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    • 2. 发明授权
    • Heat dissipation device for electronic device
    • 电子设备散热装置
    • US07055577B2
    • 2006-06-06
    • US10778704
    • 2004-02-12
    • Yaxiong WangShun Chi DongChung-Yuan Huang
    • Yaxiong WangShun Chi DongChung-Yuan Huang
    • F28F7/00
    • H01L23/467H01L2924/0002H01L2924/00
    • A heat dissipation device includes a column (1) for being positioned on an electronic device for dissipating heat therefrom, a plurality of fin units (5) attached to and stacked along the column, an H-shaped securing member (3) attached to the column below the fin units for securing the heat dissipation device to the electronic device, a pair of fan supports (7) extending from opposite sides of the securing member, and a fan (9) mounted on the fan supports. The fin units define a plurality of sprial air passages along an axis of the column which consist with air flow of the fan. Each of the fin units is configured by a metal disc with a plurality of sectors (54, 54′, 54″) and channels (56, 56′, 56″) between adjacent sectors.
    • 一种散热装置,包括用于定位在电子装置上用于散发热量的柱(1),沿着柱附接并堆叠的多个翅片单元(5),附接到该柱的H形固定构件(3) 用于将散热装置固定到电子装置的一对风扇支架(7),以及安装在风扇支架上的风扇(9)。 翅片单元沿着柱的轴线限定多个沿风扇的空气流组成的空气通道。 每个鳍单元由具有多个扇区(54,54',54“)的金属盘和相邻扇区之间的通道(56,56',56”)构成。
    • 3. 发明授权
    • Heat dissipating device for electronic component
    • 电子元件散热装置
    • US06958915B2
    • 2005-10-25
    • US10681390
    • 2003-10-07
    • Yaxiong WangChung-Yuan HuangShun Chi Dong
    • Yaxiong WangChung-Yuan HuangShun Chi Dong
    • F28D15/02F28F1/32G06F1/16G06F1/20H01L23/34H01L23/40H01L23/427H01L23/467H05K7/20
    • H01L23/427F28D15/0275F28F1/32H01L23/4093H01L23/467H01L2924/0002H01L2924/00
    • A heat dissipating device includes a retention module (20) around an electronic component (15), a heat sink (30) attached to the retention module, and a fan (90). The heat sink includes a plurality of fins (62, 64, 66, 68) and spacers (52) interleaved between the fins, two heat pipes (80) sequentially extending through lower portions of the fins, the spacers and upper portions of the fins to bond the fins and the spacers together. Each spacer includes a flat bottom face for contacting the electronic component, and an arcuate top face. The fins includes two outer fins, and a plurality of inner fins each defining a cutout (62a, 64a) cooperatively defining a chamber between the outer fins. The chamber and the arcuate spacers facilitate cooling air from the fan to blow to opposite sides of the heat sink thereby improving heat dissipation efficiency of the heat sink.
    • 散热装置包括围绕电子部件(15)的保持模块(20),附接到保持模块的散热器(30)和风扇(90)。 散热片包括多个散热片(62,64,66,68)和间隔件(52),两个散热片之间交错,两个热管(80)依次延伸穿过翅片的下部,间隔件和翅片的上部 以将翅片和间隔件结合在一起。 每个间隔件包括用于接触电子部件的平坦底面和弧形顶面。 散热片包括两个外部散热片和多个内部散热片,每个内部散热片限定了一个切口(62a,64a),它们协同地限定了外部散热片之间的室。 腔室和弓形间隔件促进了风扇的冷却空气吹到散热器的相对两侧,从而提高了散热器的散热效率。