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    • 4. 发明申请
    • Reducing dielectric constant for MIM capacitor
    • 降低MIM电容的介电常数
    • US20070200162A1
    • 2007-08-30
    • US11361330
    • 2006-02-24
    • Kuo-Chi TuChun-Yao ChenYi-Ching Lin
    • Kuo-Chi TuChun-Yao ChenYi-Ching Lin
    • H01L29/76
    • H01L28/40H01L27/10852H01L27/10894H01L28/56
    • A memory device having improved sensing speed and reliability and a method of forming the same are provided. The memory device includes a first dielectric layer having a low k value over a semiconductor substrate, a second dielectric layer having a second k value over the first dielectric layer, and a capacitor formed in the second dielectric layer wherein the capacitor comprises a cup region at least partially filled by the third dielectric layer. The memory device further includes a third dielectric layer over the second dielectric layer and a bitline over the third dielectric layer. The bitline is electrically coupled to the capacitor. A void having great dimensions is preferably formed in the cup region of the capacitor.
    • 提供了具有改进的感测速度和可靠性的记忆装置及其形成方法。 存储器件包括在半导体衬底上具有低k值的第一电介质层,在第一介电层上具有第二k值的第二电介质层和形成在第二电介质层中的电容器,其中电容器包括位于 最少部分地被第三介电层填充。 存储器件还包括第二电介质层上的第三电介质层和第三电介质层上的位线。 位线电耦合到电容器。 优选地,在电容器的杯区域中形成具有大尺寸的空隙。
    • 6. 发明授权
    • Method for fabricating capacitor-over-bit-line dynamic random access
memory (DRAM) using self-aligned contact etching technology
    • 使用自对准接触蚀刻技术制造电容器 - 位线动态随机存取存储器(DRAM)的方法
    • US6136643A
    • 2000-10-24
    • US248727
    • 1999-02-11
    • Erik S. JengChun-Yao ChenIng-Ruey LiawJanmye Sung
    • Erik S. JengChun-Yao ChenIng-Ruey LiawJanmye Sung
    • H01L21/02H01L21/8242
    • H01L27/10888H01L28/91
    • A method for making capacitor-over-bit line (COB) DRAM using a self-aligned contact etching technology is achieved. After forming FET gate electrodes, sidewall spacers are formed from a first Si.sub.3 N.sub.4 etch-stop layer, while a portion of the Si.sub.3 N.sub.4 is retained as an etch-stop layer on the source/drain areas. Self-aligned contact openings are etched in a first oxide layer to the source/drain areas, and polysilicon landing plugs are formed in all the self-aligned openings. A second oxide layer is deposited and contact holes are etched to the landing plugs for bit lines. A polycide layer having a cap layer is deposited and patterned to form bit lines. A third Si.sub.3 N.sub.4 etch-stop layer is conformally deposited over the bit lines and patterned to form openings over the landing plugs for the capacitor node contacts while forming Si.sub.3 N.sub.4 sidewall spacers on the bit lines exposed in the openings. A third oxide layer is deposited, and openings having relaxed alignment tolerances, can be etched to the capacitor node contacts because the underlying third etch-stop layer prevents overetching. A conducting layer is deposited and etched back to form bottom electrodes in the openings, and the third oxide layer is removed, while the Si.sub.3 N.sub.4 etch-stop layers prevents over-etching. An interelectrode dielectric layer is deposited, and capacitor top electrodes are formed.
    • 实现了使用自对准接触蚀刻技术制造电容器对位线(COB)DRAM的方法。 在形成FET栅电极之后,侧壁间隔物由第一Si 3 N 4蚀刻停止层形成,而一部分Si 3 N 4作为蚀刻停止层保留在源/漏区上。 自对准的接触开口在第一氧化物层中蚀刻到源极/漏极区域,并且在所有自对准开口中形成多晶硅着色塞。 沉积第二氧化物层,并将接触孔蚀刻到位线的着陆塞。 沉积具有盖层的多晶硅化物层并构图以形成位线。 第三个Si 3 N 4蚀刻停止层被保形地沉积在位线上并被图案化以在用于电容器节点接触的着陆塞上形成开口,同时在开口中暴露的位线上形成Si 3 N 4侧壁间隔物。 沉积第三氧化物层,并且具有松弛的取向公差的开口可被蚀刻到电容器节点接点,因为下面的第三蚀刻停止层防止过蚀刻。 导电层被沉积并回蚀刻以在开口中形成底部电极,并且去除第三氧化物层,而Si 3 N 4蚀刻停止层防止过蚀刻。 沉积电极间电介质层,形成电容器顶部电极。
    • 10. 发明申请
    • Semiconductor devices with MIM-type decoupling capacitors and fabrication method thereof
    • 具有MIM型去耦电容器的半导体器件及其制造方法
    • US20080122032A1
    • 2008-05-29
    • US11504693
    • 2006-08-16
    • Kuo-Chi TuChun-Yao Chen
    • Kuo-Chi TuChun-Yao Chen
    • H01L29/00H01L21/02
    • H01L28/91H01L28/55
    • A semiconductor device. The semiconductor device includes a substrate having an array region and a decoupling region, a first dielectric layer overlying the substrate, a second dielectric layer overlying the first dielectric layer, a plurality of active components formed in the first dielectric layer within the array region, a first capacitor formed in the second dielectric layer within the array region, a second capacitor formed in the second dielectric layer within the decoupling region, and a first plug formed in the first dielectric layer within the array region electrically connecting the active component and the first capacitor. The invention also provides a method of fabricating the semiconductor device.
    • 半导体器件。 半导体器件包括具有阵列区和去耦区的衬底,覆盖衬底的第一电介质层,覆盖第一电介质层的第二电介质层,形成在阵列区域内的第一电介质层中的多个有源元件, 形成在阵列区域内的第二电介质层中的第一电容器,形成在去耦区域内的第二电介质层中的第二电容器和形成在阵列区域内的第一电介质层中的电连接有源部件和第一电容器 。 本发明还提供一种制造半导体器件的方法。