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    • 10. 发明授权
    • High-speed router with backplane using tuned-impedance thru-holes and vias
    • 具有背板的高速路由器使用调谐阻抗通孔和通孔
    • US07336502B1
    • 2008-02-26
    • US10454735
    • 2003-06-03
    • Joel R. Goergen
    • Joel R. Goergen
    • H01R12/16
    • H05K1/0251H05K1/0245H05K1/116H05K3/429H05K2201/044H05K2201/09236H05K2201/09454H05K2201/09636H05K2201/09781
    • A high-speed router backplane is disclosed. The router backplane uses differential signal pairs on multiple signal layers, each sandwiched between a pair of digital ground layers. To reduce routing complexity, at least some of the differential signal pairs route through a via pair, somewhere along their path, to a different signal layer. Specific via designs reduce differential signal distortion due to the via pair, allowing the backplane to operate reliably at differential signal rates in excess of 3 Gigabits per second. In particular, each via passes through nonfunctional conductive pads on selected digital ground plane layers, the pads separated from the remainder of its ground plane layer by a clearance, thereby modifying the impedance of the via and reducing reflections from the stubs created by the via.
    • 公开了一种高速路由器背板。 路由器背板在多个信号层上使用差分信号对,每个信号对夹在一对数字接地层之间。 为了降低路由复杂度,差分信号对中的至少一些在其路径的某处沿着不同的信号层路由通路对。 特定的通孔设计可减少由于通孔对导致的差分信号失真,从而允许背板在差分信号速率下可靠地运行,每秒超过3千兆位。 特别地,每个通孔通过选定的数字接地平面层上的非功能导电焊盘,焊盘与其接地平面层的其余部分间隔一定距离,从而修改通孔的阻抗并减少由通孔产生的短截线的反射。