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1. 发明授权

US09013303B2 Product management system 有权
标题翻译：产品管理系统
公开(公告)号：US09013303B2
公开(公告)日：2015-04-21
申请号：US13555519
申请日：2012-07-23
申请人： Yasuyuki Arai , Mai Akiba , Yuko Tachimura , Yohei Kanno
发明人： Yasuyuki Arai , Mai Akiba , Yuko Tachimura , Yohei Kanno
IPC分类号： G08B1/08 , H04B5/00 , G06K7/10 , G06K17/00 , G06K19/077 , H04Q5/22 , G08B13/14 , H01L21/336
CPC分类号： H04B5/0012 , G06K7/10178 , G06K17/00 , G06K19/07758 , G06K2017/0051 , H04B5/0056 , H04B5/0081
摘要： One feature of the present invention is a product management system that includes a package body for packing a product attached with an ID tag, and a reader/writer. The ID tag includes a thin film integrated circuit portion and an antenna, the package body includes a resonance circuit portion having an antenna coil and a capacitor, and the resonance circuit portion can communicate with the reader/writer and the ID tag. Accordingly, the stability of communication between an ID tag attached to a product and an R/W can be secured, and management of products can be conducted simply and efficiently, even if a product is packed by a package body.
摘要翻译：本发明的一个特征是产品管理系统，其包括用于打包附有ID标签的产品的包装体和读取器/写入器。 ID标签包括薄膜集成电路部分和天线，封装主体包括具有天线线圈和电容器的谐振电路部分，并且谐振电路部分可以与读取器/写入器和ID标签通信。因此，即使产品被包装体包装，也可以确保附着在产品上的ID标签与R / W之间的通信的稳定性，并且可以简单有效地进行产品的管理。

2. 发明授权

US07994617B2 Semiconductor device 有权
标题翻译：半导体器件
公开(公告)号：US07994617B2
公开(公告)日：2011-08-09
申请号：US10587237
申请日：2005-02-01
申请人： Yasuyuki Arai , Yuko Tachimura , Yohei Kanno , Mai Akiba
发明人： Yasuyuki Arai , Yuko Tachimura , Yohei Kanno , Mai Akiba
IPC分类号： H01L23/02
CPC分类号： H01L27/1266 , G06K19/025 , G06K19/07728 , G06K19/07749 , H01L27/1214 , H01L27/13 , H01L2221/6835 , H01L2224/73204
摘要： An object of the present invention is providing a semiconductor device that is capable of improving the reliability of a semiconductor element and enhancing the mechanical strength without suppressing the scale of a circuit. The semiconductor device includes an integrated circuit sandwiched between first and second sealing films, an antenna electrically connected to the integrated circuit, the first sealing film sandwiched between a substrate and the integrated circuit, which includes a plurality of first insulating films and at least one second insulating film sandwiched therebetween, the second sealing film including a plurality of third insulating films and at least one fourth insulating film sandwiched therebetween. The second insulating film has lower stress than the first insulting film and the fourth insulating film has lower stress than the third insulating film. The first and third insulating films are inorganic insulating films.
摘要翻译：本发明的目的在于提供一种能够提高半导体元件的可靠性并提高机械强度而不抑制电路规模的半导体装置。半导体器件包括夹在第一和第二密封膜之间的集成电路，与集成电路电连接的天线，夹在基板和集成电路之间的第一密封膜，其包括多个第一绝缘膜和至少一个第二绝缘膜夹在其间的绝缘膜，所述第二密封膜包括多个第三绝缘膜和夹在其间的至少一个第四绝缘膜。第二绝缘膜具有比第一绝缘膜低的应力，并且第四绝缘膜具有比第三绝缘膜更低的应力。第一和第三绝缘膜是无机绝缘膜。

