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    • 5. 发明授权
    • Armature coil winder
    • 电枢绕线机
    • US06502299B2
    • 2003-01-07
    • US09423735
    • 1999-12-13
    • Akihiko YamazakiManabu OkamotoKazuo Kimura
    • Akihiko YamazakiManabu OkamotoKazuo Kimura
    • H02K1502
    • H02K15/09Y10T29/49009Y10T29/49012Y10T29/49071Y10T29/49073Y10T29/5141Y10T29/53143Y10T29/53157
    • In order to realize thinned armatures, a winder which winds coils at a high density while restricting coil ends within a restricted space is provided. An armature coil winder for winding coils in an armature core assembly having a plurality of slots in an outer circumference thereof comprising a winding former equipped with a fixed former which guides a coil into two slots and a movable former which restricts a position of a coil end between the slots by moving in the fixed former along both end surfaces of an armature core toward a center thereof, a former slider which shifts the movable former to a specified position, and coil shaping mechanism which is disposed at location other than that of the former slider and equipped with coil shaping blades functioning to shape the coil in the slots, thereby making it possible to wind coils at a high density by effectively utilizing winding spaces.
    • 为了实现减薄的电枢,提供了一种在限制空间内限制线圈端部的情况下以高密度缠绕的绕线器。 一种用于在电枢铁芯组件中缠绕线圈的电枢线圈绕线器,其具有在其外圆周上的多个槽,所述衔铁绕组装备有配备有将线圈引导到两个槽中的固定成形器的绕组架,以及限制线圈端 通过沿着电枢铁心的两个端面向着其中心在固定的成形器中移动的槽之间,将可移动成形器移动到特定位置的前滑块和设置在与前者不同的位置的线圈成形机构 滑块,并配备有线圈成型刀片,其用于使线圈在槽中成形,从而可以通过有效地利用缠绕空间来以高密度缠绕线圈。
    • 8. 发明授权
    • Resinous circuit board with pins improved in joining strength
    • 带引脚的树脂电路板提高了接合强度
    • US06376782B1
    • 2002-04-23
    • US09494174
    • 2000-01-31
    • Kazuo KimuraHajime SaikiMitsuo ShiraishiYosuke Kondo
    • Kazuo KimuraHajime SaikiMitsuo ShiraishiYosuke Kondo
    • H05K111
    • H05K3/3426H01L23/49811H01L2924/0002H01L2924/15312H01R4/02H05K3/3463Y02P70/613H01L2924/00
    • In a resinous circuit board having a circuitized substrate having conductive layers therewithin, a plurality of pin pads formed on a rear surface of the substrate, and a plurality of pins, each pin having a tip end portion and a head portion and soldered to the pin pad in such a manner as to contact at the head portion to the pin pad. The head portion of the pin consists of a flange section which is larger in diameter than the tip end portion, and a part-spherical abutment section bulging from the flange section in the direction opposite to the tip end portion and brought into contact with the pin pad. The part-spherical abutment section is made of eutectic silver solder which is lower in melting point than solder such as Sn—Ag solder which is used for soldering the pin to the pin pad. Since the silver solder and soft solder are present between the flange section and the pin pad, they can release the stress applied to the pin, thus making it possible to increase the joining strength considerably. Further, the above structure can dispense with holes which are formed in the circuitized substrate and in which pins are press-fitted and fixed as in the prior art circuit board.
    • 在其中具有导电层的电路化基板的树脂电路板中,形成在基板的后表面上的多个引脚焊盘和多个引脚,每个引脚具有尖端部分和头部,并焊接到引脚 垫以这样的方式在头部与销垫接触。 销的头部由直径大于前端部的凸缘部和与前端部相反方向从凸缘部凸出的部分球形抵接部,与销的接触部 垫。 部分球形邻接部分由共熔银焊料制成,其熔点低于诸如Sn-Ag焊料的焊料,其用于将引脚焊接到引脚焊盘。 由于银焊料和软焊料存在于凸缘部分和销焊盘之间,它们可以释放施加到销的应力,从而可以显着提高接合强度。 此外,如现有技术的电路板那样,上述结构可以省略形成在电路化基板中的孔,并且其中的销被压入和固定。
    • 9. 发明授权
    • Manufacturing method for calcium fluoride and calcium fluoride for photolithography
    • US06332922B1
    • 2001-12-25
    • US09257296
    • 1999-02-25
    • Shigeru SakumaTsutomu MizugakiKazuo KimuraShuuichi Takano
    • Shigeru SakumaTsutomu MizugakiKazuo KimuraShuuichi Takano
    • C30B3306
    • G03F7/70958C30B29/12C30B33/00G02B1/02G03F7/70966Y10S117/906
    • A manufacturing method for a single crystal of calcium fluoride by which it is possible to obtain a single crystal of calcium fluoride with adequately small double refraction, which can be used in optical systems for photolithography, and in particular, a single crystal of calcium fluoride with a large diameter (ø 200 mm or larger) having superior optical properties, which can be used for photolithography with a wavelength of 250 nm or less. A manufacturing method for a single crystal of calcium fluoride, having its optical properties improved through an annealing process in which a single crystal of calcium fluoride is contained in a sealable container, and said container is sealed and vacuumed, followed by, a process of heating with a heater arranged external to said container so that the temperature inside said container is raised to a first temperature, which is lower than the melting point of said single crystal of calcium fluoride, a process by which the temperature inside said container is maintained at said first temperature for a designated period of time, and a process by which the temperature inside said container is lowered to room temperature, wherein, the maximum temperature of the annealing process is set to be a first temperature within the range of 1020 to 1150° C. Also provided is a manufacturing method for a single crystal of calcium fluoride having its optical properties improved through an annealing process such that, its maximum temperature during the thermal process is set to a first temperature which is within the range of 1020 to 1150° C., and which is maintained for a designated period of time, and its cooling speed for reaching a second temperature, which is in the range of (or around) 600 to 800° C., from said first temperature is set to be 1.2° C./hour or less, or its cooling speed for reaching a second temperature, which is in the range of (or around) 700 to 900° C., from said first temperature is set to be 1.2° C./hour or less.