专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明授权

US08927122B2 Substrate for suspension, process for producing the same, suspension for magnetic head, and hard disk drive 有权
标题翻译：用于悬挂的基板，其制造工艺，磁头悬挂和硬盘驱动器
公开(公告)号：US08927122B2
公开(公告)日：2015-01-06
申请号：US12528676
申请日：2008-04-14
申请人： Yoichi Hitomi , Shinji Kumon , Terutoshi Momose , Katsuya Sakayori , Kiyohiro Takachi , Yoichi Miura , Tsuyoshi Yamazaki
发明人： Yoichi Hitomi , Shinji Kumon , Terutoshi Momose , Katsuya Sakayori , Kiyohiro Takachi , Yoichi Miura , Tsuyoshi Yamazaki
IPC分类号： G11B5/60 , B05D5/12 , H05K1/05 , G11B5/48 , H05K3/28
CPC分类号： G11B5/4833 , C23F1/00 , C23F1/02 , C23F1/18 , C23F1/28 , G11B5/3103 , G11B5/3133 , G11B5/484 , G11B5/486 , H05K1/056 , H05K3/28 , H05K3/285 , Y10T428/11 , Y10T428/1157 , Y10T428/1179
摘要： A substrate for suspension comprises a metallic substrate, an insulating layer formed on the metallic substrate, a conductor layer formed on the insulating layer, and a cover layer covering the conductor layer. The insulating layer and the cover layer are formed from different materials, whose coefficients of hygroscopic expansion are in the range between 3×10−6/% RH and 30×10−6/% RH. The difference between the coefficients of hygroscopic expansion of the two materials is 5×10−6/% RH or less.
摘要翻译：用于悬浮的基板包括金属基板，形成在金属基板上的绝缘层，形成在绝缘层上的导体层和覆盖导体层的覆盖层。绝缘层和覆盖层由吸湿膨胀系数在3×10 -6 /％RH与30×10 -6 /％RH之间的不同材料形成。两种材料的吸湿膨胀系数之差为5×10-6 /％RH以下。

2. 发明申请

US20100047626A1 SUBSTRATE FOR SUSPENSION, PROCESS FOR PRODUCING THE SAME, SUSPENSION FOR MAGNETIC HEAD, AND HARD DISK DRIVE 有权
标题翻译：悬挂基材，其制造方法，磁头悬挂和硬盘驱动
公开(公告)号：US20100047626A1
公开(公告)日：2010-02-25
申请号：US12528676
申请日：2008-04-14
申请人： Yoichi Hitomi , Shinji Kumon , Terutoshi Momose , Katsuya Sakayori , Kiyohiro Takachi , Yoichi Miura , Tsuyoshi Yamazaki
发明人： Yoichi Hitomi , Shinji Kumon , Terutoshi Momose , Katsuya Sakayori , Kiyohiro Takachi , Yoichi Miura , Tsuyoshi Yamazaki
IPC分类号： G11B5/60 , B05D5/12 , G11B21/21 , G11B5/33 , G11B5/62 , G03F7/20
CPC分类号： G11B5/4833 , C23F1/00 , C23F1/02 , C23F1/18 , C23F1/28 , G11B5/3103 , G11B5/3133 , G11B5/484 , G11B5/486 , H05K1/056 , H05K3/28 , H05K3/285 , Y10T428/11 , Y10T428/1157 , Y10T428/1179
摘要： A substrate for suspension 10 comprises a metallic substrate 1, an insulating layer 2 formed on the metallic substrate 1, a conductor layer 3 formed on the insulating layer 2, and a cover layer 4 covering the conductor layer 3. The insulating layer 2 and the cover layer 4 are formed from different materials, whose coefficients of hygroscopic expansion are in the range between 3×10−6/% RH and 30×10−6/% RH. The difference between the coefficients of hygroscopic expansion of the two materials is 5×10−6/% RH or less.
摘要翻译：用于悬架10的基板包括金属基板1，形成在金属基板1上的绝缘层2，形成在绝缘层2上的导体层3和覆盖导体层3的覆盖层4.绝缘层2和覆盖层4由吸湿膨胀系数在3×10 -6 /％RH与30×10 -6 /％RH之间的不同材料形成。两种材料的吸湿膨胀系数之差为5×10-6 /％RH以下。