3. 发明授权

US08237569B2 Product management system 有权
标题翻译：产品管理系统
公开(公告)号：US08237569B2
公开(公告)日：2012-08-07
申请号：US10594308
申请日：2005-04-06
申请人： Yasuyuki Arai , Mai Akiba , Yuko Tachimura , Yohei Kanno
发明人： Yasuyuki Arai , Mai Akiba , Yuko Tachimura , Yohei Kanno
IPC分类号： G08B13/14 , G08B13/00 , H04Q5/22 , G06Q30/00 , G06Q20/00
CPC分类号： H04B5/0012 , G06K7/10178 , G06K17/00 , G06K19/07758 , G06K2017/0051 , H04B5/0056 , H04B5/0081
摘要： When a product attached with an ID tag is placed inside a package body, there is a risk that communication with an ID tag using a reader/writer is blocked. Then, it is difficult to manage products in a distribution process of products, which leads to lose convenience of ID tags. One feature of the present invention is a product management system that includes a package body for packing a product attached with an ID tag, and a reader/writer. The ID tag includes a thin film integrated circuit portion and an antenna, the package body includes a resonance circuit portion having an antenna coil and a capacitor, and the resonance circuit portion can communicate with the reader/writer and the ID tag. Accordingly, the stability of communication between an ID tag attached to a product and an R/W can be secured, and management of products can be conducted simply and efficiently, even if a product is packed by a package body.
摘要翻译：当附有ID标签的产品放置在包装体内时，存在与使用读写器的ID标签进行通信的风险。然后，在产品分销过程中难以管理产品，导致ID标签的便利性不足。本发明的一个特征是产品管理系统，其包括用于打包附有ID标签的产品的包装体和读取器/写入器。 ID标签包括薄膜集成电路部分和天线，封装主体包括具有天线线圈和电容器的谐振电路部分，并且谐振电路部分可以与读取器/写入器和ID标签通信。因此，即使产品被包装体包装，也可以确保附着在产品上的ID标签与R / W之间的通信的稳定性，并且可以简单有效地进行产品的管理。

4. 发明申请

US20080149731A1 Id Label, Id Card, and Id Tag 有权
标题翻译： Id标签，Id卡和Id标签
公开(公告)号：US20080149731A1
公开(公告)日：2008-06-26
申请号：US10586156
申请日：2005-01-20
申请人： Yasuyuki Arai , Mai Akiba , Yuko Tachimura , Yohei Kanno
发明人： Yasuyuki Arai , Mai Akiba , Yuko Tachimura , Yohei Kanno
IPC分类号： G06K19/06
CPC分类号： H01L27/1266 , G06K19/07718 , G06K19/07749 , G06K19/0775 , G06K19/07779 , G06K19/07783 , H01L27/1203 , H01L27/1214 , H01L27/13 , H01L29/78603 , H01L2224/83192 , H01L2924/01004 , H01L2924/01019 , H01L2924/0102 , H01L2924/01021 , H01L2924/01025 , H01L2924/01046 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079
摘要： As a non-contact ID label, ID tag and the like being widespread, it is required to manufacture a considerable quantity of ID labels at quite a low cost. An ID label attached to a product is, for example, required to be manufactured at 1 to several yens each, or preferably less than one yen. Thus, such a structure and a process are demanded that an ID label can be manufactured in a large quantity at a low cost. A thin film integrated circuit device included in the ID label, the ID card, and the ID tag of the invention each includes a thin film active element such as a thin film transistor (TFT). Therefore, by peeling a substrate on which TFTs are formed for separating elements, the ID label and the like can be manufactured in a large quantity at a low cost.
摘要翻译：作为非接触式ID标签，ID标签等广泛使用，需要以相当低的成本制造大量的ID标签。例如，附着在产品上的ID标签需要以1至几个日元制造，或优选小于1日元。因此，要求能够以低成本大量制造ID标签的结构和工序。包括在本发明的ID标签，ID卡和ID标签中的薄膜集成电路器件各自包括诸如薄膜晶体管（TFT）的薄膜有源元件。因此，通过剥离其上形成有用于分离元件的TFT的基板，可以以低成本大量地制造ID标签等。

