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1. 发明授权

US09283927B2 Webbing take-up device 有权
标题翻译：织带收卷装置
公开(公告)号：US09283927B2
公开(公告)日：2016-03-15
申请号：US13555535
申请日：2012-07-23
申请人： Yasunori Hata , Akira Sumiyashiki
发明人： Yasunori Hata , Akira Sumiyashiki
IPC分类号： B60R22/34
CPC分类号： B60R22/341 , B60R2022/3402
摘要： A webbing take-up device is provided capable of preventing or suppressing a frame from deforming such that one of leg-plates or a back-plate displaces towards the other. A face on the center of curvature side of a curved portion of a front back plate section configuring the frame and a one width direction edge namely an upper edge of a bar support face each other along the up-low direction. When the front edge sides of leg-plates are displaced to rise due to a webbing being pulled, the one width direction edge of the bar support interferes with a front end of the front back plate section to prevent or suppress the front edge sides of the leg-plates from rising further. Deformation of the frame caused by the front edge sides of the leg-plates to rise can accordingly be prevented or suppressed.
摘要翻译：提供一种能够防止或抑制框架变形的带状卷取装置，使得一个腿板或背板朝向另一个移动。构成框架的前后板部的弯曲部的曲率中心的面和沿着上下方向的杆支撑面的上边缘的一个宽度方向的边缘。当由于被拉动的织带而使脚板的前边缘侧移动而上升时，杆支撑的一个宽度方向边缘与前后板部分的前端相干扰以防止或抑制前侧边缘腿板从进一步上升。因此可以防止或抑制由腿板的前缘侧引起的框架的变形。

2. 发明授权

US08552442B2 Semiconductor light emitting device 有权
公开(公告)号：US08552442B2
公开(公告)日：2013-10-08
申请号：US12218239
申请日：2008-07-11
申请人： Yasunori Hata , Masahiko Kobayakawa
发明人： Yasunori Hata , Masahiko Kobayakawa
IPC分类号： H01L33/00
CPC分类号： H01L33/486 , H01L33/62 , H01L2224/48091 , H01L2224/48247 , H01L2924/00012 , H01L2924/00014
摘要： A semiconductor light emitting device includes a semiconductor light emitting element, a lead electrically connected to the semiconductor light emitting element, and a resin package covering the semiconductor light emitting element and part of the lead. The resin package includes a lens facing the front of the semiconductor light emitting element. The lead includes an elongated mounting portion projecting from the resin package. The mounting portion includes a pair of first projections spaced from each other in the longitudinal direction and a second projection positioned between the first projections. The first projections and the second projection project in opposite directions from each other in the width direction of the mounting portion.

3. 发明申请

US20100102349A1 SEMICONDUCTOR LIGHT-EMITTING DEVICE 有权
标题翻译：半导体发光器件
公开(公告)号：US20100102349A1
公开(公告)日：2010-04-29
申请号：US12594270
申请日：2008-03-28
申请人： Yasunori Hata
发明人： Yasunori Hata
IPC分类号： H01L33/00
CPC分类号： H01L33/62 , H01L24/32 , H01L33/60 , H01L33/647 , H01L2224/32245 , H01L2224/48091 , H01L2224/48247 , H01L2224/73265 , H01L2924/00014
摘要： A semiconductor light emitting device (A) includes a semiconductor light emitting element (2) including a light emitting layer (22), a lead (1) formed with a reflector (11) that surrounds the semiconductor light emitting element (2), a light transmitting resin (4) covering the semiconductor light emitting element (2). The reflector (11) of the lead (1) includes a recess (12) at the bottom surface. The semiconductor light emitting element (2) is mounted to a bottom surface of the recess (12), with the light emitting layer (22) positioned outside the recess (12). A highly heat conductive material (3) having a thermal conductivity higher than that of the light transmitting resin (4) is loaded between the semiconductor light emitting element (2) and the recess (12).
摘要翻译：半导体发光器件（A）包括包括发光层（22）的半导体发光元件（2），形成有围绕半导体发光元件（2）的反射器（11）的引线（1），覆盖半导体发光元件（2）的透光树脂（4）。引线（1）的反射器（11）在底面包括凹部（12）。半导体发光元件（2）安装到凹部（12）的底表面，发光层（22）位于凹部（12）的外侧。导热率高于透光树脂（4）的导热性高的材料（3）被装载在半导体发光元件（2）和凹部（12）之间。