3. 发明授权

US08097811B2 Substrate for suspension 有权
标题翻译：底物悬浮
公开(公告)号：US08097811B2
公开(公告)日：2012-01-17
申请号：US12062730
申请日：2008-04-04
申请人： Yoichi Hitomi , Hiroaki Miyazawa , Shinji Kumon , Terutoshi Momose
发明人： Yoichi Hitomi , Hiroaki Miyazawa , Shinji Kumon , Terutoshi Momose
IPC分类号： H05K1/00 , H05K1/02
CPC分类号： G06F1/182 , G11B5/40 , G11B5/484 , G11B5/4853 , H05K1/0215 , H05K1/056 , H05K1/116 , H05K3/44 , H05K2201/09463 , H05K2201/09554
摘要： A substrate for suspension comprises a metallic substrate, an insulating layer formed on the metallic substrate, having an opening for grounding terminal, and a grounding conductor formed on the insulating layer. A grounding-terminal-forming material is placed in the opening for grounding terminal to form a grounding terminal that connects the metallic substrate and the grounding conductor. The grounding conductor does not surround a portion of the circumference of the opening for grounding terminal.
摘要翻译：悬浮基板包括金属基板，形成在金属基板上的绝缘层，具有用于接地端子的开口和形成在绝缘层上的接地导体。接地端子形成材料放置在接地端子的开口中，形成连接金属基板和接地导体的接地端子。接地导体不包围用于接地端子的开口的圆周的一部分。

4. 发明授权

US08399774B2 Substrate for suspension 有权
标题翻译：底物悬浮
公开(公告)号：US08399774B2
公开(公告)日：2013-03-19
申请号：US13303769
申请日：2011-11-23
申请人： Yoichi Hitomi , Hiroaki Miyazawa , Shinji Kumon , Terutoshi Momose
发明人： Yoichi Hitomi , Hiroaki Miyazawa , Shinji Kumon , Terutoshi Momose
IPC分类号： H05K1/00 , H05K1/02
CPC分类号： G06F1/182 , G11B5/40 , G11B5/484 , G11B5/4853 , H05K1/0215 , H05K1/056 , H05K1/116 , H05K3/44 , H05K2201/09463 , H05K2201/09554
摘要： A substrate for suspension comprises a metallic substrate, an insulating layer formed on the metallic substrate, having an opening for grounding terminal, and a grounding conductor formed on the insulating layer. A grounding-terminal-forming material is placed in the opening for grounding terminal to form a grounding terminal that connects the metallic substrate and the grounding conductor. The grounding conductor does not surround a portion of the circumference of the opening for grounding terminal.
摘要翻译：悬浮基板包括金属基板，形成在金属基板上的绝缘层，具有用于接地端子的开口和形成在绝缘层上的接地导体。接地端子形成材料放置在接地端子的开口中，形成连接金属基板和接地导体的接地端子。接地导体不包围用于接地端子的开口的圆周的一部分。

5. 发明申请

US20080247131A1 SUBSTRATE FOR SUSPENSION 有权
标题翻译：暂停基准
公开(公告)号：US20080247131A1
公开(公告)日：2008-10-09
申请号：US12062730
申请日：2008-04-04
申请人： Yoichi Hitomi , Hiroaki Miyazawa , Shinji Kumon , Terutoshi Momose
发明人： Yoichi Hitomi , Hiroaki Miyazawa , Shinji Kumon , Terutoshi Momose
IPC分类号： G06F1/16
CPC分类号： G06F1/182 , G11B5/40 , G11B5/484 , G11B5/4853 , H05K1/0215 , H05K1/056 , H05K1/116 , H05K3/44 , H05K2201/09463 , H05K2201/09554
摘要： A substrate for suspension 10 comprises a metallic substrate 1, an insulating layer 2 formed on the metallic substrate 1, having an opening for grounding terminal 3, and a grounding conductor 4 formed on the insulating layer 2. A grounding-terminal-forming material 5 is placed in the opening for grounding terminal 3 to form a grounding terminal 7 that connects the metallic substrate 1 and the grounding conductor 4. The grounding conductor 4 does not surround a portion 8 of the circumference of the opening for grounding terminal 3.
摘要翻译：用于悬架10的基板包括金属基板1，形成在金属基板1上的具有接地端子3的开口的绝缘层2和形成在绝缘层2上的接地导体4。接地端子形成材料5放置在接地端子3的开口中，以形成连接金属基板1和接地导体4的接地端子7。接地导体4不包围用于接地端子3的开口的圆周的部分8。