5. 发明申请

US20050168339A1 ID label, ID tag, and ID card 有权
标题翻译： ID标签，ID标签和身份证
公开(公告)号：US20050168339A1
公开(公告)日：2005-08-04
申请号：US11044609
申请日：2005-01-28
申请人： Yasuyuki Arai , Mai Akiba , Yuko Tachimura , Yohei Kanno
发明人： Yasuyuki Arai , Mai Akiba , Yuko Tachimura , Yohei Kanno
IPC分类号： G06K19/077 , G08B13/14
CPC分类号： G06K19/07722 , G06K19/07749 , G08B13/2417 , G08B13/2437
摘要： In commercial products to which a non-contact type or contact type ID label or ID tag is attached and ID cards, there is fear that, due to a difference between coefficients of thermal expansion between an antenna for communication and a resin provided around the antenna, stress is applied to the resin with the larger coefficient of thermal expansion to break the resin. This contributes to decrease in manufacturing yield, lifetime, and reliability of an ID label or the like. In an article such as an ID label, an ID tag, and an ID card according to the present invention, a filler is included in a filling layer provided around an antenna forming an ID label, an ID tag, and an ID card so that the difference in coefficient of thermal expansion between the antenna and the filling layer can be reduced. This makes it possible to ease generation of stress due to the difference in coefficient of thermal expansion and prevent peeling and cracks of the filling layer.
摘要翻译：在与非接触型或接触型ID标签或ID标签相连的商业产品中，ID卡有恐惧，由于通信用天线与设置在天线周围的树脂之间的热膨胀系数之间的差异对具有较大的热膨胀系数的树脂施加应力以破坏树脂。这导致ID标签等的制造产量，寿命和可靠性的降低。在根据本发明的诸如ID标签，ID标签和ID卡的物品中，在形成ID标签，ID标签和ID卡的天线周围的填充层中包括填充物，使得可以降低天线与填充层之间的热膨胀系数的差异。这使得可以缓解由于热膨胀系数的差异导致的应力的产生，并且防止填充层的剥离和裂纹。

6. 发明授权

US07633145B2 Semiconductor device with antenna and separating layer 有权
标题翻译：具有天线和分离层的半导体器件
公开(公告)号：US07633145B2
公开(公告)日：2009-12-15
申请号：US10586339
申请日：2005-01-11
申请人： Yasuyuki Arai , Mai Akiba , Yuko Tachimura , Yohei Kanno
发明人： Yasuyuki Arai , Mai Akiba , Yuko Tachimura , Yohei Kanno
IPC分类号： H01L23/02
CPC分类号： H01L27/1266 , G06K19/073 , G06K19/07726 , G06K19/07749 , G06K19/0776 , G06K19/07798 , G06K2017/0064 , H01L23/49855 , H01L27/1214 , H01L27/13 , H01L2924/0002 , H01L2924/12044 , H01L2924/00
摘要： The invention provides a semiconductor device which can reliably restrict transmission/reception of signals or a power source voltage between a reader/writer when peeled off after stuck to an object. The semiconductor device of the invention includes an integrated circuit and an antenna formed on a support base. In the semiconductor device of the invention, a separating layer which is overlapped with the integrated circuit and the antenna sandwiching an insulating film is formed on the support base. A wiring for electrically connecting the integrated circuit and the antenna, a wiring for electrically connecting semiconductor elements in an integrated circuit, or a wiring which forms the antenna passes through the separating layer.
摘要翻译：本发明提供了一种半导体器件，其能够在卡住对象之后剥离时可靠地限制读取器/写入器之间的信号的发送/接收或电源电压。本发明的半导体器件包括形成在支撑基座上的集成电路和天线。在本发明的半导体器件中，在支撑基体上形成有与集成电路重叠的分离层和夹着绝缘膜的天线。用于电连接集成电路和天线的布线，用于电连接集成电路中的半导体元件的布线或形成天线的布线通过分离层。