4. 发明申请

US20090039372A1 Semiconductor light emitting device 有权
标题翻译：半导体发光器件
公开(公告)号：US20090039372A1
公开(公告)日：2009-02-12
申请号：US12218239
申请日：2008-07-11
申请人： Yasunori Hata , Masahiko Kobayakawa
发明人： Yasunori Hata , Masahiko Kobayakawa
IPC分类号： H01L33/00
CPC分类号： H01L33/486 , H01L33/62 , H01L2224/48091 , H01L2224/48247 , H01L2924/00012 , H01L2924/00014
摘要： A semiconductor light emitting device includes a semiconductor light emitting element, a lead electrically connected to the semiconductor light emitting element, and a resin package covering the semiconductor light emitting element and part of the lead. The resin package includes a lens facing the front of the semiconductor light emitting element. The lead includes an elongated mounting portion projecting from the resin package. The mounting portion includes a pair of first projections spaced from each other in the longitudinal direction and a second projection positioned between the first projections. The first projections and the second projection project in opposite directions from each other in the width direction of the mounting portion.
摘要翻译：半导体发光器件包括半导体发光元件，与半导体发光元件电连接的引线以及覆盖半导体发光元件和引线的一部分的树脂封装。树脂封装包括面向半导体发光元件前部的透镜。引线包括从树脂封装突出的细长安装部分。安装部分包括在纵向上彼此间隔开的一对第一突起和位于第一突起之间的第二突起。第一突起和第二突起在安装部的宽度方向上彼此相反的方向突出。

5. 外观设计

USD576572S1 Light emitting diode module 有权
公开(公告)号：USD576572S1
公开(公告)日：2008-09-09
申请号：US29294417
申请日：2008-01-10
申请人： Yasunori Hata , Masahiko Kobayakawa
设计人： Yasunori Hata , Masahiko Kobayakawa

6. 发明授权

US08227829B2 Semiconductor light-emitting device 有权
标题翻译：半导体发光装置
公开(公告)号：US08227829B2
公开(公告)日：2012-07-24
申请号：US13235973
申请日：2011-09-19
申请人： Yasunori Hata
发明人： Yasunori Hata
IPC分类号： H01L33/00
CPC分类号： H01L33/62 , H01L24/32 , H01L33/60 , H01L33/647 , H01L2224/32245 , H01L2224/48091 , H01L2224/48247 , H01L2224/73265 , H01L2924/00014
摘要： A semiconductor light emitting device (A) includes a semiconductor light emitting element (2) including a light emitting layer (22), a lead (1) formed with a reflector (11) that surrounds the semiconductor light emitting element (2), a light transmitting resin (4) covering the semiconductor light emitting element (2). The reflector (11) of the lead (1) includes a recess (12) at the bottom surface. The semiconductor light emitting element (2) is mounted to a bottom surface of the recess (12), with the light emitting layer (22) positioned outside the recess (12). A highly heat conductive material (3) having a thermal conductivity higher than that of the light transmitting resin (4) is loaded between the semiconductor light emitting element (2) and the recess (12).
摘要翻译：半导体发光器件（A）包括包括发光层（22）的半导体发光元件（2），形成有围绕半导体发光元件（2）的反射器（11）的引线（1），覆盖半导体发光元件（2）的透光树脂（4）。引线（1）的反射器（11）在底面包括凹部（12）。半导体发光元件（2）安装到凹部（12）的底表面，发光层（22）位于凹部（12）的外侧。导热率高于透光树脂（4）的导热性高的材料（3）被装载在半导体发光元件（2）和凹部（12）之间。

7. 发明授权

US08035124B2 Semiconductor light-emitting device 有权
标题翻译：半导体发光装置
公开(公告)号：US08035124B2
公开(公告)日：2011-10-11
申请号：US12594270
申请日：2008-03-28
申请人： Yasunori Hata
发明人： Yasunori Hata
IPC分类号： H01L33/00
CPC分类号： H01L33/62 , H01L24/32 , H01L33/60 , H01L33/647 , H01L2224/32245 , H01L2224/48091 , H01L2224/48247 , H01L2224/73265 , H01L2924/00014
摘要： A semiconductor light emitting device (A) includes a semiconductor light emitting element (2) including a light emitting layer (22), a lead (1) formed with a reflector (11) that surrounds the semiconductor light emitting element (2), a light transmitting resin (4) covering the semiconductor light emitting element (2). The reflector (11) of the lead (1) includes a recess (12) at the bottom surface. The semiconductor light emitting element (2) is mounted to a bottom surface of the recess (12), with the light emitting layer (22) positioned outside the recess (12). A highly heat conductive material (3) having a thermal conductivity higher than that of the light transmitting resin (4) is loaded between the semiconductor light emitting element (2) and the recess (12).
摘要翻译：半导体发光器件（A）包括包括发光层（22）的半导体发光元件（2），形成有围绕半导体发光元件（2）的反射器（11）的引线（1），覆盖半导体发光元件（2）的透光树脂（4）。引线（1）的反射器（11）在底面包括凹部（12）。半导体发光元件（2）安装到凹部（12）的底表面，发光层（22）位于凹部（12）的外侧。导热率高于透光树脂（4）的导热性高的材料（3）被装载在半导体发光元件（2）和凹部（12）之间。

