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1. 发明授权

US07608787B2 Semiconductor memory device and USB memory device using the same 失效
标题翻译：半导体存储器件和使用其的USB存储器件
公开(公告)号：US07608787B2
公开(公告)日：2009-10-27
申请号：US11531589
申请日：2006-09-13
申请人： Yasuo Takemoto , Naohisa Okumura , Taku Nishiyama , Takashi Okada
发明人： Yasuo Takemoto , Naohisa Okumura , Taku Nishiyama , Takashi Okada
IPC分类号： H05K1/16
CPC分类号： H05K5/0278 , H01L2224/32145 , H01L2224/73265 , H05K1/117 , H05K1/181 , H05K3/284 , H05K2201/10159 , H05K2201/10325 , H05K2201/10492 , H05K2201/10636 , H05K2203/1572 , Y02P70/611
摘要： A USB terminal having a conductor layer to be an input/output terminal of a USB connector is formed on a first principle surface of a circuit board. A memory element is mounted on a second principle surface at an opposite side of a terminal forming surface of the circuit board, and the memory element is sealed with a sealing resin. A semiconductor memory device as a USB memory main body is constituted by them. A USB memory is constituted by housing the USB memory main body inside of a USB connector case.
摘要翻译：具有作为USB连接器的输入/输出端子的导体层的USB端子形成在电路板的第一主表面上。存储元件安装在电路板的端子形成表面的相对侧的第二主表面上，并且存储元件用密封树脂密封。作为USB存储器主体的半导体存储器件由它们构成。 USB存储器通过将USB存储器主体容纳在USB连接器壳体内部而构成。

2. 发明申请

US20070066102A1 SEMICONDUCTOR MEMORY DEVICE AND USB MEMORY DEVICE USING THE SAME 失效
标题翻译：半导体存储器件和使用其的USB存储器件
公开(公告)号：US20070066102A1
公开(公告)日：2007-03-22
申请号：US11531589
申请日：2006-09-13
申请人： Yasuo Takemoto , Naohisa Okumura , Taku Nishiyama , Takashi Okada
发明人： Yasuo Takemoto , Naohisa Okumura , Taku Nishiyama , Takashi Okada
IPC分类号： H01R13/44
CPC分类号： H05K5/0278 , H01L2224/32145 , H01L2224/73265 , H05K1/117 , H05K1/181 , H05K3/284 , H05K2201/10159 , H05K2201/10325 , H05K2201/10492 , H05K2201/10636 , H05K2203/1572 , Y02P70/611
摘要： A USB terminal having a conductor layer to be an input/output terminal of a USB connector is formed on a first principle surface of a circuit board. A memory element is mounted on a second principle surface at an opposite side of a terminal forming surface of the circuit board, and the memory element is sealed with a sealing resin. A semiconductor memory device as a USB memory main body is constituted by them. A USB memory is constituted by housing the USB memory main body inside of a USB connector case.
摘要翻译：具有作为USB连接器的输入/输出端子的导体层的USB端子形成在电路板的第一主表面上。存储元件安装在电路板的端子形成表面的相对侧的第二主表面上，并且存储元件用密封树脂密封。作为USB存储器主体的半导体存储器件由它们构成。 USB存储器通过将USB存储器主体容纳在USB连接器壳体内部而构成。

3. 发明授权

US07679174B1 Semiconductor device and memory card using the same 有权
标题翻译：半导体器件和存储卡使用相同
公开(公告)号：US07679174B1
公开(公告)日：2010-03-16
申请号：US11691716
申请日：2007-03-27
申请人： Takashi Okada , Kiyokazu Okada , Akinori Ono , Taku Nishiyama
发明人： Takashi Okada , Kiyokazu Okada , Akinori Ono , Taku Nishiyama
IPC分类号： H01L23/02
CPC分类号： H05K1/0256 , H01L2224/48091 , H01L2224/49171 , H01L2924/181 , H05K1/117 , H05K3/0052 , H05K3/284 , H05K2201/0761 , H05K2201/09145 , H05K2201/09227 , H05K2203/0228 , H01L2924/00012 , H01L2924/00014
摘要： A circuit board has a curved portion provided in at least one side of an external shape thereof. An external connecting terminal is provided on a first main surface of the circuit board. A semiconductor element is mounted on a second main surface of the circuit board. A first wiring network is provided in a region except the terminal region on the first main surface. A second wiring network is provided on the second main surface. Distance from the side including the curved portion to the first wiring network is larger than distance from at least one of the other sides to the first wiring networks, and distance from the side including the curved portion to the second wiring network is larger than distance from at least one of the other sides to the second wiring networks.
摘要翻译：电路板具有设置在其外部形状的至少一侧的弯曲部分。外部连接端子设置在电路板的第一主表面上。半导体元件安装在电路板的第二主表面上。第一布线网络设置在除了第一主表面上的端子区域之外的区域中。第二配线网络设置在第二主表面上。从包括弯曲部分到第一布线网络的一侧的距离大于从另一侧至第一布线网络中的至少一个的距离，并且从包括弯曲部分到第二布线网络的一侧的距离大于距离至少一个对方到第二布线网络。

