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    • 1. 发明授权
    • Method of manufacturing electronic components
    • 制造电子元器件的方法
    • US5295289A
    • 1994-03-22
    • US955838
    • 1992-10-02
    • Yasuto InagakiYoshiaki Kohno
    • Yasuto InagakiYoshiaki Kohno
    • H01C17/28H01G4/232H01G4/248H01G4/30H01G13/00
    • H01G4/232Y10T29/435
    • A method for efficiently forming external electrodes of desired thicknesses on chip electronic components such as multilayer ceramic capacitors. Cutting grooves are formed in a block along surfaces to be provided with external electrodes. The block is divided into individual chips after metal paste for forming external electrodes is cast into the cutting grooves and dried. The metal paste filling up each of the cutting grooves is cut with a blade to be divided into two parts. The two parts of the metal paste thus formed with the blade define external electrodes. The present invention can also be applied to form external electrodes in an electronic component array comprising a plurality of electronic component elements.
    • 一种用于有效地形成片状电子部件如多层陶瓷电容器的所需厚度的外部电极的方法。 切割槽沿着表面形成在块中以设置有外部电极。 将用于形成外部电极的金属糊料浇注到切割槽中并干燥后,将该块分成单独的芯片。 填充每个切割槽的金属糊料用刀片切割以分成两部分。 由此形成的与刀片形成的金属浆料的两个部分限定外部电极。 本发明还可以应用于在包括多个电子元件的电子元件阵列中形成外部电极。