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1. 发明授权

US09062851B2 LED lamp, LED illumination device, and LED module 有权
标题翻译： LED灯，LED照明装置和LED模块
公开(公告)号：US09062851B2
公开(公告)日：2015-06-23
申请号：US13575430
申请日：2011-02-16
申请人： Yoko Matsubayashi , Hiroshi Yagi , Masanori Shimizu , Yoshio Manabe , Atsushi Motoya , Kazuhiro Matsuo , Toshio Mori
发明人： Yoko Matsubayashi , Hiroshi Yagi , Masanori Shimizu , Yoshio Manabe , Atsushi Motoya , Kazuhiro Matsuo , Toshio Mori
IPC分类号： F21V9/16 , F21V3/04 , F21K99/00 , C09K11/77 , C03C3/00 , F21Y101/02 , H01L33/50 , F21Y103/00
CPC分类号： F21V3/0481 , C03C3/00 , C09K11/7774 , F21K9/232 , F21K9/27 , F21K9/64 , F21V3/12 , F21Y2103/10 , F21Y2115/10 , H01L33/504
摘要： An LED lamp provides a strong red color with a natural appearance. The LED lamp is provided with an LED module and a filter. The LED module includes a blue LED with a main emission peak in the 440 nm to 460 nm wavelength band, a green/yellow phosphor that is excited by light emitted by the blue LED, and a red phosphor that is excited by light emitted by at least one of the blue LED and the green/yellow phosphor. The filter reduces the spectral radiation intensity of at least a portion of the 570 nm to 590 nm wavelength band among light emitted by the LED module.
摘要翻译： LED灯提供强烈的红色，具有自然的外观。 LED灯具有LED模块和滤光片。 LED模块包括在440nm至460nm波长带中具有主发射峰的蓝色LED，由蓝色LED发射的光激发的绿色/黄色荧光体，以及由在其上发射的光激发的红色荧光体蓝色LED和绿色/黄色荧光粉中的至少一种。滤光器降低由LED模块发出的光之间的570nm至590nm波长带的至少一部分的光谱辐射强度。

2. 发明申请

US20120300432A1 LED LAMP, LED ILLUMINATION DEVICE, AND LED MODULE 有权
标题翻译： LED灯，LED照明装置和LED模块
公开(公告)号：US20120300432A1
公开(公告)日：2012-11-29
申请号：US13575430
申请日：2011-02-16
申请人： Yoko Matsubayashi , Hiroshi Yagi , Masanori Shimizu , Yoshio Manabe , Atsushi Motoya , Kazuhiro Matsuo , Toshio Mori
发明人： Yoko Matsubayashi , Hiroshi Yagi , Masanori Shimizu , Yoshio Manabe , Atsushi Motoya , Kazuhiro Matsuo , Toshio Mori
IPC分类号： F21V9/16
CPC分类号： F21V3/0481 , C03C3/00 , C09K11/7774 , F21K9/232 , F21K9/27 , F21K9/64 , F21V3/12 , F21Y2103/10 , F21Y2115/10 , H01L33/504
摘要： An LED lamp provides a strong red color with a natural appearance. The LED lamp is provided with an LED module and a filter. The LED module includes a blue LED with a main emission peak in the 440 nm to 460 nm wavelength band, a green/yellow phosphor that is excited by light emitted by the blue LED, and a red phosphor that is excited by light emitted by at least one of the blue LED and the green/yellow phosphor. The filter reduces the spectral radiation intensity of at least a portion of the 570 nm to 590 nm wavelength band among light emitted by the LED module.
摘要翻译： LED灯提供强烈的红色，具有自然的外观。 LED灯具有LED模块和滤光片。 LED模块包括在440nm至460nm波长带中具有主发射峰的蓝色LED，由蓝色LED发射的光激发的绿色/黄色荧光体，以及由在其上发射的光激发的红色荧光体蓝色LED和绿色/黄色荧光粉中的至少一种。滤光器降低由LED模块发出的光之间的570nm至590nm波长带的至少一部分的光谱辐射强度。

3. 发明授权

US08534857B2 Backlight apparatus, light source for backlight apparatus, and display apparatus using the same 失效
标题翻译：背光装置，背光装置用光源及使用其的显示装置
公开(公告)号：US08534857B2
公开(公告)日：2013-09-17
申请号：US12911553
申请日：2010-10-25
申请人： Masanori Shimizu , Yoko Matsubayashi , Hiroshi Yagi
发明人： Masanori Shimizu , Yoko Matsubayashi , Hiroshi Yagi
IPC分类号： F21K2/00 , H05B33/00 , F21K2/08
CPC分类号： F21K2/08 , G02F1/133603 , G02F1/133609 , G02F2001/133614 , G02F2001/133624 , H01L33/504 , H05B33/12
摘要： A backlight apparatus comprises a light source that is composed of a combination of a blue light emitting device, a green light emitting phosphor, and a red light emitting phosphor. The blue light emitting device has a peak intensity of a light emitting spectrum 3 to 19 times as high as the green light emitting phosphor.
摘要翻译：背光装置包括由蓝色发光装置，绿色发光荧光体和红色发光荧光体的组合构成的光源。蓝色发光元件的发光光谱的峰值强度为绿色发光荧光体的3〜19倍。