4. 发明授权

US08110434B2 Semiconductor device and memory card using the same 有权
标题翻译：半导体器件和存储卡使用相同
公开(公告)号：US08110434B2
公开(公告)日：2012-02-07
申请号：US12693096
申请日：2010-01-25
申请人： Takashi Okada , Kiyokazu Okada , Akinori Ono , Taku Nishiyama
发明人： Takashi Okada , Kiyokazu Okada , Akinori Ono , Taku Nishiyama
IPC分类号： H01L21/44 , H01L21/50 , H01L21/48 , H01L21/82
CPC分类号： H05K1/0256 , H01L2224/48091 , H01L2224/49171 , H01L2924/181 , H05K1/117 , H05K3/0052 , H05K3/284 , H05K2201/0761 , H05K2201/09145 , H05K2201/09227 , H05K2203/0228 , H01L2924/00012 , H01L2924/00014
摘要： A circuit board has a curved portion provided in at least one side of an external shape thereof. An external connecting terminal is provided on a first main surface of the circuit board. A semiconductor element is mounted on a second main surface of the circuit board. A first wiring network is provided in a region except the terminal region on the first main surface. A second wiring network is provided on the second main surface. Distance from the side including the curved portion to the first wiring network is larger than distance from at least one of the other sides to the first wiring networks, and distance from the side including the curved portion to the second wiring network is larger than distance from at least one of the other sides to the second wiring networks.
摘要翻译：电路板具有设置在其外部形状的至少一侧的弯曲部分。外部连接端子设置在电路板的第一主表面上。半导体元件安装在电路板的第二主表面上。第一布线网络设置在除了第一主表面上的端子区域之外的区域中。第二配线网络设置在第二主表面上。从包括弯曲部分到第一布线网络的一侧的距离大于从另一侧至第一布线网络中的至少一个的距离，并且从包括弯曲部分到第二布线网络的一侧的距离大于距离至少一个对方到第二布线网络。

5. 发明申请

US20200038310A1 COMPOSITION, ARTIFICIAL NAIL COMPOSITION, NAIL DECORATION MATERIAL, ARTIFICIAL NAIL, STORED CONTAINER, IMAGE FORMING APPARATUS, AND IMAGE FORMING METHOD 审中-公开
公开(公告)号：US20200038310A1
公开(公告)日：2020-02-06
申请号：US16441844
申请日：2019-06-14
申请人： Takenori SUENAGA , Masahide Kobayashi , Mitsunobu Morita , Takashi Okada , Soh Noguchi , Tatsuki Yamaguchi
发明人： Takenori SUENAGA , Masahide Kobayashi , Mitsunobu Morita , Takashi Okada , Soh Noguchi , Tatsuki Yamaguchi
IPC分类号： A61K8/87 , A61Q3/02
摘要： Provided is a composition including: an acrylamide compound represented by general formula (1) below; urethane (meth)acrylate having a SI value of 3 or less in a skin sensitization test; and a polymerization initiator having a molecular weight of 800 or greater, where in general formula (1), R1 represents an alkyl group containing 1 through 6 carbon atoms, X represents an alkylene group containing 1 through 6 carbon atoms, and Y represents any one selected from the group consisting of general formula (2) below and general formula (3) below, where in general formula (2), R2 represents an alkyl group containing 1 through 10 carbon atoms, and * represents a binding site with X above, where in general formula (3), R2 represents an alkyl group containing 1 through 10 carbon atoms, and * represents a binding site with X above.

