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1. 发明授权

US5611279A Process of producing a printing plate for a stamp 失效
标题翻译：生产印章印版的工艺
公开(公告)号：US5611279A
公开(公告)日：1997-03-18
申请号：US454252
申请日：1995-06-02
申请人： Yoichi Ando , Fumitoshi Nakamura , Haruhito Shiraishi , Hajime Toda , Susumu Suzuki , Koichi Hirano , Hisami Tamano
发明人： Yoichi Ando , Fumitoshi Nakamura , Haruhito Shiraishi , Hajime Toda , Susumu Suzuki , Koichi Hirano , Hisami Tamano
IPC分类号： B41C1/055 , B41K1/50
CPC分类号： B41C1/055
摘要： A stamp and a process of producing a stamp includes a stamp that is made from a sponge having open cells to allow repeated impressing operations without supplying stamp ink for a long time. The process includes fitting a heat-fusing ink sheet or a heat-generating plate, which contains a heat-generating material, over the surface of a stamp-piece that has open cells therein. A liquid substance soaks a manuscript having characters, patterns, etc., which are represented by non-applied areas of recording material. The manuscript is placed over the top in such a manner that an image may appear to be a mirror image. The manuscript is irradiated from above with light to cause light to pass through the non-applied areas of recording material to increase the temperature of the heat-generating material at sites corresponding to the non-applied areas of recording material. The generated heat of the heat-generating material corresponding to the non-applied portion of recording material fuses that part of the surface of the stamp-piece, thereby forming non-oozing areas of stamp ink while the stamp surface portion corresponding to the applied areas of recording material is not fused, thus forming oozing areas of stamp ink.
摘要翻译： PCT No.PCT / JP94 / 01640 Sec。 371日期：1995年6月2日 102（e）1995年6月2日PCT 1994年9月30日PCT PCT。出版物WO94 / 01640 日期1994年9月30日印章和制作邮票的过程包括由具有开放细胞的海绵制成的邮票，以允许重复打印操作，而长时间不提供印墨。该方法包括在其中具有开孔的印模件的表面上装配热熔油墨片或包含发热材料的发热板。液体物质浸透由不适用的记录材料区域表示的具有字符，图案等的原稿。手稿放置在顶部，使得图像可能看起来是镜像。从上面用光照射原稿，使光线通过记录材料的非涂敷区域，以增加与不施加记录材料区域对应的位置处的发热材料的温度。对应于记录材料的未施加部分的发热材料的产生的热量使得印模件的表面的一部分熔化，从而在对应于涂覆区域的印模表面部分形成印墨油墨的非渗出区域的记录材料不熔化，从而形成印墨的渗出区域。

2. 发明授权

US5741459A Process for preparing stamp 失效
公开(公告)号：US5741459A
公开(公告)日：1998-04-21
申请号：US365124
申请日：1994-12-28
申请人： Yoichi Ando , Hajime Toda , Koichi Hirano , Hisami Tamano
发明人： Yoichi Ando , Hajime Toda , Koichi Hirano , Hisami Tamano
IPC分类号： B29C44/56 , B29C59/02 , B41D7/00 , B41K1/00 , B41K1/02
CPC分类号： B41D7/00 , B29C44/5636 , B29C59/02 , B41K1/00 , B41K1/02 , B29K2105/04
摘要： On the surface of an ink-permeable sponge material having open cells, a melted portion and an unmelted portion are formed by a thermal head printer controlled by a memory processor for desired imprint data to prepare a stamp having the unmelted portion as an ink oozing imprint surface. Furthermore, a stamp material plate comprising the tape-like sponge material is wound up in the form of a roll and then received in a cassette case, and a stamp material cartridge comprising this cassette case is mounted in a cartridge receiving section of the thermal printer capable of printing in a tape form. A print image set by input from a keyboard or external input is printed on the stamp material comprising the sponge material fed from the cartridge by the thermal head, while the stamp material is pressed, to form a concave having a depth of 0.01 mm or more, thereby preparing a print plate for a stamp having a suitable length. A process for preparing a stamp of the present invention comprises simple steps, and therefore the high-quality stamp can be promptly provided.