4. 发明申请

US20110096530A1 BACKLIGHT APPARATUS, LIGHT SOURCE FOR BACKLIGHT APPARATUS, AND DISPLAY APPARATUS USING THE SAME 失效
标题翻译：背光装置，背光装置用光源及使用其的显示装置
公开(公告)号：US20110096530A1
公开(公告)日：2011-04-28
申请号：US12911553
申请日：2010-10-25
申请人： Masanori Shimizu , Yoko Matsubayashi , Hiroshi Yagi
发明人： Masanori Shimizu , Yoko Matsubayashi , Hiroshi Yagi
IPC分类号： G02F1/13357 , F21V9/00
CPC分类号： F21K2/08 , G02F1/133603 , G02F1/133609 , G02F2001/133614 , G02F2001/133624 , H01L33/504 , H05B33/12
摘要： A backlight apparatus comprises a light source that is composed of a combination of a blue light emitting device, a green light emitting phosphor, and a red light emitting phosphor. The blue light emitting device has a peak intensity of a light emitting spectrum 3 to 19 times as high as the green light emitting phosphor.
摘要翻译：背光装置包括由蓝色发光装置，绿色发光荧光体和红色发光荧光体的组合构成的光源。蓝色发光元件的发光光谱的峰值强度为绿色发光荧光体的3〜19倍。

5. 发明申请

US20130286616A1 CIRCUIT DEVICE 有权
标题翻译：电路设备
公开(公告)号：US20130286616A1
公开(公告)日：2013-10-31
申请号：US13878724
申请日：2011-09-15
申请人： Takashi Shibasaki , Hidefumi Saito , Takahisa Makino , Masanori Shimizu , Daisuke Sasaki
发明人： Takashi Shibasaki , Hidefumi Saito , Takahisa Makino , Masanori Shimizu , Daisuke Sasaki
IPC分类号： H05K1/18
CPC分类号： H05K1/18 , H01L23/049 , H01L23/24 , H01L23/295 , H01L23/3107 , H01L23/3735 , H01L23/49811 , H01L23/49844 , H01L24/32 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/73 , H01L24/92 , H01L25/072 , H01L31/02021 , H01L2224/05553 , H01L2224/05554 , H01L2224/32225 , H01L2224/45014 , H01L2224/45015 , H01L2224/45124 , H01L2224/48091 , H01L2224/48137 , H01L2224/48139 , H01L2224/48227 , H01L2224/48247 , H01L2224/48472 , H01L2224/48699 , H01L2224/49111 , H01L2224/49175 , H01L2224/73265 , H01L2224/92247 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01023 , H01L2924/01029 , H01L2924/01033 , H01L2924/01074 , H01L2924/01082 , H01L2924/014 , H01L2924/1203 , H01L2924/1305 , H01L2924/13055 , H01L2924/13091 , H01L2924/14 , H01L2924/15787 , H01L2924/181 , H01L2924/19107 , Y02E10/50 , H01L2924/00012 , H01L2924/00 , H01L2224/85399 , H01L2224/05599
摘要： A circuit device having superior voltage resistance is provided. A structure is achieved that omits the resin layer that is normally provided to the top surface of a circuit board. Specifically, a ceramic substrate (22) is disposed on the top surface of a circuit board (12) comprising a metal, and a transistor (34) such as an IGBT is mounted to the top surface of the ceramic substrate (22). As a result, the transistor (34) and the circuit board (12) are insulated from each other by the ceramic substrate (22). The ceramic substrate (22), which comprises an inorganic material, has an extremely high voltage resistance compared to the conventionally used insulating layer comprising resin, and so even if a high voltage on the order of 1000V is applied to the transistor (34), short circuiting between the transistor (34) and the circuit board (12) is prevented.
摘要翻译：提供了具有优异的耐电压性的电路装置。实现省略通常设置到电路板的顶表面的树脂层的结构。具体而言，在包含金属的电路基板（12）的顶面设置有陶瓷基板（22），在陶瓷基板（22）的上表面安装有诸如IGBT的晶体管（34）。结果，晶体管（34）和电路板（12）通过陶瓷基板（22）彼此绝缘。包括无机材料的陶瓷基板（22）与常规使用的包含树脂的绝缘层相比具有极高的耐电压性，因此即使将大约1000V的高电压施加到晶体管（34），防止晶体管（34）与电路板（12）之间的短路。

