 有权
标题翻译：插件处理器
公开(公告)号：US20120200024A1
公开(公告)日：2012-08-09
申请号：US13395146
申请日：2010-06-24
申请人： Jae Hak Lee
发明人： Jae Hak Lee
IPC分类号： G01R31/26
CPC分类号： G01R31/2887
摘要： An insert for a handler which may be easily replaced when damaged because a semiconductor device is often received in the insert. The insert in which the semiconductor device including a plurality of terminals is received and which allows the semiconductor device to contact an external contactor includes: an insert body that has a through-hole which is formed in a central portion of the insert body and into which the semiconductor device is to be inserted; and a support member that crosses the through-hole to be detachably coupled to the insert body and supports the semiconductor device inserted into the through-hole, wherein a plurality of communication holes are formed to correspond in position to the terminals of the semiconductor device and to pass through the support member from a top surface to a bottom surface of the support member such that the terminals and the external contactor are brought into contact with each other.
摘要翻译：用于处理器的插入件，其可能由于半导体器件经常被接收在插入件中而被损坏时容易地更换。其中容纳包括多个端子的半导体器件并且允许半导体器件接触外部接触器的插入件包括：插入体，其具有形成在插入体的中心部分中的通孔，要插入半导体器件; 以及支撑构件，其穿过所述通孔以可拆卸地联接到所述插入体并且支撑插入所述通孔中的所述半导体装置，其中形成多个连通孔以与半导体装置的端子对应，通过支撑构件从支撑构件的顶表面延伸到底表面，使得端子和外部接触器彼此接触。

5. 发明授权

US08610447B2 Spring structure and test socket using thereof 有权
标题翻译：弹簧结构和使用它的测试插座
公开(公告)号：US08610447B2
公开(公告)日：2013-12-17
申请号：US13054680
申请日：2009-07-20
申请人： Jae Hak Lee
发明人： Jae Hak Lee
IPC分类号： G01R31/00
CPC分类号： G01R1/06722 , G01R1/07314 , H01R12/714 , H01R13/2421 , H01R2201/20
摘要： Spring assemblies and a test socket using the spring assemblies. The spring assemblies are used in a test socket electrically connecting lead terminals of a semiconductor chip to test terminals of a test device by contacting the lead terminals and the test terminals, and include: first springs in which a first steel wire having elasticity and conductivity is coiled in a spiral in one direction; and second springs in which a second steel wire having elasticity and conductivity is coiled in a spiral in an opposite direction to the direction in which the first springs are coiled, which have outer diameters narrower than inner diameters of the first springs, and are inserted into the first springs. Accordingly, electric resistances and inductances of two spring assemblies coiled in a spiral are reduced to improve electricity transmission characteristic. A height of a test socket is easily adjusted using spring assemblies having desired lengths. Also, since only plating is performed on the springs to form the spring assemblies, the spring assemblies are formed at a very low cost and have a wide range of applications.
摘要翻译：弹簧组件和使用弹簧组件的测试插座。弹簧组件用于通过接触引线端子和测试端子将半导体芯片的引线端子电连接到测试装置的测试端子的测试插座中，并且包括：第一弹簧，其中具有弹性和导电性的第一钢丝是沿一个方向卷成螺旋状; 以及第二弹簧，其中具有弹性和导电性的第二钢丝以与第一弹簧卷绕的方向相反的方向螺旋地螺旋形成，其外径比第一弹簧的内径窄，并且插入第一泉。因此，减小了螺旋状的两个弹簧组件的电阻和电感，以提高电力传输特性。使用具有期望长度的弹簧组件容易地调整测试插座的高度。此外，由于仅在弹簧上执行电镀以形成弹簧组件，所以弹簧组件以非常低的成本形成并且具有广泛的应用。