7. 发明申请

US20070164413A1 Semiconductor device 有权
标题翻译：半导体器件
公开(公告)号：US20070164413A1
公开(公告)日：2007-07-19
申请号：US10586339
申请日：2005-01-11
申请人： Yasuyuki Arai , Mai Akiba , Yuko Tachimura , Yohei Kanno
发明人： Yasuyuki Arai , Mai Akiba , Yuko Tachimura , Yohei Kanno
IPC分类号： H01L23/02
CPC分类号： H01L27/1266 , G06K19/073 , G06K19/07726 , G06K19/07749 , G06K19/0776 , G06K19/07798 , G06K2017/0064 , H01L23/49855 , H01L27/1214 , H01L27/13 , H01L2924/0002 , H01L2924/12044 , H01L2924/00
摘要： The invention provides a semiconductor device which can reliably restrict transmission/reception of signals or a power source voltage between a reader/writer when peeled off after stuck to an object. The semiconductor device of the invention includes an integrated circuit and an antenna formed on a support base. In the semiconductor device of the invention, a separating layer which is overlapped with the integrated circuit and the antenna sandwiching an insulating film is formed on the support base. A wiring for electrically connecting the integrated circuit and the antenna, a wiring for electrically connecting semiconductor elements in an integrated circuit, or a wiring which forms the antenna passes through the separating layer.
摘要翻译：本发明提供了一种半导体器件，其能够在卡住对象之后剥离时可靠地限制读取器/写入器之间的信号的发送/接收或电源电压。本发明的半导体器件包括形成在支撑基座上的集成电路和天线。在本发明的半导体器件中，在支撑基体上形成有与集成电路重叠的分离层和夹着绝缘膜的天线。用于电连接集成电路和天线的布线，用于电连接集成电路中的半导体元件的布线或形成天线的布线通过分离层。

8. 发明申请

US20070159335A1 Semiconductor device 有权
标题翻译：半导体器件
公开(公告)号：US20070159335A1
公开(公告)日：2007-07-12
申请号：US10587237
申请日：2005-02-01
申请人： Yasuyuki Arai , Yuko Tachimura , Yohei Kanno , Mai Akiba
发明人： Yasuyuki Arai , Yuko Tachimura , Yohei Kanno , Mai Akiba
IPC分类号： G08B13/14 , H01L23/02
CPC分类号： H01L27/1266 , G06K19/025 , G06K19/07728 , G06K19/07749 , H01L27/1214 , H01L27/13 , H01L2221/6835 , H01L2224/73204
摘要： An object of the present invention is providing a semiconductor device that is capable of improving the reliability of a semiconductor element and enhancing the mechanical strength without suppressing the scale of a circuit. The semiconductor device includes an integrated circuit sandwiched between first and second sealing films, an antenna electrically connected to the integrated circuit, the first sealing film sandwiched between a substrate and the integrated circuit, which includes a plurality of first insulating films and at least one second insulating film sandwiched therebetween, the second sealing film including a plurality of third insulating films and at least one fourth insulating film sandwiched therebetween. The second insulating film has lower stress than the first insulting film and the fourth insulating film has lower stress than the third insulating film. The first and third insulating films are inorganic insulating films.
摘要翻译：本发明的目的在于提供一种能够提高半导体元件的可靠性并提高机械强度而不抑制电路规模的半导体装置。半导体器件包括夹在第一和第二密封膜之间的集成电路，与集成电路电连接的天线，夹在基板和集成电路之间的第一密封膜，其包括多个第一绝缘膜和至少一个第二绝缘膜夹在其间的绝缘膜，所述第二密封膜包括多个第三绝缘膜和夹在其间的至少一个第四绝缘膜。第二绝缘膜具有比第一绝缘膜低的应力，并且第四绝缘膜具有比第三绝缘膜更低的应力。第一和第三绝缘膜是无机绝缘膜。

