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1. 发明授权

US07357883B2 Conductive adhesive, method of producing the same, and bonding method 失效
标题翻译：导电胶，其制造方法和粘接方法
公开(公告)号：US07357883B2
公开(公告)日：2008-04-15
申请号：US11500307
申请日：2006-08-08
申请人： Yasunori Ninomiya , Masashi Totokawa , Hirokazu Imai , Yukinori Migitaka
发明人： Yasunori Ninomiya , Masashi Totokawa , Hirokazu Imai , Yukinori Migitaka
IPC分类号： H01B1/00 , H01B1/12
CPC分类号： H01B1/22 , H05K3/321 , H05K2201/0218 , H05K2201/0257 , H05K2201/0272 , Y10T428/12882 , Y10T428/12903 , Y10T428/29 , Y10T428/2933
摘要： A conductive adhesive is formed by mixing a plurality of conductive fillers into a thermosetting resin. The conductive filler includes a core material made of copper-based metal, a coating film made of silver and a plurality of particles made of silver. The coating film is provided on the core material to cover the core material, and the particles are provided on a surface of the coating film. Accordingly, a surface of the core material is prevented from being exposed. The conductive adhesive can be suitably used for bonding two members.
摘要翻译：通过将多种导电填料混合到热固性树脂中形成导电粘合剂。导电填料包括由铜基金属制成的芯材，由银制成的涂膜和多个由银制成的颗粒。涂覆膜设置在芯材上以覆盖芯材，并且将颗粒设置在涂膜的表面上。因此，防止芯材的表面露出。导电粘合剂可以适合用于粘接两个部件。

2. 发明申请

US20070075299A1 Conductive adhesive, method of producing the same, and bonding method 失效
标题翻译：导电胶，其制造方法和粘接方法
公开(公告)号：US20070075299A1
公开(公告)日：2007-04-05
申请号：US11500307
申请日：2006-08-08
申请人： Yasunori Ninomiya , Masashi Totokawa , Hirokazu Imai , Yukinori Migitaka
发明人： Yasunori Ninomiya , Masashi Totokawa , Hirokazu Imai , Yukinori Migitaka
IPC分类号： H01B1/12
CPC分类号： H01B1/22 , H05K3/321 , H05K2201/0218 , H05K2201/0257 , H05K2201/0272 , Y10T428/12882 , Y10T428/12903 , Y10T428/29 , Y10T428/2933
摘要： A conductive adhesive is formed by mixing a plurality of conductive fillers into a thermosetting resin. The conductive filler includes a core material made of copper-based metal, a coating film made of silver and a plurality of particles made of silver. The coating film is provided on the core material to cover the core material, and the particles are provided on a surface of the coating film. Accordingly, a surface of the core material is prevented from being exposed. The conductive adhesive can be suitably used for bonding two members.
摘要翻译：通过将多种导电填料混合到热固性树脂中形成导电粘合剂。导电填料包括由铜基金属制成的芯材，由银制成的涂膜和多个由银制成的颗粒。涂覆膜设置在芯材上以覆盖芯材，并且将颗粒设置在涂膜的表面上。因此，防止芯材的表面露出。导电粘合剂可以适合用于粘接两个部件。