3. 发明授权

US5878668A Process for preparing stamp 失效
标题翻译：制作邮票的过程
公开(公告)号：US5878668A
公开(公告)日：1999-03-09
申请号：US888189
申请日：1997-07-03
申请人： Yoichi Ando , Hajime Toda , Koichi Hirano , Hisami Tamano
发明人： Yoichi Ando , Hajime Toda , Koichi Hirano , Hisami Tamano
IPC分类号： B29C44/56 , B29C59/02 , B41D7/00 , B41K1/00 , B41K1/02 , B41K1/50
CPC分类号： B41D7/00 , B29C44/5636 , B29C59/02 , B41K1/00 , B41K1/02 , B29K2105/04
摘要： On the surface of an ink-permeable sponge material having open cells, a melted portion and an unmelted portion are formed by a thermal head printer controlled by a memory processor for desired imprint data to prepare a stamp having the unmelted portion as an ink oozing imprint surface. Furthermore, a stamp material plate comprising the tape-like sponge material is wound up in the form of a roll and then received in a cassette case, and a stamp material cartridge comprising this cassette case is mounted in a cartridge receiving section of the thermal printer capable of printing in a tape form. A print image set by input from a keyboard or external input is printed on the stamp material comprising the sponge material fed from the cartridge by the thermal head, while the stamp material is pressed, to form a concave having a depth of 0.01 mm or more, thereby preparing a print plate for a stamp having a suitable length.A process for preparing a stamp of the present invention comprises simple steps, and therefore the high-quality stamp can be promptly provided.
摘要翻译：在具有开孔的透墨海绵材料的表面上，通过由存储处理器控制的热打印机打印机形成熔融部分和未熔化部分，以获得所需的印迹数据，以制备具有未熔化部分作为油墨渗色印迹的印模表面。此外，包括带状海绵材料的印模材料板以卷的形式卷绕，然后被接收在盒式磁带盒中，并且包括该盒壳体的印模材料盒安装在热敏打印机的盒接收部分中能够以磁带形式打印。通过来自键盘或外部输入的输入设置的打印图像被印刷在包括通过热敏头从墨盒供给的海绵材料的印模材料上，同时压印印模材料，以形成深度为0.01mm或更大的凹部从而制备具有合适长度的印模的印版。制备本发明的印模的方法包括简单的步骤，因此能够迅速地提供高质量的印记。

4. 发明授权

US5669299A Method for preparing a thermosensitive stencil with a thermal label printer 失效
标题翻译：用热标签打印机制备热敏模板的方法
公开(公告)号：US5669299A
公开(公告)日：1997-09-23
申请号：US698753
申请日：1996-08-16
申请人： Yoichi Ando , Koichi Hirano
发明人： Yoichi Ando , Koichi Hirano
IPC分类号： B41C1/055 , B41J2/32 , B41J3/407 , B41N1/24 , B41L13/00
CPC分类号： B41J2/32 , B41J3/4075
摘要： A cartridge containing a thermosensitive stencil original comprising a tape-formed thermosensitive stencil original which is to be perforated to create a print image, a pressing member for pressing the thermosensitive stencil original, and a cassette case having the pressing member disposed therein. The thermosensitive stencil original is also accommodated inside the cassette case so that the stencil original may be carried out from the cartridge. The mirror image of the desired print image is perforated onto the surface of the thermosensitive stencil original.
摘要翻译：包含热敏蜡纸原稿的墨盒，包括要被打孔以形成打印图像的带状热敏模版原件，用于按压热敏模版原件的按压部件以及设置有按压部件的盒壳体。热敏模版原件也被容纳在盒壳体内，使得模板原件可以从盒中进行。所需打印图像的镜像穿孔在热敏模版原件的表面上。