6. 发明申请

US20130106457A1 TEST PROBE FOR TEST AND FABRICATION METHOD THEREOF 有权
标题翻译：用于其测试和制造方法的测试探针
公开(公告)号：US20130106457A1
公开(公告)日：2013-05-02
申请号：US13807949
申请日：2011-07-01
申请人： Jae Hak Lee
发明人： Jae Hak Lee
IPC分类号： G01R1/067 , G01R3/00
CPC分类号： G01R1/067 , G01R1/06722 , G01R1/06738 , G01R3/00 , Y10T29/49117
摘要： A method of fabricating a test probe includes a first conductive providing operation in which a first conductive member formed of a conductive metal material is provided, the first conductive member including a probe portion that has a probe shape and is formed in an upper portion of the first conductive member by a micro-electromechanical systems (MEMS) process, a second conductive member providing operation in which a second conductive member formed of a conductive metal material is provided, the second conductive member having an insertion portion formed in an upper portion of the second conductive member for inserting the first conductive member to be coupled to the insertion portion, an insertion operation in which the first conductive member is inserted into the insertion portion of the second conductive member, and a fixing and coupling operation in which the first conducive member is fixedly coupled to the second conductive member by deforming a part of the second conductive member.
摘要翻译：制造测试探针的方法包括：第一导电提供操作，其中设置由导电金属材料形成的第一导电构件，所述第一导电构件包括具有探针形状并形成在所述导电金属材料的上部的探针部分通过微机电系统（MEMS）工艺的第一导电构件，提供由导电金属材料形成的第二导电构件提供操作的第二导电构件，所述第二导电构件具有形成在所述第二导电构件的上部中的插入部分用于插入要耦合到插入部分的第一导电构件的第二导电构件，插入操作，其中第一导电构件插入到第二导电构件的插入部分中，以及固定和耦合操作，其中第一导电构件通过使第二导电体的一部分变形而固定地耦合到第二导电构件 mber

7. 发明授权

US12054849B2 Apparatus and method for manufacturing hexagonal silicon crystal 有权
公开(公告)号：US12054849B2
公开(公告)日：2024-08-06
申请号：US17630553
申请日：2020-06-10
申请人： Byunggeun Ahn , Jae Hak Lee
发明人： Hyung Soo Ahn , Jae Hak Lee
IPC分类号： C30B25/14 , C23C16/24 , C23C16/30 , C23C16/448 , C23C16/455 , C23C16/458 , C30B25/10 , C30B25/12 , C30B25/16 , C30B25/20 , C30B29/06 , C30B29/40 , C30B29/66
CPC分类号： C30B25/14 , C23C16/24 , C23C16/303 , C23C16/4488 , C23C16/45512 , C23C16/4583 , C30B25/10 , C30B25/12 , C30B25/16 , C30B25/20 , C30B29/06 , C30B29/403 , C30B29/66
摘要： An apparatus for manufacturing hexagonal Si crystal includes: a reaction tube; a mixed source part placed on one side in the reaction tube, for receiving mixed source of silicon, aluminum, and gallium which are in a solid state; a halogenation reaction gas supply pipe for supplying a halogenation reaction gas to the mixed source part; a substrate mounting part placed on the other side in the reaction tube, for mounting a first substrate, wherein the first substrate is disposed such that a crystal growth surface of the first substrate faces downwards; a nitrification reaction gas supply pipe for supplying a nitrification reaction gas to the substrate mounting part; and a heater for heating the reaction tube. The heater heats the reaction tube in a temperature range of 1100-1300° C.

8. 发明授权

US08727328B2 Insert for handler 有权
标题翻译：插入处理程序
公开(公告)号：US08727328B2
公开(公告)日：2014-05-20
申请号：US13395146
申请日：2010-06-24
申请人： Jae Hak Lee
发明人： Jae Hak Lee
IPC分类号： B23Q3/00 , H01R13/62 , H01R13/15 , G01R31/26
CPC分类号： G01R31/2887
摘要： An insert for a handler which may be easily replaced when damaged because a semiconductor device is often received in the insert. The insert in which the semiconductor device including a plurality of terminals is received and which allows the semiconductor device to contact an external contactor includes: an insert body that has a through-hole which is formed in a central portion of the insert body and into which the semiconductor device is to be inserted; and a support member that crosses the through-hole to be detachably coupled to the insert body and supports the semiconductor device inserted into the through-hole, wherein a plurality of communication holes are formed to correspond in position to the terminals of the semiconductor device and to pass through the support member from a top surface to a bottom surface of the support member such that the terminals and the external contactor are brought into contact with each other.
摘要翻译：用于处理器的插入件，其可能由于半导体器件经常被接收在插入件中而被损坏时容易地更换。其中容纳包括多个端子的半导体器件并且允许半导体器件接触外部接触器的插入件包括：插入体，其具有形成在插入体的中心部分中的通孔，要插入半导体器件; 以及支撑构件，其穿过所述通孔以可拆卸地联接到所述插入体并且支撑插入所述通孔中的所述半导体装置，其中形成多个连通孔以与半导体装置的端子对应，通过支撑构件从支撑构件的顶表面延伸到底表面，使得端子和外部接触器彼此接触。