3. 发明申请

US20070185243A1 Conductive adhesive 有权
标题翻译：导电胶
公开(公告)号：US20070185243A1
公开(公告)日：2007-08-09
申请号：US10597937
申请日：2005-02-09
申请人： Nobuto Terada , Naoto Shioi , Masashi Totokawa , Yasunori Ninomiya
发明人： Nobuto Terada , Naoto Shioi , Masashi Totokawa , Yasunori Ninomiya
IPC分类号： C08L63/00 , B32B27/38
CPC分类号： C09J163/00 , C08G59/42 , C08L63/00 , C09J9/02 , H01B1/22 , H05K3/321 , H05K2201/0239
摘要： The present invention provides a conductive adhesive that is applicable as means for forming conductive junction to process for surface mounting of electronic parts for vehicle loading and process for the manufacture of the electronic parts per se for the purpose of substituting soldering therewith. The conductive adhesive according to the present invention is a conductive adhesive produced by dispersing a conductive medium, such as silver powder, in a binder resin component of a one-component epoxy thermosetting resin which has such a composition that the resin comprises, as essential components, an epoxy resin component composed mainly of an epoxy compound with a polycyclic aromatic ring skeleton, and a cyclic acid anhydride as a curing agent component thereof, and is further added with a coupling agent as an adherence imparting agent therefor.
摘要翻译：本发明提供一种导电粘合剂，其可用作用于形成用于车辆装载的电子部件的表面安装的用于形成导电结的装置和用于制造电子部件本身的工艺，以便用其代替焊接。根据本发明的导电粘合剂是通过将诸如银粉的导电介质分散在单组分环氧热固性树脂的粘合剂树脂组分中制成的导电粘合剂，其具有树脂包含的组成，作为必要组分，主要由具有多环芳族环骨架的环氧化合物组成的环氧树脂组分和环状酸酐作为其固化剂组分，并进一步加入偶联剂作为粘合赋予剂。

4. 发明申请

US20070074391A1 Method of producing circuit board 有权
标题翻译：电路板生产方法
公开(公告)号：US20070074391A1
公开(公告)日：2007-04-05
申请号：US11503896
申请日：2006-08-14
申请人： Masashi Totokawa , Yasunori Ninomiya
发明人： Masashi Totokawa , Yasunori Ninomiya
IPC分类号： H05K3/10 , H01K3/22
CPC分类号： H05K1/097 , H05K3/4069 , H05K3/4617 , H05K3/4632 , H05K2201/0129 , H05K2201/0266 , H05K2203/1131 , Y10T29/49126 , Y10T29/49128 , Y10T29/49155 , Y10T29/49163 , Y10T29/49165
摘要： A method of producing a circuit board includes a step of providing a conductive paste including metal nano-particles at an insulating substrate, and a step of sintering the conductive paste so as to form a circuit conductor. In the sintering step, the conductive paste is sintered in a low-oxygen condition including alcohol such that the metal nano-particles are sintered.
摘要翻译：制造电路板的方法包括在绝缘基板上提供包含金属纳米颗粒的导电糊料的步骤，以及烧结导电浆料以形成电路导体的步骤。在烧结步骤中，导电浆料在包含醇的低氧条件下烧结，使得金属纳米粒子被烧结。

5. 发明申请

US20110034032A1 Method of formation or thermal spray coating 审中-公开
标题翻译：形成方法或热喷涂
公开(公告)号：US20110034032A1
公开(公告)日：2011-02-10
申请号：US12802497
申请日：2010-06-08
申请人： Toshiki Itoh , Kouzou Yoshimura , Ryonosuke Tera , Masashi Totokawa , Yasunori Ninomiya
发明人： Toshiki Itoh , Kouzou Yoshimura , Ryonosuke Tera , Masashi Totokawa , Yasunori Ninomiya
IPC分类号： H01L21/30
CPC分类号： C23C4/134 , C23C4/11 , H01L24/73 , H01L2224/32245 , H01L2224/33181 , H01L2224/48091 , H01L2224/48247 , H01L2224/73215 , H01L2224/73265 , H01L2924/181 , H01L2924/00012 , H01L2924/00014
摘要： A method of formation of a thermal spray coating which forms a thermal spray coating on a coating-forming surface, characterized by comprising a thermal spraying step of thermally spraying feedstock powder on the coating-forming surface and a deposition and coating forming step of having the thermally sprayed feedstock powder deposit on the coating-forming surface and solidify to form a coating, in the deposition and coating forming step, when deposited on the coating-forming surface by thermal spraying, the feedstock powder deposits in the solid phase state in 50 to 90%, preferably 70 to 80%, of the whole so as to raise the ratio of the crystallite remaining in the feedstock powder and secure a high heat conductivity.
摘要翻译：一种形成热喷涂层的方法，其在涂层形成表面上形成热喷涂，其特征在于包括在喷涂形成表面上热喷涂原料粉末的热喷涂步骤，以及沉积和涂层形成步骤，热喷涂原料粉末沉积在涂层形成表面上并固化形成涂层，在沉积和涂层形成步骤中，当通过热喷涂沉积在涂层形成表面上时，原料粉末以50〜 90％，优选70〜80％，以提高原料粉末中残留的微晶的比例，确保高导热性。