5. 发明授权

US08617943B2 Method for making a semiconductor device on a flexible substrate 有权
标题翻译：在柔性基板上制造半导体器件的方法
公开(公告)号：US08617943B2
公开(公告)日：2013-12-31
申请号：US12746440
申请日：2009-07-22
申请人： Takashi Ichiryu , Seiichi Nakatani , Koichi Hirano , Yoshihisa Yamashita , Shingo Komatsu
发明人： Takashi Ichiryu , Seiichi Nakatani , Koichi Hirano , Yoshihisa Yamashita , Shingo Komatsu
IPC分类号： H01L21/00
CPC分类号： H01L29/78603 , H01L24/19 , H01L24/82 , H01L27/1218 , H01L29/66765 , H01L29/78609 , H01L29/78681 , H01L29/7869 , H01L51/0024 , H01L51/003 , H01L51/0097 , H01L51/0541 , H01L51/0545 , H01L2221/68377 , H01L2224/04105 , H01L2224/73267 , H01L2224/76155 , H01L2224/82039 , H01L2224/82102 , H01L2224/92144 , H01L2224/92244 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01019 , H01L2924/0102 , H01L2924/01029 , H01L2924/0103 , H01L2924/01032 , H01L2924/01033 , H01L2924/01038 , H01L2924/0104 , H01L2924/01047 , H01L2924/01049 , H01L2924/01056 , H01L2924/01057 , H01L2924/01072 , H01L2924/01073 , H01L2924/01078 , H01L2924/01082 , H01L2924/04941 , H01L2924/04953 , H01L2924/10329 , H01L2924/12042 , H01L2924/15788 , H01L2924/19041 , H01L2924/30105 , H01L2924/00
摘要： A method for fabricating a flexible semiconductor device includes: preparing a layered film 80 including a first metal layer 10, an inorganic insulating layer 20, a semiconductor layer 30, and a second metal layer 40 which are sequentially formed; etching the first metal layer 10 to form a gate electrode 12g; compression bonding a resin layer 50 to a surface of the layered film 80 provided with the gate electrode 12g to allow the gate electrode 12g to be embedded in the resin layer 50; and etching the second metal layer 40 to form a source electrode 42s and a drain electrode 42d, wherein the inorganic insulating layer 20 on the gate electrode 12g functions as a gate insulating film 22, and the semiconductor layer 30 between the source electrode 42s and drain electrode 42d on the inorganic insulating layer 20 functions as a channel 32.
摘要翻译：一种制造柔性半导体器件的方法包括：制备包括依次形成的第一金属层10，无机绝缘层20，半导体层30和第二金属层40的层状膜80; 蚀刻第一金属层10以形成栅电极12g; 将树脂层50压接到设置有栅电极12g的层叠膜80的表面，以使栅电极12g嵌入树脂层50中; 并且蚀刻第二金属层40以形成源电极42s和漏电极42d，其中栅电极12g上的无机绝缘层20用作栅极绝缘膜22，并且源电极42s和漏极之间的半导体层30 无机绝缘层20上的电极42d用作通道32。

6. 发明授权

US08525178B2 Flexible semiconductor device and method for producing the same 有权
标题翻译：柔性半导体器件及其制造方法
公开(公告)号：US08525178B2
公开(公告)日：2013-09-03
申请号：US13498700
申请日：2011-04-14
申请人： Takashi Ichiryu , Seiichi Nakatani , Koichi Hirano
发明人： Takashi Ichiryu , Seiichi Nakatani , Koichi Hirano
IPC分类号： H01L29/04
CPC分类号： H01L29/7869 , H01L27/1225 , H01L27/124 , H01L27/1262 , H01L27/1292 , H01L27/3244 , H01L29/78603 , H01L2251/5338
摘要： A flexible semiconductor device includes an insulating film on which a semiconductor element is formed. The top and bottom surfaces of the insulating film have a top wiring pattern layer and a bottom wiring pattern layer, respectively. The semiconductor element includes a semiconductor layer formed on the top surface of the insulating film, a source electrode and a drain electrode formed on the top surface of the insulating film so as to contact the semiconductor layer, and a gate electrode formed on the bottom surface of the insulating film so as to be opposite the semiconductor layer. A first thickness, which is the thickness of the insulating film facing the source electrode, the drain electrode, the top wiring pattern layer, and the bottom wiring pattern layer, is greater than a second thickness, which is the thickness of the insulating film between the gate electrode and the semiconductor layer.
摘要翻译：柔性半导体器件包括其上形成有半导体元件的绝缘膜。绝缘膜的顶表面和底表面分别具有顶部布线图案层和底部布线图案层。半导体元件包括形成在绝缘膜的顶表面上的半导体层，形成在绝缘膜的顶表面上以与半导体层接触的源电极和漏电极，以及形成在底表面上的栅电极的绝缘膜与半导体层相对。作为与源极电极，漏极电极，顶部布线图案层和底部布线图案层相对的绝缘膜的厚度的第一厚度大于第二厚度，其是第二厚度，其是绝缘膜的厚度栅电极和半导体层。

