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1. 发明授权

US09214376B2 Substrate mounting stage and surface treatment method therefor 有权
标题翻译：基板安装台及其表面处理方法
公开(公告)号：US09214376B2
公开(公告)日：2015-12-15
申请号：US12028904
申请日：2008-02-11
申请人： Masakazu Higuma , Yasuharu Sasaki , Tadashi Aoto , Eiichiro Kikuchi
发明人： Masakazu Higuma , Yasuharu Sasaki , Tadashi Aoto , Eiichiro Kikuchi
IPC分类号： C23C16/50 , C23C16/00 , C23F1/00 , H01L21/306 , H01L21/687 , C23C16/458 , H01L21/673 , H01J37/20
CPC分类号： H01L21/68757 , C23C16/4581 , H01J37/20 , H01L21/67366 , H01L21/6875
摘要： A substrate mounting stage that prevents poor attraction of substrates so as to improve the operating rate of a substrate processing apparatus. The substrate mounting stage is disposed in the substrate processing apparatus and has a substrate mounting surface on which a substrate is mounted. The arithmetic average roughness (Ra) of the substrate mounting surface is not less than a first predetermined value, and the initial wear height (Rpk) of the substrate mounting surface is not more than a second predetermined value.
摘要翻译：一种基板安装台，其防止基板的吸引力降低，从而提高基板处理装置的运转速度。基板安装台设置在基板处理装置中，并且具有安装有基板的基板安装面。基板安装面的算术平均粗糙度（Ra）不小于第一预定值，并且基板安装面的初始磨损高度（Rpk）不大于第二预定值。

2. 发明授权

US07815492B2 Surface treatment method 有权
标题翻译：表面处理方法
公开(公告)号：US07815492B2
公开(公告)日：2010-10-19
申请号：US11687879
申请日：2007-03-19
申请人： Yasuharu Sasaki , Masakazu Higuma , Tadashi Aoto , Eiichiro Kikuchi
发明人： Yasuharu Sasaki , Masakazu Higuma , Tadashi Aoto , Eiichiro Kikuchi
IPC分类号： B24B1/00
CPC分类号： B24B1/00 , B24B21/04
摘要： A surface treatment method that enables a surface of an electrostatic chuck to be smoothed, so as to improve the efficiency of heat transfer between the surface of the electrostatic chuck and a substrate. The electrostatic chuck is provided in an upper portion of a susceptor provided in a chamber of a substrate processing apparatus. In the surface treatment of the electrostatic chuck, a sprayed coating film is formed on the surface of the electrostatic chuck, next the surface of the electrostatic chuck is ground by bringing into contact therewith a grindstone, then the surface of the electrostatic chuck is ground flat by bringing into contact therewith a lapping plate onto a surface of which is sprayed a suspension, and then the surface of the electrostatic chuck is ground smooth by bringing into contact therewith a tape of a tape lapping apparatus.
摘要翻译：能够平滑静电卡盘的表面的表面处理方法，以提高静电卡盘的表面与基板之间的热传递效率。静电吸盘设置在设置在基板处理装置的室中的基座的上部。在静电卡盘的表面处理中，在静电卡盘的表面上形成喷涂膜，然后通过与磨石接触来研磨静电卡盘的表面，然后将静电卡盘的表面磨平通过与其接触的研磨板在其表面上喷涂悬浮液，然后通过与胶带研磨装置的带接触，将静电卡盘的表面研磨成平滑的。

3. 发明申请

US20080280536A1 SURFACE TREATMENT METHOD 有权
标题翻译：表面处理方法
公开(公告)号：US20080280536A1
公开(公告)日：2008-11-13
申请号：US11687879
申请日：2007-03-19
申请人： Yasuharu Sasaki , Masakazu Higuma , Tadashi Aoto , Eiichiro Kikuchi
发明人： Yasuharu Sasaki , Masakazu Higuma , Tadashi Aoto , Eiichiro Kikuchi
IPC分类号： B24B1/00
CPC分类号： B24B1/00 , B24B21/04
摘要： A surface treatment method that enables a surface of an electrostatic chuck to be smoothed, so as to improve the efficiency of heat transfer between the surface of the electrostatic chuck and a substrate. The electrostatic chuck is provided in an upper portion of a susceptor provided in a chamber of a substrate processing apparatus. In the surface treatment of the electrostatic chuck, a sprayed coating film is formed on the surface of the electrostatic chuck, next the surface of the electrostatic chuck is ground by bringing into contact therewith a grindstone, then the surface of the electrostatic chuck is ground flat by bringing into contact therewith a lapping plate onto a surface of which is sprayed a suspension, and then the surface of the electrostatic chuck is ground smooth by bringing into contact therewith a tape of a tape lapping apparatus.
摘要翻译：能够平滑静电卡盘的表面的表面处理方法，以提高静电卡盘的表面与基板之间的热传递效率。静电吸盘设置在设置在基板处理装置的室中的基座的上部。在静电卡盘的表面处理中，在静电卡盘的表面上形成喷涂膜，然后通过与磨石接触来研磨静电卡盘的表面，然后将静电卡盘的表面磨平通过与其接触的研磨板在其表面上喷涂悬浮液，然后通过与胶带研磨装置的带接触，将静电卡盘的表面研磨成平滑的。