6. 发明授权

US08040634B2 Magnetic head suspension 有权
标题翻译：磁头悬挂
公开(公告)号：US08040634B2
公开(公告)日：2011-10-18
申请号：US12307298
申请日：2006-07-14
申请人： Hiroaki Miyazawa , Terutoshi Momose , Yoichi Hitomi , Tsuyoshi Yamazaki
发明人： Hiroaki Miyazawa , Terutoshi Momose , Yoichi Hitomi , Tsuyoshi Yamazaki
IPC分类号： G11B5/48
CPC分类号： H05K1/0219 , G11B5/484 , G11B5/4853 , H05K1/0215 , H05K1/056 , H05K3/421 , H05K3/44 , H05K2201/09509 , H05K2201/09554
摘要： A magnetic head suspension having a thin metallic plate as a substrate which is caused to have a new function besides a function as a spring. The magnetic head suspension plural lines for connecting a magnetic head and a control circuit board to each other are formed over a thin metallic plate having a spring property through an insulating layer, and are integrated with the thin metallic plate A metallic pad made of a same metal layer as the plural lines is formed independently of the lines, an opening is made in a portion of the metallic pad to penetrate the insulating layer and then to reach the thin metallic plate, and an electroconductive region is formed into the opening by metal plating, thereby connecting the metallic pad and the thin metallic plate electrically to each other. Thereby, the desired portions of the suspension can be grounded through this simple structure without adopting a complicated structure wherein additional special lines for grounding are not separately laid besides the lines, which are lines for connecting a magnetic head and a control circuit board to each other.
摘要翻译：具有作为基板的薄金属板的磁头悬架，除了作为弹簧的功能之外还具有新的功能。用于将磁头和控制电路板彼此连接的多个磁头悬挂在通过绝缘层具有弹性的薄金属板上形成，并与金属板一体形成由其制成的金属垫作为多行的金属层独立于线形成，在金属垫的一部分上形成开口以穿透绝缘层，然后到达金属薄板，并且通过金属电镀形成导电区域到开口中从而将金属垫和薄金属板彼此电连接。因此，通过这种简单的结构，悬架的期望部分可以通过这种简单的结构接地，而不采用复杂的结构，其中除了用于将磁头和控制电路板彼此连接的线之外的线之外，不需要分开附加的附加专用线。

7. 发明申请

US20090310260A1 MAGNETIC HEAD SUSPENSION 有权
标题翻译：磁头悬挂
公开(公告)号：US20090310260A1
公开(公告)日：2009-12-17
申请号：US12307298
申请日：2006-07-14
申请人： Hiroaki Miyazawa , Terutoshi Momose , Yoichi Hitomi , Tsuyoshi Yamazaki
发明人： Hiroaki Miyazawa , Terutoshi Momose , Yoichi Hitomi , Tsuyoshi Yamazaki
IPC分类号： G11B21/16 , C23F1/00 , C25D5/34
CPC分类号： H05K1/0219 , G11B5/484 , G11B5/4853 , H05K1/0215 , H05K1/056 , H05K3/421 , H05K3/44 , H05K2201/09509 , H05K2201/09554
摘要： A magnetic head suspension having a thin metallic plate as a substrate which is caused to have a new function besides a function as a spring. The magnetic head suspension plural lines for connecting a magnetic head and a control circuit board to each other are formed over a thin metallic plate having a spring property through an insulating layer, and are integrated with the thin metallic plate A metallic pad made of a same metal layer as the plural lines is formed independently of the lines, an opening is made in a portion of the metallic pad to penetrate the insulating layer and then to reach the thin metallic plate, and an electroconductive region is formed into the opening by metal plating, thereby connecting the metallic pad and the thin metallic plate electrically to each other. Thereby, the desired portions of the suspension can be grounded through this simple structure without adopting a complicated structure wherein additional special lines for grounding are not separately laid besides the lines, which are lines for connecting a magnetic head and a control circuit board to each other.
摘要翻译：具有作为基板的薄金属板的磁头悬架，除了作为弹簧的功能之外还具有新的功能。用于将磁头和控制电路板彼此连接的多个磁头悬挂在通过绝缘层具有弹性的薄金属板上形成，并且与金属板一体形成由其制成的金属垫作为多条线的金属层独立于线形成，在金属垫的一部分上形成开口以穿透绝缘层，然后到达薄金属板，并且通过金属电镀形成导电区域到开口中从而将金属垫和薄金属板彼此电连接。因此，通过这种简单的结构，悬架的期望部分可以通过这种简单的结构接地，而不采用复杂的结构，其中除了用于将磁头和控制电路板彼此连接的线之外的线之外，不需要分开布置附加的接地专用线。

