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1. 发明授权

US07102283B2 Full-color light emitting device with four leads 失效
标题翻译：全彩发光装置，四引线
公开(公告)号：US07102283B2
公开(公告)日：2006-09-05
申请号：US10699844
申请日：2003-11-04
申请人： Yong Chil Choi , Seung Mo Park , Kyung Taeg Han
发明人： Yong Chil Choi , Seung Mo Park , Kyung Taeg Han
IPC分类号： F21V9/00
CPC分类号： H01L25/0753 , H01L2224/45144 , H01L2224/48091 , H01L2224/48137 , H01L2224/48247 , H01L2224/48465 , Y10S362/80 , H01L2924/00014 , H01L2924/00
摘要： A full-color light emitting device includes four leads and three light emitting diode chips which have different light emission wavelengths and can be individually controlled to realize emission of light beams of more diverse colors. The device has a simplified connection structure, so that it can be implemented even when a limited bonding area is provided.
摘要翻译：全色发光装置包括具有不同发光波长的四个引线和三个发光二极管芯片，并且可以被单独控制以实现更多种颜色的光束的发射。该装置具有简化的连接结构，使得即使在提供有限的结合区域的情况下也可以实现该结构。

2. 发明授权

US08324646B2 Chip coated light emitting diode package and manufacturing method thereof 有权
标题翻译：芯片涂层发光二极管封装及其制造方法
公开(公告)号：US08324646B2
公开(公告)日：2012-12-04
申请号：US12842493
申请日：2010-07-23
申请人： Seon Goo Lee , Kyung Taeg Han , Seong Yeon Han
发明人： Seon Goo Lee , Kyung Taeg Han , Seong Yeon Han
IPC分类号： H01L33/00
CPC分类号： H01L33/62 , H01L33/508 , H01L2224/48091 , H01L2224/48247 , H01L2224/48257 , H01L2224/48465 , H01L2924/01078 , H01L2924/01079 , H01L2924/00014 , H01L2924/00
摘要： A chip coated LED package and a manufacturing method thereof. The chip coated LED package includes a light emitting chip composed of a chip die-attached on a submount and a resin layer uniformly covering an outer surface of the chip die. The chip coated LED package also includes an electrode part electrically connected by metal wires with at least one bump ball exposed through an upper surface of the resin layer. The chip coated LED package further includes a package body having the electrode part and the light emitting chip mounted thereon. The invention improves light efficiency by preventing difference in color temperature according to irradiation angles, increases a yield, miniaturizes the package, and accommodates mass production.
摘要翻译：一种芯片涂覆的LED封装及其制造方法。芯片涂覆的LED封装包括由安装在基座上的芯片芯片和均匀覆盖芯片裸片外表面的树脂层组成的发光芯片。芯片涂覆的LED封装还包括通过金属线电连接的电极部分，其中至少一个凸块球通过树脂层的上表面暴露。芯片涂覆的LED封装还包括具有安装在其上的电极部分和发光芯片的封装体。本发明通过根据照射角度防止色温差异提高光效，提高成品率，使封装体小型化，适应批量生产。

3. 发明授权

US08169128B2 LED package having recess in heat conducting part 有权
标题翻译： LED封装在导热部分具有凹槽
公开(公告)号：US08169128B2
公开(公告)日：2012-05-01
申请号：US11500361
申请日：2006-08-08
申请人： Seon Goo Lee , Chang Ho Song , Kyung Taeg Han
发明人： Seon Goo Lee , Chang Ho Song , Kyung Taeg Han
IPC分类号： H01J1/02
CPC分类号： H01L33/647 , H01L24/97 , H01L33/486 , H01L33/60 , H01L33/62 , H01L2224/48091 , H01L2224/48247 , H01L2924/12041 , H01L2924/181 , Y10S362/80 , H01L2924/00014 , H01L2924/00
摘要： The invention provides an LED package including an LED chip. In the LED package, a heat conducting part of folded sheet metals has a recess formed thereon to seat the LED chip therein. A package body houses the heat conducting part and directs light generated from the LED chip upward. Also, a transparent encapsulant is provided to at least the recess of the heat conducting part. Leads are partially housed by the package body to supply power to the LED chip. According to the invention, the sheet metals are folded to form the heat conducting part, and the recess is formed on the heat conducting part to seat the LED chip therein. This improves reflection efficiency and simplifies an overall process.
摘要翻译：本发明提供了一种包括LED芯片的LED封装。在LED封装中，折叠的金属片的导热部分具有形成在其上的凹部，以将LED芯片置于其中。包装体容纳导热部分，并将LED芯片产生的光向上引导。此外，透明密封剂至少设置在导热部分的凹部上。引线部分地由封装体容纳以向LED芯片供电。根据本发明，折叠金属板以形成导热部分，并且在导热部分上形成凹部以将LED芯片置于其中。这提高了反射效率并简化了整个过程。