6. 发明授权

US07458150B2 Method of producing circuit board 有权
标题翻译：电路板生产方法
公开(公告)号：US07458150B2
公开(公告)日：2008-12-02
申请号：US11503896
申请日：2006-08-14
申请人： Masashi Totokawa , Yasunori Ninomiya
发明人： Masashi Totokawa , Yasunori Ninomiya
IPC分类号： H01K3/10
CPC分类号： H05K1/097 , H05K3/4069 , H05K3/4617 , H05K3/4632 , H05K2201/0129 , H05K2201/0266 , H05K2203/1131 , Y10T29/49126 , Y10T29/49128 , Y10T29/49155 , Y10T29/49163 , Y10T29/49165
摘要： A method of producing a circuit board includes a step of providing a conductive paste including metal nano-particles at an insulating substrate, and a step of sintering the conductive paste so as to form a circuit conductor. In the sintering step, the conductive paste is sintered in a low-oxygen condition including alcohol such that the metal nano-particles are sintered.
摘要翻译：制造电路板的方法包括在绝缘基板上提供包含金属纳米颗粒的导电糊料的步骤，以及烧结导电浆料以形成电路导体的步骤。在烧结步骤中，导电浆料在包含醇的低氧条件下烧结，使得金属纳米粒子被烧结。

7. 发明授权

US07524893B2 Conductive adhesive 有权
标题翻译：导电胶
公开(公告)号：US07524893B2
公开(公告)日：2009-04-28
申请号：US10597937
申请日：2005-02-09
申请人： Nobuto Terada , Naoto Shioi , Masashi Totokawa , Yasunori Ninomiya
发明人： Nobuto Terada , Naoto Shioi , Masashi Totokawa , Yasunori Ninomiya
IPC分类号： C08K5/04
CPC分类号： C09J163/00 , C08G59/42 , C08L63/00 , C09J9/02 , H01B1/22 , H05K3/321 , H05K2201/0239
摘要： The present invention provides a conductive adhesive that is applicable as means for forming conductive junction to process for surface mounting of electronic parts for vehicle loading and process for the manufacture of the electronic parts per se for the purpose of substituting soldering therewith. The conductive adhesive according to the present invention is a conductive adhesive produced by dispersing a conductive medium, such as silver powder, in a binder resin component of a one-component epoxy thermosetting resin which has such a composition that the resin comprises, as essential components, an epoxy resin component composed mainly of an epoxy compound with a polycyclic aromatic ring skeleton, and a cyclic acid anhydride as a curing agent component thereof, and is further added with a coupling agent as an adherence imparting agent therefor.
摘要翻译：本发明提供一种导电粘合剂，其可用作用于形成用于车辆装载的电子部件的表面安装的用于形成导电结的装置和用于制造电子部件本身的工艺，以便用其代替焊接。根据本发明的导电粘合剂是通过将诸如银粉的导电介质分散在单组分环氧热固性树脂的粘合剂树脂组分中制成的导电粘合剂，其具有树脂包含的组成，作为必要组分，主要由具有多环芳族环骨架的环氧化合物组成的环氧树脂组分和环状酸酐作为其固化剂组分，并进一步加入偶联剂作为粘合赋予剂。