6. 发明授权

US08405307B2 LED lamp 有权
标题翻译：点灯
公开(公告)号：US08405307B2
公开(公告)日：2013-03-26
申请号：US12836219
申请日：2010-07-14
申请人： Tadashi Yano , Masanori Shimizu , Kiyoshi Takahashi
发明人： Tadashi Yano , Masanori Shimizu , Kiyoshi Takahashi
IPC分类号： H05B33/00
CPC分类号： H01L33/44 , F21V19/001 , F21Y2115/10 , H01L33/52 , H01L33/54 , H01L2224/48091 , H01L2224/48247 , H01L2224/48257 , H01L2224/49107 , H01L2224/8592 , H01L2924/181 , H01L2924/00012 , H01L2924/00014
摘要： An LED lamp 100 includes: an LED chip 10; a phosphor resin portion 12 that covers the LED chip 10; and a light-transmissive member 20 that covers the phosphor resin portion 12. The phosphor resin portion 12 includes: a phosphor for converting the emission of the LED chip 10 into light that has a longer wavelength than the emission; and a resin in which the phosphor is dispersed. The surface of the light-transmissive member 20 includes an upper surface portion 22 located over the LED chip 10 and a side surface portion 24 located around and below the upper surface portion 22. At least a part (low-transmittance part 26) of the side surface portion 24 of the light-transmissive member 20 has lower transmittance than the upper surface portion 22.
摘要翻译： LED灯100包括：LED芯片10; 覆盖LED芯片10的荧光体树脂部12; 以及覆盖荧光体树脂部分12的透光构件20.荧光体树脂部分12包括：用于将LED芯片10的发射转换成具有比发射更长波长的光的荧光体; 和分散有荧光体的树脂。透光构件20的表面包括位于LED芯片10上的上表面部分22和位于上表面部分22周围和下方的侧表面部分24.至少一部分（低透射率部分26）透光性部件20的侧面部24的透过率比上表面部22低。

7. 发明授权

US07397177B2 LED lamp and method for manufacturing the same 有权
标题翻译： LED灯及其制造方法
公开(公告)号：US07397177B2
公开(公告)日：2008-07-08
申请号：US10932417
申请日：2004-09-02
申请人： Kiyoshi Takahashi , Masanori Shimizu , Tadashi Yano
发明人： Kiyoshi Takahashi , Masanori Shimizu , Tadashi Yano
IPC分类号： H01J1/62
CPC分类号： H01L33/505 , H01L33/54
摘要： An LED lamp includes at least one LED chip mounted on the principal surface of a substrate and an optical wavelength converting portion, which includes a phosphor for converting the emission of the LED chip into light having a longer wavelength than that of the emission and which covers at least a portion of the LED chip. The side surface of the optical wavelength converting portion has at least one concave curved surface portion.
摘要翻译： LED灯包括安装在基板的主表面上的至少一个LED芯片和光波长转换部分，其包括用于将LED芯片的发射转换成具有比发光的波长更长的波长的光的荧光体，至少一部分LED芯片。光波长转换部分的侧表面具有至少一个凹曲面部分。

8. 发明申请

US20070235748A1 LIGHTING DEVICE HAVING A LIGHTING UNIT WITH AN OPTICAL SEMICONDUCTOR BARE CHIP MOUNTED ON PRINTED WIRING BOARD 失效
标题翻译：具有安装在印刷电路板上的光学半导体裸片的照明装置的照明装置
公开(公告)号：US20070235748A1
公开(公告)日：2007-10-11
申请号：US11764098
申请日：2007-06-15
申请人： Tetsushi Tamura , Tatsumi Setomoto , Nobuyuki Matsui , Masanori Shimizu , Yoshihisa Yamashita
发明人： Tetsushi Tamura , Tatsumi Setomoto , Nobuyuki Matsui , Masanori Shimizu , Yoshihisa Yamashita
IPC分类号： H01L33/00
CPC分类号： H01L33/20 , H01L33/38 , H01L2924/0002 , H05K1/111 , H05K2201/09381 , H05K2201/094 , H05K2201/10106 , H05K2201/10636 , Y02P70/611 , H01L2924/00
摘要： A wiring board used for mounting an LED bare chip capable of firmly bonding the LED bare chip and improving yield. In a printed wiring board 2, a distance D between wiring patterns 81 and 85 disposed so as to oppose each other is the smallest at a position nearest to a center point (G) of an LED chip 14 disposed at a designed location, and increases with an increasing distance from the point G. In addition, pattern edges 83 and 87 of the wiring patterns 81 and 85 recede in the direction of widening the distance D as a distance from the center point G increases with respect to electrode edges 148 and 149 of the LED chip 14.
摘要翻译：用于安装LED裸芯片的布线板，能够牢固地接合LED裸芯片并提高产量。在印刷布线板2中，布置在彼此相对的布线图案81和85之间的距离D在最靠近布置在设计位置处的LED芯片14的中心点（G）的位置处最小，并且增加距离点G的距离增加。此外，布线图案81和85的图案边缘83和87随着距离中心点G的距离相对于电极边缘148和149而增加的方向后退。的LED芯片14。