8. 发明授权

US08198726B2 Through-hole electrode substrate and method of manufacturing the same 有权
标题翻译：通孔电极基板及其制造方法
公开(公告)号：US08198726B2
公开(公告)日：2012-06-12
申请号：US12628712
申请日：2009-12-01
申请人： Koichi Nakayama , Yoichi Hitomi , Takamasa Takano
发明人： Koichi Nakayama , Yoichi Hitomi , Takamasa Takano
IPC分类号： H01L21/00
CPC分类号： H01L23/147 , H01L21/486 , H01L23/481 , H01L23/49827 , H01L24/03 , H01L24/05 , H01L2224/0557 , H01L2224/05599 , H01L2224/05644 , H01L2224/05647 , H01L2224/05655 , H01L2924/00014 , H01L2924/0002 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01014 , H01L2924/01022 , H01L2924/01029 , H01L2924/01033 , H01L2924/01078 , H01L2924/01079 , H01L2924/014 , H01L2924/14 , H05K3/423 , H05K3/426 , H05K3/445 , H05K2201/0347 , H05K2201/09563 , H05K2201/09909 , H05K2203/1178 , H01L2224/05552
摘要： A through-hole electrode substrate related to an embodiment of the present invention is arranged with a semiconductor substrate having a plurality of through-holes, an insulating layer formed with an insulating material on the inner walls of the plurality of through-holes and on at least one surface of the semiconductor substrate, a plurality of through-hole electrodes formed with a metal material inside the through-hole, and a plurality of gas discharge parts formed to contact with each of the plurality of through-hole electrodes which is exposed on at least one surface of the semiconductor substrate, the plurality of gas discharge parts externally discharges gas which is discharged from the inside of the plurality of through-hole electrodes.
摘要翻译：与本发明的实施方式相关的贯通孔电极基板，配置有具有多个通孔的半导体基板，在多个贯通孔的内壁上形成有绝缘材料的绝缘层，半导体衬底的至少一个表面，在通孔内部形成有金属材料的多个通孔电极，以及多个气体放电部分，形成为与暴露在多个通孔电极中的每一个通孔电极半导体衬底的至少一个表面，多个气体放电部件从多个通孔电极的内部排出从外部排出的气体。