6. 发明申请

US20200032089A1 COMPOSITION, CURED PRODUCT, STORAGE CONTAINER, IMAGE FORMING APPARATUS, AND IMAGE FORMING METHOD 审中-公开
公开(公告)号：US20200032089A1
公开(公告)日：2020-01-30
申请号：US16426523
申请日：2019-05-30
申请人： Masahide KOBAYASHI , Mitsunobu Morita , Takenori Suenaga , Soh Noguchi , Takashi Okada , Tatsuki Yamaguchi
发明人： Masahide KOBAYASHI , Mitsunobu Morita , Takenori Suenaga , Soh Noguchi , Takashi Okada , Tatsuki Yamaguchi
IPC分类号： C09D11/38 , B41M7/00
摘要： Provided is a composition including an acrylamide compound (A1) having a molecular weight of 150 or greater but 250 or less, and a trifunctional or higher polymerizable compound (A2), wherein an amount of the trifunctional or higher polymerizable compound (A2) is 1% by mass or greater but 30% by mass or less relative to a total amount of the composition.

7. 发明授权

US10093693B2 Electrochromic compound, electrochromic composition, and display element 有权
公开(公告)号：US10093693B2
公开(公告)日：2018-10-09
申请号：US14433176
申请日：2013-11-01
申请人： Toshiya Sagisaka , Hiroyuki Takahashi , Takashi Okada , Shigenobu Hirano , Tohru Yashiro , Koh Fujimura , Yoshihisa Naijo , Yoshinori Okada , Kazuaki Tsuji , Sukchan Kim , Keiichiroh Yutani , Tamotsu Horiuchi , Mamiko Inoue
发明人： Toshiya Sagisaka , Hiroyuki Takahashi , Takashi Okada , Shigenobu Hirano , Tohru Yashiro , Koh Fujimura , Yoshihisa Naijo , Yoshinori Okada , Kazuaki Tsuji , Sukchan Kim , Keiichiroh Yutani , Tamotsu Horiuchi , Mamiko Inoue
IPC分类号： C07D401/10 , C07D401/14 , C07F9/6558 , C09K9/02 , C07F9/58 , C07F7/08 , G02F1/15
摘要： To provide an electrochromic compound, represented by the following general formula (I): General Formula (I) where X1, X2, X3, X4, X5, X6, X7 and X8 are each independently a hydrogen atom or a monovalent substituent; R1 and R2 are each independently a monovalent substituent; A− and B− are each independently a monovalent anion; and Y is represented by the following general formula (II) or (III): General Formula (II) General Formula (III) where X9, X10, X11, X12, X13, X14, X15, X16, X17, and X18 are each independently a hydrogen atom or a monovalent substituent.

8. 发明授权

US09288811B2 Base station device and mobile communication method 有权
标题翻译：基站设备和移动通信方式
公开(公告)号：US09288811B2
公开(公告)日：2016-03-15
申请号：US13500511
申请日：2010-10-06
申请人： Hiromasa Umeda , Takashi Okada , Hiroyuki Ishii
发明人： Hiromasa Umeda , Takashi Okada , Hiroyuki Ishii
IPC分类号： H04L12/28 , H04W72/08 , H04W88/08 , H04W72/04
CPC分类号： H04W72/082 , H04L5/001 , H04W72/0446 , H04W72/0453 , H04W88/08
摘要： To reduce deterioration of a downlink signal when a multicarrier transmission is performed. A base station device eNB according to the present invention communication system includes: an uplink signal reception unit 17 configured to receive an uplink signal in a first carrier and an uplink signal in a second carrier, the uplink signal being transmitted from a user equipment UE; and a downlink signal transmission unit 15 configured to transmit a downlink signal in the first carrier and a downlink signal in the second carrier to the user equipment UE, wherein the downlink signal transmission unit 15 is configured to decide whether to transmit the downlink signal in the first carrier based on whether the uplink signal reception unit 17 receives the uplink signal in the second carrier.
摘要翻译：为了减少执行多载波传输时的下行链路信号的恶化。根据本发明的通信系统的基站设备eNB包括：上行链路信号接收单元17，被配置为在第一载波中接收上行链路信号，并在第二载波中接收上行链路信号，所述上行链路信号从用户设备UE发送; 以及下行链路信号发送单元15，被配置为向所述用户设备UE发送所述第一载波中的下行链路信号和所述第二载波中的下行链路信号，其中，所述下行链路信号发送单元15被配置为决定是否发送所述下行链路信号第一载波基于上行链路信号接收单元17是否在第二载波中接收到上行链路信号。

