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1. 发明申请

US20090200267A1 INJECTION TYPE PLASMA TREATMENT APPARATUS AND METHOD 审中-公开
标题翻译：注射式等离子体处理装置和方法
公开(公告)号：US20090200267A1
公开(公告)日：2009-08-13
申请号：US11996651
申请日：2005-07-26
申请人： Yeon Keon Shim , Jong Moon Baek , Dong Hoon Kim , Hae Ryong Lee , Keun Ho Lee
发明人： Yeon Keon Shim , Jong Moon Baek , Dong Hoon Kim , Hae Ryong Lee , Keun Ho Lee
IPC分类号： B44C1/22 , H05H1/24
CPC分类号： C23C8/36 , C23C4/134 , H01J37/32357 , H01J37/32522
摘要： The present invention relates to an injection type plasma treatment apparatus. An object of the present invention is to provide an injection type plasma treatment apparatus capable of treating work pieces with a variety of areas, sizes and shapes without damages due to micro arc streamer by using a method of injecting plasma, which is generated through dielectric barrier discharge (DBD) under the normal pressure condition, toward the work pieces.To this end, the injection type plasma treatment apparatus of the present invention comprises a power electrode plate which is provided in the reaction chamber in a state where a dielectric is formed on the power electrode plate; a ground electrode plate which is formed with a plurality of holes, defines a part of a wall of the reaction chamber, and cooperates with the power electrode plate to generate plasma therebetween when alternating current power is applied to the power electrode plate; and a gas supply unit which introduces reaction gas into the reaction chamber and injects the plasma in the reaction chamber to the outside through the holes in the ground electrode plate.
摘要翻译：本发明涉及一种注射型等离子体处理装置。本发明的目的是提供一种注射式等离子体处理装置，其能够通过使用通过介电阻挡层产生的注入等离子体的方法来处理各种面积，尺寸和形状的工件，而不会由于微弧流造成损坏放电（DBD）在常压条件下，朝向工件。为此，本发明的注射型等离子体处理装置包括：在电极板上形成电介质的状态下设置在反应室内的电极板; 形成有多个孔的接地电极板限定反应室的壁的一部分，并且在向功率电极板施加交流电力时与电极板配合以产生等离子体; 以及气体供给单元，其将反应气体引入到反应室中，并且通过接地电极板中的孔将反应室中的等离子体注入到外部。

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