4. 发明授权

US07875476B2 High power LED package and fabrication method thereof 有权
标题翻译：大功率LED封装及其制造方法
公开(公告)号：US07875476B2
公开(公告)日：2011-01-25
申请号：US12612268
申请日：2009-11-04
申请人： Seon Goo Lee , Hun Joo Hahm , Jung Kyu Park , Kyung Taeg Han , Seong Yeon Han , Dae Yeon Kim , Young Sam Park
发明人： Seon Goo Lee , Hun Joo Hahm , Jung Kyu Park , Kyung Taeg Han , Seong Yeon Han , Dae Yeon Kim , Young Sam Park
IPC分类号： H01L21/00
CPC分类号： H01L33/642 , H01L33/486 , H01L33/58 , H01L2224/48091 , H01L2924/00014
摘要： An LED diode package includes a heat connecting part for mounting a light emitting part on an upper surface thereof, frames electrically connected to the light emitting part while holding the heat connecting part and a molded part fixing the heat connecting part and the frames together. The light emitting part generates light in response to current applied thereto, and the upper surface of the heat connecting part is protruded beyond an upper surface of the molded part to a predetermined height. This can optimize the unique beam angle of the light source thereby to maximize lighting efficiency as well as prevent overflow of the encapsulating material in the assembling process of the lens, which may otherwise soil adjacent components.
摘要翻译： LED二极管封装包括用于在其上表面上安装发光部分的热连接部分，同时保持热连接部分电连接到发光部分的框架和将热连接部分和框架固定在一起的模制部件。发光部分响应于施加到其上的电流产生光，并且热连接部分的上表面超过模制部件的上表面突出到预定高度。这可以优化光源的唯一光束角度，从而使照明效率最大化，并且防止在透镜的组装过程中封装材料的溢出，否则可能会污染相邻的部件。

5. 发明申请

US20100109040A1 CHIP COATED LIGHT EMITTING DIODE PACKAGE AND MANUFACTURING METHOD THEREOF 有权
公开(公告)号：US20100109040A1
公开(公告)日：2010-05-06
申请号：US12684614
申请日：2010-01-08
申请人： Seon Goo LEE , Kyung Taeg Han , Seong Yeon Han
发明人： Seon Goo LEE , Kyung Taeg Han , Seong Yeon Han
IPC分类号： H01L33/00
CPC分类号： H01L33/62 , H01L33/508 , H01L2224/48091 , H01L2224/48247 , H01L2224/48257 , H01L2224/48465 , H01L2924/01078 , H01L2924/01079 , H01L2924/00014 , H01L2924/00
摘要： A chip coated LED package and a manufacturing method thereof. The chip coated LED package includes a light emitting chip composed of a chip die-attached on a submount and a resin layer uniformly covering an outer surface of the chip die. The chip coated LED package also includes an electrode part electrically connected by metal wires with at least one bump ball exposed through an upper surface of the resin layer. The chip coated LED package further includes a package body having the electrode part and the light emitting chip mounted thereon. The invention improves light efficiency by preventing difference in color temperature according to irradiation angles, increases a yield, miniaturizes the package, and accommodates mass production.