9. 发明授权

US07250637B2 Card type LED illumination source 有权
标题翻译：卡式LED照明源
公开(公告)号：US07250637B2
公开(公告)日：2007-07-31
申请号：US11277952
申请日：2006-03-30
申请人： Masanori Shimizu , Tadashi Yano , Tatsumi Setomoto , Nobuyuki Matsui , Tetsushi Tamura
发明人： Masanori Shimizu , Tadashi Yano , Tatsumi Setomoto , Nobuyuki Matsui , Tetsushi Tamura
IPC分类号： H01L33/00
CPC分类号： F21V29/70 , F21K9/23 , F21L4/00 , F21L4/005 , F21L4/027 , F21S2/00 , F21S6/00 , F21S6/003 , F21V7/0083 , F21V19/003 , F21V19/045 , F21Y2103/33 , F21Y2105/00 , F21Y2105/10 , F21Y2115/10 , F21Y2115/15 , F21Y2115/20 , H01L24/97 , H01L25/0753 , H01L33/20 , H01L33/64 , H01L2224/05568 , H01L2224/05573 , H01L2224/16 , H01L2224/16225 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/48465 , H01L2224/49107 , H01L2924/00014 , H01L2924/01004 , H01L2924/01019 , H01L2924/01078 , H01L2924/01079 , H01L2924/07811 , H01L2924/09701 , H01L2924/12041 , H01L2924/15787 , H01L2924/181 , H01R12/714 , H01R33/225 , H05B33/0803 , H05B33/0821 , H05B33/0842 , H05B33/0863 , H05K1/05 , H05K1/112 , H05K1/117 , H05K2201/10106 , H01L2924/00 , H01L2224/05599
摘要： An LED illumination source comprises a heat dissipating substrate which includes a metal plate and at least two insulating layers thereon. LEI) bare chips are mounted on a surface of the substrate. An optical reflector with holes surrounds the LED bare chips. The optical reflector is provided on the surface of the substrate on which the LED bare chips are mounted. A resin encapsulates the entire optical reflector on the substrate, the resin molding each of the LED bare chips and functioning as an optical lens for each of the LED bare chips.
摘要翻译： LED照明源包括散热基板，其包括金属板和其上至少两个绝缘层。 LEI）裸芯片安装在基板的表面上。具有孔的光学反射器围绕LED裸芯片。光反射器设置在其上安装有LED裸芯片的基板的表面上。树脂将整个光学反射器封装在基板上，树脂模制每个LED裸芯片，并且用作每个LED裸芯片的光学透镜。

10. 发明授权

US07121486B1 Crusher 失效
标题翻译：破碎机
公开(公告)号：US07121486B1
公开(公告)日：2006-10-17
申请号：US10547486
申请日：2005-03-14
申请人： Masanori Shimizu
发明人： Masanori Shimizu
IPC分类号： B02C13/00
CPC分类号： B02C18/083 , B02C18/18 , B02C18/2216 , B02C2018/188 , B02C2201/066
摘要： A crusher for crushing cooked wood chips or the like finely. A raw material to be crushed such as the cooked wood chips is delivered into a housing and clamped between stationary blades attached to a stationary plate housed in the upper end of the housing and rotary blades attached to a rotary plate rotating in the housing, so that it is finely crushed by the stationary blades and the rotary blades by making use of the planer principle. The crushed products are carried in the air flow, which is generated around a guide vane disc, which rotates in a through hole formed in a substantially central portion of the stationary plate, and forcibly delivered from an exit in the housing side wall front portion inclined forward, to the outside of the housing.
摘要翻译：用于将熟木屑等细碎的破碎机。要被粉碎的原料如熟木片被输送到壳体中并且被夹持在附接到容纳在壳体的上端中的固定板的固定叶片和附接到在壳体中旋转的旋转板之间的旋转叶片之间，使得它通过利用平面原理由固定刀片和旋转刀片细碎。破碎的产品被携带在围绕导向叶片盘周围产生的空气流中，该导向叶片盘在形成在固定板的大致中央部分的通孔中旋转，并且从外壳侧壁前部的出口强制地输送倾斜前进到房屋外面。

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