8. 发明授权

US07868334B2 Semiconductor light emitting device 有权
标题翻译：半导体发光器件
公开(公告)号：US07868334B2
公开(公告)日：2011-01-11
申请号：US12080966
申请日：2008-04-08
申请人： Yasunori Hata , Masahiko Kobayakawa
发明人： Yasunori Hata , Masahiko Kobayakawa
IPC分类号： H01L27/15
CPC分类号： H05K3/3426 , H01L33/486 , H01L33/62 , H01L2224/48091 , H01L2224/48247 , H05K2201/09954 , H05K2201/10106 , Y02P70/613 , H01L2924/00014
摘要： A semiconductor light emitting device includes a semiconductor light emitting element, a lead electrically connected to the semiconductor light emitting element, and a resin package covering the semiconductor light emitting element and part of the lead. The resin package includes a lens facing the semiconductor light emitting element. The lead includes an exposed portion that is not covered by the resin package. The exposed portion includes a first portion and a second portion, where the first portion has a first mount surface oriented backward along the optical axis of the lens, and the second portion has a second mount surface oriented perpendicularly to the optical axis of the lens.
摘要翻译：半导体发光器件包括半导体发光元件，与半导体发光元件电连接的引线以及覆盖半导体发光元件和引线的一部分的树脂封装。树脂封装包括面向半导体发光元件的透镜。引线包括未被树脂封装覆盖的暴露部分。暴露部分包括第一部分和第二部分，其中第一部分具有沿着透镜的光轴向后定向的第一安装表面，并且第二部分具有垂直于透镜的光轴定向的第二安装表面。

9. 发明授权

US08499851B2 Fixed structure of an eccentric rod, and vibration generator 有权
标题翻译：偏心杆的固定结构和振动发生器
公开(公告)号：US08499851B2
公开(公告)日：2013-08-06
申请号：US13554556
申请日：2012-07-20
申请人： Yasunori Hata
发明人： Yasunori Hata
IPC分类号： A46B13/02
CPC分类号： B06B1/16 , A61C17/222 , A61C17/3481
摘要： An electric toothbrush as a vibration generator is provided with a case, a motor, an eccentric rod, a stem, and an oral hygiene member. The eccentric rod has an eccentric weight portion and a rod portion connected to a drive shaft of the motor. The angle between the first central axis of the eccentric weight portion and an extension line, defined by extending the second central axis of the rod portion towards the eccentric weight portion, is greater than 0 degrees and equal to or less than approximately 10 degrees in a state in which one end of the eccentric rod is not inserted into a shaft receiving portion. In this way, a fixed structure of an eccentric rod and a vibration generator are obtained which reduce noise generated by vibration when run at high as well as at low rotation speeds.
摘要翻译：作为振动发生器的电动牙刷设置有壳体，马达，偏心杆，杆和口腔卫生构件。偏心杆具有偏心的重量部分和与电动机的驱动轴连接的杆部分。偏心重块部分的第一中心轴线与通过将杆部分的第二中心轴向偏心重量部分延伸而限定的延伸线之间的角度大于0度并且等于或小于约10度偏心杆的一端未插入轴接收部的状态。以这种方式，获得偏心杆和振动发生器的固定结构，其在高速和低转速下运行时减少由振动产生的噪声。

10. 发明授权

US08076677B2 Semiconductor light emitting device 有权
公开(公告)号：US08076677B2
公开(公告)日：2011-12-13
申请号：US12962150
申请日：2010-12-07
申请人： Yasunori Hata , Masahiko Kobayakawa
发明人： Yasunori Hata , Masahiko Kobayakawa
IPC分类号： H01L27/15
CPC分类号： H05K3/3426 , H01L33/486 , H01L33/62 , H01L2224/48091 , H01L2224/48247 , H05K2201/09954 , H05K2201/10106 , Y02P70/613 , H01L2924/00014
摘要： A semiconductor light emitting device includes a semiconductor light emitting element, a lead electrically connected to the semiconductor light emitting element, and a resin package covering the semiconductor light emitting element and part of the lead. The resin package includes a lens facing the semiconductor light emitting element. The lead includes an exposed portion that is not covered by the resin package. The exposed portion includes a first portion and a second portion, where the first portion has a first mount surface oriented backward along the optical axis of the lens, and the second portion has a second mount surface oriented perpendicularly to the optical axis of the lens.

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