6. 发明申请

US20090155938A1 LIGHT EMITTING DIODE PACKAGE WITH DIFFUSER AND METHOD OF MANUFACTURING THE SAME 有权
标题翻译：具有扩散器的发光二极管封装及其制造方法
公开(公告)号：US20090155938A1
公开(公告)日：2009-06-18
申请号：US12370194
申请日：2009-02-12
申请人： Seong Yeon Han , Seon Goo Lee , Chang Ho Song , Jung Kyu Park , Young Sam Park , Kyung Taeg Han
发明人： Seong Yeon Han , Seon Goo Lee , Chang Ho Song , Jung Kyu Park , Young Sam Park , Kyung Taeg Han
IPC分类号： H01L21/56
CPC分类号： H01L33/58 , H01L33/505 , H01L2224/48091 , H01L2224/49107 , H01L2224/73265 , H01L2924/181 , H01L2933/0091 , H01L2924/00014 , H01L2924/00012
摘要： The invention relates to an LED package for facilitating color mixing using a diffuser and a manufacturing method of the same. The LED package includes a substrate with an electrode formed thereon, and an LED chip mounted on the substrate. The LED package also includes an encapsulant applied around the light emitting diode chip, containing a diffuser. The LED package further includes a lens part disposed on the light emitting diode chip and the encapsulant to radiate light in a wide angle. The LED package allows light from the light emitting diode chip to be emitted out of the package without distortion. The invention allows light to exit through the encapsulant containing the diffuser and the lens part, achieving uniform diffusion and emission of light from the LED chip, thereby increasing a radiating angle and obtaining a uniform light source.
摘要翻译：本发明涉及一种便于使用扩散器进行混色的LED封装及其制造方法。 LED封装包括其上形成有电极的基板和安装在基板上的LED芯片。 LED封装还包括施加在发光二极管芯片周围的密封剂，其包含扩散器。 LED封装还包括设置在发光二极管芯片上的透镜部分和密封剂以广角度辐射光。 LED封装允许来自发光二极管芯片的光从封装外部发射而不变形。本发明允许光通过包含扩散器和透镜部分的密封剂而离开，实现来自LED芯片的均匀的扩散和发射，从而增加辐射角度并获得均匀的光源。

7. 发明授权

US07156538B2 LED package for backlight unit 有权
标题翻译：背光单元的LED封装
公开(公告)号：US07156538B2
公开(公告)日：2007-01-02
申请号：US10953787
申请日：2004-09-30
申请人： Kyung Taeg Han , Chan Wang Park , Seon Goo Lee
发明人： Kyung Taeg Han , Chan Wang Park , Seon Goo Lee
IPC分类号： F21V21/00
CPC分类号： H01L25/0753 , H01L33/486 , H01L2224/48091 , H01L2224/48137 , H01L2224/48247 , H01L2924/00014
摘要： Disclosed herein is an LED package for a backlight unit. The LED package includes a plurality of LEDs, a die bonding part, a wire bonding part and a body. The die bonding part, on which the plurality of LEDs is arranged, allows the first electrodes of the LEDs to be electrically connected to an external circuit. The wire bonding part is spaced apart from the die bonding part by a predetermined distance to be insulated from the die bonding part and allows the second electrodes of the LEDs to be electrically connected to the external circuit so that the LEDs are operated. The body has a molding cup which is used to fill a space above the LEDs with transparent resin and a base on which the die bonding part and the wire bonding part are arranged.
摘要翻译：这里公开了一种用于背光单元的LED封装。 LED封装包括多个LED，芯片接合部，引线接合部和主体。多个LED布置在其上的裸片接合部分允许LED的第一电极电连接到外部电路。引线接合部与芯片接合部隔开预定距离，以与芯片接合部绝缘，并且允许LED的第二电极电连接到外部电路，使得LED被操作。本体具有用于以透明树脂填充LED上方的空间的模制杯和芯片接合部分和引线接合部分布置在其上的基座。