7. 发明申请

US20130032797A1 FIELD-EFFECT TRANSISTOR AND METHOD FOR MANUFACTURING THE SAME 有权
标题翻译：场效应晶体管及其制造方法
公开(公告)号：US20130032797A1
公开(公告)日：2013-02-07
申请号：US13641793
申请日：2011-12-19
申请人： Koichi Hirano , Shingo Komatsu , Yasuteru Saito , Naoki Ike
发明人： Koichi Hirano , Shingo Komatsu , Yasuteru Saito , Naoki Ike
IPC分类号： H01L21/336 , H01L29/786
CPC分类号： H01L29/7869 , H01L29/66742 , H01L29/66969 , H01L29/78693
摘要： The present invention achieves a formation of a metal oxide film of a thin film transistor with a simplified process. The present invention is concerned with a method for manufacturing a field-effect transistor comprising a gate electrode, a source electrode, a drain electrode, a channel layer and a gate insulating layer wherein the channel layer is formed by using a metal salt-containing composition comprising a metal salt, a polyvalent carboxylic acid having a cis-form structure of —C(COOH)═C(COOH)—, an organic solvent and a water wherein a molar ratio of the polyvalent carboxylic acid to the metal salt is in the range of 0.5 to 4.0.
摘要翻译：本发明通过简化的工艺实现了薄膜晶体管的金属氧化物膜的形成。本发明涉及一种制造场效应晶体管的方法，该场效应晶体管包括栅电极，源电极，漏电极，沟道层和栅极绝缘层，其中通过使用含金属盐的组合物形成沟道层包括金属盐，具有-C（COOH）= C（COOH） - 的顺式结构的多元羧酸，有机溶剂和水，其中多价羧酸与金属盐的摩尔比为范围为0.5至4.0。

8. 发明授权

US07910403B2 Metal particles-dispersed composition and flip chip mounting process and bump-forming process using the same 有权
标题翻译：金属颗粒分散组合物和倒装芯片安装工艺以及使用其的凸块形成工艺
公开(公告)号：US07910403B2
公开(公告)日：2011-03-22
申请号：US11885562
申请日：2006-03-06
申请人： Koichi Hirano , Seiji Karashima , Takashi Ichiryu , Yoshihiro Tomita
发明人： Koichi Hirano , Seiji Karashima , Takashi Ichiryu , Yoshihiro Tomita
IPC分类号： H01L21/00
CPC分类号： H01L24/81 , H01L21/6835 , H01L23/49883 , H01L24/11 , H01L24/12 , H01L24/16 , H01L2224/0554 , H01L2224/05568 , H01L2224/05573 , H01L2224/11003 , H01L2224/11005 , H01L2224/1141 , H01L2224/1152 , H01L2224/11524 , H01L2224/13099 , H01L2224/16 , H01L2224/293 , H01L2224/294 , H01L2224/73104 , H01L2224/83886 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01011 , H01L2924/01013 , H01L2924/01015 , H01L2924/01019 , H01L2924/01023 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01047 , H01L2924/0105 , H01L2924/01051 , H01L2924/01056 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/09701 , H01L2924/14 , H01L2924/15787 , H01L2924/15788 , H05K3/323 , H05K3/3484 , H05K2201/10977 , H05K2203/0425 , H05K2203/087 , H05K2203/1178 , H01L2924/00 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556
摘要： A flip chip mounting process wherein a semiconductor chip and a circuit substrate are electrically interconnected. The process includes the steps of preparing a semiconductor chip on which a first plurality of electrodes are formed and a circuit substrate on which a second plurality of electrodes are formed; supplying a composition onto a surface of the circuit substrate, such surface being provided with second plurality of electrodes; bringing the semiconductor chip into contact with a surface of said composition such that the first plurality of electrodes are opposed to the second plurality of electrodes; and heating the circuit substrate, and thereby electrical connections including a metal component constituting the metal particles dispersed in the composition are formed between the first plurality of electrodes and the second plurality of electrodes. Also, a thermoset resin layer is formed between the semiconductor chip and the circuit substrate.
摘要翻译：一种倒装芯片安装工艺，其中半导体芯片和电路基板电连接。该方法包括制备其上形成有第一多个电极的半导体芯片和形成有第二多个电极的电路基板的步骤; 在电路基板的表面上提供组合物，该表面设置有第二多个电极; 使所述半导体芯片与所述组合物的表面接触，使得所述第一多个电极与所述第二多个电极相对; 并且加热电路基板，从而在第一多个电极和第二多个电极之间形成包括构成分散在组合物中的金属颗粒的金属组分的电连接。此外，在半导体芯片和电路基板之间形成热固性树脂层。