9. 发明授权

US09224959B2 Method for producing a pi-electron conjugated compound 有权
标题翻译： π-电子共轭化合物的制造方法
公开(公告)号：US09224959B2
公开(公告)日：2015-12-29
申请号：US14172572
申请日：2014-02-04
申请人： Daisuke Goto , Satoshi Yamamoto , Toshiya Sagisaka , Takuji Kato , Takashi Okada , Masato Shinoda , Shinji Matsumoto , Masataka Mohri , Keiichiro Yutani
发明人： Daisuke Goto , Satoshi Yamamoto , Toshiya Sagisaka , Takuji Kato , Takashi Okada , Masato Shinoda , Shinji Matsumoto , Masataka Mohri , Keiichiro Yutani
IPC分类号： C07D495/02 , H01L51/00 , C07C1/213 , C07C15/20 , C07C15/24 , C07C15/28 , C07C15/38 , C07C15/56 , C07C15/58 , C07C15/60 , C07C17/093 , C07C17/10 , C07C17/361 , C07C25/22 , C07C69/013 , C07C69/18 , C07C69/63 , C07D321/00 , C07D409/14 , C07D495/04 , C07D495/06 , H01L51/05
CPC分类号： H01L51/0052 , C07C1/213 , C07C15/20 , C07C15/24 , C07C15/28 , C07C15/38 , C07C15/56 , C07C15/58 , C07C15/60 , C07C17/093 , C07C17/10 , C07C17/361 , C07C25/22 , C07C69/013 , C07C69/18 , C07C69/63 , C07C2602/10 , C07C2603/24 , C07C2603/44 , C07C2603/50 , C07C2603/52 , C07D321/00 , C07D409/14 , C07D495/04 , C07D495/06 , H01L51/0074 , H01L51/0558
摘要： A leaving substituent-containing compound including a partial structure represented by the following General Formula (I): where a pair of X1 and X2 or a pair of Y1 and Y2 each represent a hydrogen atom; the other pair each represent a group selected from the group consisting of a halogen atom and a substituted or unsubstituted acyloxy group having one or more carbon atoms; a pair of the acyloxy groups represented by the pair of X1 and X2 or the pair of Y1 and Y2 may be identical or different, or may be bonded together to form a ring; R1 to R4 each represent a hydrogen atom or a substituent; and Q1 and Q2 each represent a hydrogen atom, a halogen atom or a monovalent organic group, and may be bonded together to form a ring.
摘要翻译：含有由以下通式（I）表示的部分结构的含有取代基的化合物：其中一对X1和X2或一对Y1和Y2各自表示氢原子; 另一对各自表示选自卤原子和具有一个或多个碳原子的取代或未取代的酰氧基的基团; 由一对X1和X2表示的一对酰氧基或一对Y1和Y2可以相同或不同，或者可以结合在一起形成环; R 1〜R 4各自表示氢原子或取代基; 并且Q1和Q2各自表示氢原子，卤素原子或一价有机基团，并且可以结合在一起形成环。

10. 发明授权

US09028949B2 Substrate for printed wiring and resin composition used therefor 有权
标题翻译：用于印刷线路的基板和用于其的树脂组合物
公开(公告)号：US09028949B2
公开(公告)日：2015-05-12
申请号：US13503023
申请日：2010-10-20
申请人： Motoki Okaniwa , Toshimitsu Kikuchi , Takaaki Uno , Takashi Okada
发明人： Motoki Okaniwa , Toshimitsu Kikuchi , Takaaki Uno , Takashi Okada
IPC分类号： C08G65/40 , H05K1/03 , C08G75/23
CPC分类号： H05K1/0326 , C08G65/40 , C08G65/4006 , C08G75/23 , C08G2650/40 , Y10S428/901 , Y10T428/24802 , Y10T428/31678
摘要： There are provided a substrate for printed wiring excellent in light transmission property, heat resistance, mechanical strength and resistance to thermal coloration; a printed wiring laminate; and a resin composition used to produce the substrate and the laminate. The substrate for printed wiring comprises an aromatic polyether-typed polymer having a glass transition temperature, as measured by differential scanning calorimetry (DSC, heating rate: 20° C./minute), of from 230° C. to 350° C.
摘要翻译：提供了透光性，耐热性，机械强度和耐热着色性优异的印刷配线用基板。印刷布线层压板; 以及用于制造基材和层压体的树脂组合物。印刷布线用基材包括通过差示扫描量热法（DSC，加热速度：20℃/分钟）测定的玻璃化转变温度为230℃〜350℃的芳香族聚醚型聚合物。

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