9. 发明授权

US08136735B2 ID label, ID card, and ID tag 有权
标题翻译： ID标签，身份证和身份证标签
公开(公告)号：US08136735B2
公开(公告)日：2012-03-20
申请号：US10586156
申请日：2005-01-20
申请人： Yasuyuki Arai , Mai Akiba , Yuko Tachimura , Yohei Kanno
发明人： Yasuyuki Arai , Mai Akiba , Yuko Tachimura , Yohei Kanno
IPC分类号： G06K19/06 , G06K19/00 , G06K19/02
CPC分类号： H01L27/1266 , G06K19/07718 , G06K19/07749 , G06K19/0775 , G06K19/07779 , G06K19/07783 , H01L27/1203 , H01L27/1214 , H01L27/13 , H01L29/78603 , H01L2224/83192 , H01L2924/01004 , H01L2924/01019 , H01L2924/0102 , H01L2924/01021 , H01L2924/01025 , H01L2924/01046 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079
摘要： As a non-contact ID label, ID tag and the like being widespread, it is required to manufacture a considerable quantity of ID labels at quite a low cost. An ID label attached to a product is, for example, required to be manufactured at 1 to several yens each, or preferably less than one yen. Thus, such a structure and a process are demanded that an ID label can be manufactured in a large quantity at a low cost. A thin film integrated circuit device included in the ID label, the ID card, and the ID tag of the invention each includes a thin film active element such as a thin film transistor (TFT). Therefore, by peeling a substrate on which TFTs are formed for separating elements, the ID label and the like can be manufactured in a large quantity at a low cost.
摘要翻译：作为非接触式ID标签，ID标签等广泛使用，需要以相当低的成本制造大量的ID标签。例如，附着在产品上的ID标签需要以1至几个日元制造，或优选小于1日元。因此，要求能够以低成本大量制造ID标签的结构和工序。包括在本发明的ID标签，ID卡和ID标签中的薄膜集成电路器件各自包括诸如薄膜晶体管（TFT）的薄膜有源元件。因此，通过剥离其上形成有用于分离元件的TFT的基板，可以以低成本大量地制造ID标签等。

10. 发明授权

US07728734B2 ID label, ID tag, and ID card 有权
标题翻译： ID标签，ID标签和身份证
公开(公告)号：US07728734B2
公开(公告)日：2010-06-01
申请号：US12336611
申请日：2008-12-17
申请人： Yasuyuki Arai , Mai Akiba , Yuko Tachimura , Yohei Kanno
发明人： Yasuyuki Arai , Mai Akiba , Yuko Tachimura , Yohei Kanno
IPC分类号： G08B13/14
CPC分类号： G06K19/07722 , G06K19/07749 , G08B13/2417 , G08B13/2437
摘要： In commercial products to which a non-contact type or contact type ID label or ID tag is attached and ID cards, there is fear that, due to a difference between coefficients of thermal expansion between an antenna for communication and a resin provided around the antenna, stress is applied to the resin with the larger coefficient of thermal expansion to break the resin. This contributes to a decrease in manufacturing yield, lifetime, and reliability of an ID label or the like. In an article such as an ID label, an ID tag, and an ID card according to the present invention, a filler is included in a filling layer provided around an antenna forming an ID label, an ID tag, and an ID card so that the difference in coefficient of thermal expansion between the antenna and the filling layer can be reduced. This makes it possible to ease generation of stress due to the difference in coefficient of thermal expansion and prevent peeling and cracks of the filling layer.
摘要翻译：在与非接触型或接触型ID标签或ID标签相连的商业产品中，ID卡有恐惧，由于通信用天线与设置在天线周围的树脂之间的热膨胀系数之间的差异对具有较大的热膨胀系数的树脂施加应力以破坏树脂。这有助于ID标签等的制造产量，寿命和可靠性的降低。在根据本发明的诸如ID标签，ID标签和ID卡的物品中，在形成ID标签，ID标签和ID卡的天线周围的填充层中包括填充物，使得可以降低天线与填充层之间的热膨胀系数的差异。这使得可以缓解由于热膨胀系数的差异导致的应力的产生，并且防止填充层的剥离和裂纹。

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