9. 发明申请

US20110042677A1 FLEXIBLE SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME 有权
标题翻译：柔性半导体器件及其制造方法
公开(公告)号：US20110042677A1
公开(公告)日：2011-02-24
申请号：US12863202
申请日：2009-11-13
申请人： Takeshi Suzuki , Kenichi Hotehama , Koichi Hirano , Seiichi Nakatani
发明人： Takeshi Suzuki , Kenichi Hotehama , Koichi Hirano , Seiichi Nakatani
IPC分类号： H01L33/08 , H01L21/336
CPC分类号： H01L29/66742 , H01L29/66765 , H01L29/786 , H01L29/78603 , H01L29/78681 , H01L29/7869
摘要： There is provided a flexible semiconductor device. The flexible semiconductor device of the present invention comprises a metal layer comprising a gate electrode, a source electrode and a drain electrode; a metal oxide film made from a metal which constitutes the metal layer and formed over a surface region of the metal layer; and a semiconductor layer formed above the gate electrode via the metal oxide film. In the flexible semiconductor device, uncovered portions, each of which is not covered with the metal oxide film, are locally formed in the surface region of the metal layer; and also electrical connections are formed between the source electrode and the semiconductor layer and between the drain electrode and the semiconductor layer via the uncovered portions.
摘要翻译：提供了一种柔性半导体器件。本发明的柔性半导体器件包括由栅电极，源电极和漏电极组成的金属层; 由金属制成的金属氧化物膜，其构成金属层并形成在金属层的表面区域上; 以及通过金属氧化物膜形成在栅极电极上方的半导体层。在柔性半导体器件中，在金属层的表面区域局部形成未被金属氧化物膜覆盖的未覆盖部分，并且还通过未覆盖部分在源电极和半导体层之间以及在漏电极和半导体层之间形成电连接。

10. 发明申请

US20100261321A1 METHOD FOR MANUFACTURING FLEXIBLE SEMICONDUCTOR DEVICE 有权
标题翻译：制造柔性半导体器件的方法
公开(公告)号：US20100261321A1
公开(公告)日：2010-10-14
申请号：US12681399
申请日：2009-07-30
申请人： Koichi Hirano , Seiichi Nakatani , Tatsuo Ogawa
发明人： Koichi Hirano , Seiichi Nakatani , Tatsuo Ogawa
IPC分类号： H01L21/336
CPC分类号： H01L51/0541 , H01L51/0004 , H01L51/0022 , H01L51/0097 , H01L51/107 , Y02E10/549 , Y02P70/521
摘要： There is provided a method for manufacturing a flexible semiconductor device. The manufacturing method is characterized by comprising (i) a step of forming an insulating film on the upper surface of a resin film, (ii) a step of forming a pattern of extraction electrodes on the upper surface of the resin film, (iii) a step of forming a semiconductor layer on the insulating film in such a manner that the semiconductor layer is in contact with the pattern of extraction electrodes, and (iv) a step of forming a sealing resin layer on the upper surface of the resin film in such a manner that the sealing resin layer covers the semiconductor layer and the pattern of extraction electrodes, wherein at least one forming step among the above (i) to (iv) is carried out by a printing method. In the manufacturing method, various layers can be formed by a simple printing process without using a vacuum process, photolithography, or the like.
摘要翻译：提供了一种用于制造柔性半导体器件的方法。（i）在树脂膜的上表面形成绝缘膜的工序，（ii）在树脂膜的上表面形成引出电极的图案的工序，（iii）以使得半导体层与引出电极的图案接触的方式在绝缘膜上形成半导体层的步骤，以及（iv）在树脂膜的上表面上形成密封树脂层的步骤密封树脂层覆盖半导体层和提取电极的图案的方式，其中上述（i）至（iv）中的至少一个形成步骤通过印刷方法进行。在制造方法中，可以通过简单的印刷工艺形成各种层，而不使用真空工艺，光刻等。

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