8. 发明申请

US20100289051A1 CHIP COATED LIGHT EMITTING DIODE PACKAGE AND MANUFACTURING METHOD THEREOF 有权
标题翻译：芯片涂层发光二极管封装及其制造方法
公开(公告)号：US20100289051A1
公开(公告)日：2010-11-18
申请号：US12842493
申请日：2010-07-23
申请人： Seon Goo LEE , Kyung Taeg Han , Seong Yeon Han
发明人： Seon Goo LEE , Kyung Taeg Han , Seong Yeon Han
IPC分类号： H01L33/52 , H01L33/00 , H01L21/78 , H01L33/62 , H01L33/60
CPC分类号： H01L33/62 , H01L33/508 , H01L2224/48091 , H01L2224/48247 , H01L2224/48257 , H01L2224/48465 , H01L2924/01078 , H01L2924/01079 , H01L2924/00014 , H01L2924/00
摘要： A chip coated LED package and a manufacturing method thereof. The chip coated LED package includes a light emitting chip composed of a chip die-attached on a submount and a resin layer uniformly covering an outer surface of the chip die. The chip coated LED package also includes an electrode part electrically connected by metal wires with at least one bump ball exposed through an upper surface of the resin layer. The chip coated LED package further includes a package body having the electrode part and the light emitting chip mounted thereon. The invention improves light efficiency by preventing difference in color temperature according to irradiation angles, increases a yield, miniaturizes the package, and accommodates mass production.
摘要翻译：一种芯片涂覆的LED封装及其制造方法。芯片涂覆的LED封装包括由安装在基座上的芯片芯片和均匀覆盖芯片裸片外表面的树脂层组成的发光芯片。芯片涂覆的LED封装还包括通过金属线电连接的电极部分，其中至少一个凸块球通过树脂层的上表面暴露。芯片涂覆的LED封装还包括具有安装在其上的电极部分和发光芯片的封装体。本发明通过根据照射角度防止色温差异提高光效，提高成品率，使封装体小型化，适应批量生产。

9. 发明授权

US07714342B2 Chip coated light emitting diode package and manufacturing method thereof 有权
公开(公告)号：US07714342B2
公开(公告)日：2010-05-11
申请号：US11651524
申请日：2007-01-10
申请人： Seon Goo Lee , Kyung Taeg Han , Seong Yeon Han
发明人： Seon Goo Lee , Kyung Taeg Han , Seong Yeon Han
IPC分类号： H01L33/00 , H01L21/00
CPC分类号： H01L33/62 , H01L33/508 , H01L2224/48091 , H01L2224/48247 , H01L2224/48257 , H01L2224/48465 , H01L2924/01078 , H01L2924/01079 , H01L2924/00014 , H01L2924/00
摘要： A chip coated LED package and a manufacturing method thereof. The chip coated LED package includes a light emitting chip composed of a chip die-attached on a submount and a resin layer uniformly covering an outer surface of the chip die. The chip coated LED package also includes an electrode part electrically connected by metal wires with at least one bump ball exposed through an upper surface of the resin layer. The chip coated LED package further includes a package body having the electrode part and the light emitting chip mounted thereon. The invention improves light efficiency by preventing difference in color temperature according to irradiation angles, increases a yield, miniaturizes the package, and accommodates mass production.

10. 发明申请

US20100112735A1 CHIP COATED LIGHT EMITTING DIODE PACKAGE AND MANUFACTURING METHOD THEREOF 有权
公开(公告)号：US20100112735A1
公开(公告)日：2010-05-06
申请号：US12684578
申请日：2010-01-08
申请人： Seon Goo Lee , Kyung Taeg Han , Seong Yeon Han
发明人： Seon Goo Lee , Kyung Taeg Han , Seong Yeon Han
IPC分类号： H01L21/50 , H01L33/00
CPC分类号： H01L33/62 , H01L33/508 , H01L2224/48091 , H01L2224/48247 , H01L2224/48257 , H01L2224/48465 , H01L2924/01078 , H01L2924/01079 , H01L2924/00014 , H01L2924/00
摘要： A chip coated LED package and a manufacturing method thereof. The chip coated LED package includes a light emitting chip composed of a chip die-attached on a submount and a resin layer uniformly covering an outer surface of the chip die. The chip coated LED package also includes an electrode part electrically connected by metal wires with at least one bump ball exposed through an upper surface of the resin layer. The chip coated LED package further includes a package body having the electrode part and the light emitting chip mounted thereon. The invention improves light efficiency by preventing difference in color temperature according to irradiation angles, increases a yield, miniaturizes the package, and accommodates mass production.

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