8. 发明授权

US07541574B2 Sensor device 失效
标题翻译：传感器装置
公开(公告)号：US07541574B2
公开(公告)日：2009-06-02
申请号：US11802612
申请日：2007-05-24
申请人： Yasunori Ninomiya , Ryuichiro Abe
发明人： Yasunori Ninomiya , Ryuichiro Abe
IPC分类号： G01P15/00 , H01J5/02
CPC分类号： G01P15/125 , G01P1/023 , G01P15/0802 , G01P2015/0814
摘要： A sensor device includes a board, a sensor element and a resin member made of resin. The sensor element has a displace part to be displaced in a predetermined detection direction, and detects a displace amount of the displace part in the detection direction. The sensor element is mounted and connected to the board through the resin member. The resin member is arranged between the sensor element and the board in part such that a warp of the sensor element in the detection direction due to a temperature variation is smaller than a warp of the sensor element in a direction except for the detection direction.
摘要翻译：传感器装置包括板，传感器元件和树脂制的树脂构件。传感器元件具有在预定检测方向上移位的位移部，并且检测位移部在检测方向上的位移量。传感器元件通过树脂构件安装并连接到板。树脂构件部分地布置在传感器元件和板之间，使得由于温度变化而导致的检测方向上的传感器元件的翘曲小于除了检测方向以外的方向上的传感器元件的翘曲。

9. 发明申请

US20070284713A1 Sensor device 失效
标题翻译：传感器装置
公开(公告)号：US20070284713A1
公开(公告)日：2007-12-13
申请号：US11802612
申请日：2007-05-24
申请人： Yasunori Ninomiya , Ryuichiro Abe
发明人： Yasunori Ninomiya , Ryuichiro Abe
IPC分类号： H01L23/02
CPC分类号： G01P15/125 , G01P1/023 , G01P15/0802 , G01P2015/0814
摘要： A sensor device includes a board, a sensor element and a resin member made of resin. The sensor element has a displace part to be displaced in a predetermined detection direction, and detects a displace amount of the displace part in the detection direction. The sensor element is mounted and connected to the board through the resin member. The resin member is arranged between the sensor element and the board in part such that a warp of the sensor element in the detection direction due to a temperature variation is smaller than a warp of the sensor element in a direction except for the detection direction.
摘要翻译：传感器装置包括板，传感器元件和树脂制的树脂构件。传感器元件具有在预定检测方向上移位的位移部，并且检测位移部在检测方向上的位移量。传感器元件通过树脂构件安装并连接到板。树脂构件部分地布置在传感器元件和板之间，使得由于温度变化而导致的检测方向上的传感器元件的翘曲小于除了检测方向以外的方向上的传感器元件的翘曲。

10. 发明申请

US20070090536A1 Sensor having semiconductor chip and circuit chip 审中-公开
标题翻译：传感器具有半导体芯片和电路芯片
公开(公告)号：US20070090536A1
公开(公告)日：2007-04-26
申请号：US11522916
申请日：2006-09-19
申请人： Minekazu Sakai , Ryuichiro Abe , Yasunori Ninomiya
发明人： Minekazu Sakai , Ryuichiro Abe , Yasunori Ninomiya
IPC分类号： H01L23/48
CPC分类号： G01C19/5719 , B81C1/0023 , G01P1/023 , H01L2224/05568 , H01L2224/05573 , H01L2224/05624 , H01L2224/16 , H01L2924/01068 , H01L2924/01079 , H01L2924/1305 , H01L2924/13091 , H01L2924/00 , H01L2924/00014
摘要： A sensor includes: a semiconductor chip having a sensing portion; a circuit chip; and first and second films. The sensing portion is disposed on a first side of the semiconductor chip. The first side of the semiconductor chip is electrically connected to the circuit chip through a bump. The first side of the semiconductor chip faces the circuit chip. The first film is disposed on the first side of the semiconductor chip. The first film covers the sensing portion, and is made of resin, and the second film is made of resin, and disposed on a second side of the semiconductor chip.
摘要翻译：传感器包括：具有感测部分的半导体芯片; 电路芯片; 第一和第二部电影。感测部分设置在半导体芯片的第一侧上。半导体芯片的第一侧通过凸块与电路芯片电连接。半导体芯片的第一面面向电路芯片。第一膜设置在半导体芯片的第一侧上。第一膜覆盖感测部分，并且由树脂制成，第二膜由树脂制成，并且设置在半导体芯片的第二侧上。

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