9. 发明申请

US20120127713A1 OUTDOOR LAMP 有权
标题翻译：户外灯
公开(公告)号：US20120127713A1
公开(公告)日：2012-05-24
申请号：US13386740
申请日：2010-07-06
申请人： Jae Hak Lee
发明人： Jae Hak Lee
IPC分类号： F21V21/14 , F21V29/00 , F21V5/04
CPC分类号： F21S8/086 , F21V21/30 , F21V29/767 , F21W2131/103 , F21Y2115/10 , Y02B20/36
摘要： An outdoor lamp. The outdoor lamp includes: a plurality of frame members rotatably connected to each other by hinge members so as to change relative rotation angles; optical source modules each comprising an optical source for emitting light, each of the optical source modules installed attachably to and detachably from the frame members; and rotation restriction units each combined to the frame members to restrict the relative rotation angles of the frame members so as for the frame members to be fixed at desired angles. According to the outdoor lamp, the optical source modules are installed to the rotatable frame members so that optical angles may be easily controlled according to an installation condition for the lamp.
摘要翻译：室外灯。室外灯包括：多个框架构件，其通过铰链构件彼此可旋转地连接以改变相对旋转角度; 每个光源模块包括用于发射光的光源，每个光源模块可安装到框架构件上并可拆卸地安装在框架构件上; 以及旋转限制单元，每个组合到框架构件以限制框架构件的相对旋转角度，以使框架构件以期望的角度固定。根据户外灯，光源模块安装在可旋转的框架部件上，从而可以根据灯的安装条件容易地控制光学角度。

10. 发明申请

US20110102009A1 TEST SOCKET ELECTRICAL CONNECTOR, AND METHOD FOR MANUFACTURING THE TEST SOCKET 审中-公开
标题翻译：测试插座电气连接器，以及制造测试插座的方法
公开(公告)号：US20110102009A1
公开(公告)日：2011-05-05
申请号：US13000166
申请日：2009-06-19
申请人： Jae Hak Lee
发明人： Jae Hak Lee
IPC分类号： G01R31/00 , H01R43/02
CPC分类号： H01R12/714 , G01R1/0466 , G01R1/0491 , G01R1/06722 , G01R3/00 , H01R13/2421 , H01R2201/20 , H05K7/1069 , Y10T29/4921
摘要： A test socket, an electrical connector, and a method for manufacturing the test socket. In detail, the test socket for electrically connecting terminals of a semiconductor device to pads of a test apparatus includes: a housing having through-holes vertically extending to correspond in position to the terminals of the semiconductor device; contact pins disposed to correspond in position to the through-holes of the housing and contacting the terminals of the semiconductor device; and elastic members connected to the contact pins in the through-holes of the housing to contract and expand, wherein the elastic members are adhered to the contact pins by using an adhesive material.
摘要翻译：测试插座，电连接器以及测试插座的制造方法。详细地说，用于将半导体器件的端子电连接到测试装置的焊盘的测试插座包括：具有垂直延伸以与半导体器件的端子对应的通孔的壳体; 接触销设置成与壳体的通孔对准，并与半导体器件的端子接触; 以及连接到所述壳体的所述通孔中的所述接触销的弹性构件，以收缩和膨胀，其中所述弹性构件通过使用粘合材料粘附到所述接触针。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式