9. 发明授权

US06201292B1 Resin-sealed semiconductor device, circuit member used therefor 失效
标题翻译：树脂密封半导体器件，用于其的电路元件
公开(公告)号：US06201292B1
公开(公告)日：2001-03-13
申请号：US09052984
申请日：1998-04-01
申请人： Hiroshi Yagi , Yoichi Hitomi , Makoto Nakamura , Masato Sasaki
发明人： Hiroshi Yagi , Yoichi Hitomi , Makoto Nakamura , Masato Sasaki
IPC分类号： H01L23495
CPC分类号： H01L23/49548 , H01L21/4828 , H01L23/4951 , H01L24/45 , H01L24/48 , H01L24/49 , H01L2221/68377 , H01L2224/05554 , H01L2224/32057 , H01L2224/32245 , H01L2224/45144 , H01L2224/48091 , H01L2224/48247 , H01L2224/48257 , H01L2224/4826 , H01L2224/48475 , H01L2224/49171 , H01L2224/73215 , H01L2224/73265 , H01L2224/83385 , H01L2224/85051 , H01L2924/01019 , H01L2924/01046 , H01L2924/01078 , H01L2924/01079 , H01L2924/07802 , H01L2924/1433 , H01L2924/15311 , H01L2924/181 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： There is disclosed a resin-sealed semiconductor device in which plural terminal portions each integrally having an inner terminal on a surface and an outer terminal on a rear face are arranged two-dimensionally substantially in a plane electrically independent of one another. A die pad is electrically independently disposed in a substantially middle portion in the plane where the terminal portions are arranged two-dimensionally. A semiconductor element is mounted on the die pad. The inner terminals of the terminal portions are electrically connected via wires to terminals of the semiconductor element, and the entirety is sealed with a resin in such a manner that the outer terminals of the terminal portions are partially exposed to the outside. Therefore, an occupancy ratio of the semiconductor element in the semiconductor device is increased. The semiconductor device can be miniaturized. The mounting density onto a circuit substrate can be enhanced. Also, by forming outer electrodes on the outer terminals, different from the conventional TSOP or another small-sized semiconductor device, multiple pins can be easily provided.
摘要翻译：公开了一种树脂密封半导体器件，其中，在表面上一体地具有内部端子和后表面上的外部端子的多个端子部分基本上彼此平行地布置在彼此电独立的平面中。芯片焊盘电气地独立地设置在端子部分被二维布置的平面中的大致中间部分中。半导体元件安装在管芯焊盘上。端子部分的内部端子经由导线电连接到半导体元件的端子，并且整体用树脂密封，使得端子部分的外部端部部分地暴露于外部。因此，半导体器件中的半导体元件的占有率增加。可以使半导体器件小型化。可以提高电路基板上的安装密度。此外，通过在外部端子上形成外部电极，与常规TSOP或另一小型半导体器件不同，可以容易地提供多个引脚。

10. 发明授权

US08623751B2 Through-hole electrode substrate and method of manufacturing the same 有权
标题翻译：通孔电极基板及其制造方法
公开(公告)号：US08623751B2
公开(公告)日：2014-01-07
申请号：US13466514
申请日：2012-05-08
申请人： Koichi Nakayama , Yoichi Hitomi , Takamasa Takano
发明人： Koichi Nakayama , Yoichi Hitomi , Takamasa Takano
IPC分类号： H01L21/02
CPC分类号： H01L23/147 , H01L21/486 , H01L23/481 , H01L23/49827 , H01L24/03 , H01L24/05 , H01L2224/0557 , H01L2224/05599 , H01L2224/05644 , H01L2224/05647 , H01L2224/05655 , H01L2924/00014 , H01L2924/0002 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01014 , H01L2924/01022 , H01L2924/01029 , H01L2924/01033 , H01L2924/01078 , H01L2924/01079 , H01L2924/014 , H01L2924/14 , H05K3/423 , H05K3/426 , H05K3/445 , H05K2201/0347 , H05K2201/09563 , H05K2201/09909 , H05K2203/1178 , H01L2224/05552
摘要： A through-hole electrode substrate related to an embodiment of the present invention is arranged with a semiconductor substrate having a plurality of through-holes, an insulating layer formed with an insulating material on the inner walls of the plurality of through-holes and on at least one surface of the semiconductor substrate, a plurality of through-hole electrodes formed with a metal material inside the through-hole, and a plurality of gas discharge parts formed to contact with each of the plurality of through-hole electrodes which is exposed on at least one surface of the semiconductor substrate, the plurality of gas discharge parts externally discharges gas which is discharged from the inside of the plurality of through-hole electrodes.
摘要翻译：与本发明的实施方式相关的贯通孔电极基板，配置有具有多个通孔的半导体基板，在多个贯通孔的内壁上形成有绝缘材料的绝缘层，半导体衬底的至少一个表面，在通孔内部形成有金属材料的多个通孔电极，以及多个气体放电部分，形成为与暴露在多个通孔电极中的每一个通孔电极半导体衬底的至少一个表面，多个气体放电部件从多个通孔电极的内部排出从外部排出的气体。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式