4. 发明申请

US20080217291A1 SUBSTRATE MOUNTING STAGE AND SURFACE TREATMENT METHOD THEREFOR 有权
标题翻译：基板安装阶段及其表面处理方法
公开(公告)号：US20080217291A1
公开(公告)日：2008-09-11
申请号：US12028904
申请日：2008-02-11
申请人： Masakazu HIGUMA , Yasuharu Sasaki , Tadashi Aoto , Eiichiro Kikuchi
发明人： Masakazu HIGUMA , Yasuharu Sasaki , Tadashi Aoto , Eiichiro Kikuchi
IPC分类号： C23F1/00 , B44C1/22
CPC分类号： H01L21/68757 , C23C16/4581 , H01J37/20 , H01L21/67366 , H01L21/6875
摘要： A substrate mounting stage that prevents poor attraction of substrates so as to improve the operating rate of a substrate processing apparatus. The substrate mounting stage is disposed in the substrate processing apparatus and has a substrate mounting surface on which a substrate is mounted. The arithmetic average roughness (Ra) of the substrate mounting surface is not less than a first predetermined value, and the initial wear height (Rpk) of the substrate mounting surface is not more than a second predetermined value.
摘要翻译：一种基板安装台，其防止基板的吸引力降低，从而提高基板处理装置的运转速度。基板安装台设置在基板处理装置中，并且具有安装有基板的基板安装面。基板安装面的算术平均粗糙度（Ra）不小于第一预定值，并且基板安装表面的初始磨损高度（Rpk）不大于第二预定值。

5. 发明申请

US20080237030A1 SURFACE PROCESSING METHOD FOR MOUNTING STAGE 有权
标题翻译：安装阶段的表面处理方法
公开(公告)号：US20080237030A1
公开(公告)日：2008-10-02
申请号：US12057975
申请日：2008-03-28
申请人： Tadashi Aoto , Eiichiro Kikuchi , Masakazu Higuma , Kimihiro Higuchi
发明人： Tadashi Aoto , Eiichiro Kikuchi , Masakazu Higuma , Kimihiro Higuchi
IPC分类号： B29C61/04 , H05H1/00
CPC分类号： H01L21/67103 , H01L21/6875
摘要： A surface processing method for a mounting stage, which enables a mounting surface conforming to a substrate to be formed while saving time and effort. The substrate is mounted on a mounting surface of the mounting stage disposed in a housing chamber of a substrate processing apparatus that carries out plasma processing on the substrate. The mounted substrate is thermally expanded.
摘要翻译：一种用于安装台的表面处理方法，其能够在节省时间和精力的同时形成符合基板的安装表面。基板安装在安装台的安装表面上，该安装台设置在基板处理设备的容纳室中，该基板处理设备在基板上执行等离子体处理。安装的基板被热膨胀。

6. 发明授权

US08343372B2 Surface processing method for mounting stage 有权
标题翻译：表面处理方法安装阶段
公开(公告)号：US08343372B2
公开(公告)日：2013-01-01
申请号：US12057975
申请日：2008-03-28
申请人： Tadashi Aoto , Eiichiro Kikuchi , Masakazu Higuma , Kimihiro Higuchi
发明人： Tadashi Aoto , Eiichiro Kikuchi , Masakazu Higuma , Kimihiro Higuchi
IPC分类号： B29C61/04 , H05H1/00
CPC分类号： H01L21/67103 , H01L21/6875
摘要： A surface processing method for a mounting stage, which enables a mounting surface conforming to a substrate to be formed while saving time and effort. The substrate is mounted on a mounting surface of the mounting stage disposed in a housing chamber of a substrate processing apparatus that carries out plasma processing on the substrate. The mounted substrate is thermally expanded.
摘要翻译：一种用于安装台的表面处理方法，其能够在节省时间和精力的同时形成符合基板的安装表面。基板安装在安装台的安装表面上，该安装台设置在基板处理设备的容纳室中，该基板处理设备在基板上执行等离子体处理。安装的基板被热膨胀。

7. 发明授权

US07481903B2 Processing device and method of maintaining the device, mechanism and method for assembling processing device parts, and lock mechanism and method for locking the lock mechanism 有权
标题翻译：维护装置的处理装置和方法，组装处理装置部件的机构和方法，以及锁定机构的锁定机构和方法
公开(公告)号：US07481903B2
公开(公告)日：2009-01-27
申请号：US11067784
申请日：2005-03-01
申请人： Shigeru Senzaki , Toshiki Sasaki , Tadashi Aoto , Nobuyuki Nagayama , Kouji Mitsuhashi
发明人： Shigeru Senzaki , Toshiki Sasaki , Tadashi Aoto , Nobuyuki Nagayama , Kouji Mitsuhashi
IPC分类号： H01L21/306 , H01L21/3065 , C23C16/00 , C23C16/50 , C23C16/503
CPC分类号： H01J37/32458
摘要： A processing device in which maintenance can be easily carried out and a burden on a worker can be reduced, and a method of maintaining the device are provided. An upper electrode unit 106 structuring a ceiling portion of a processing chamber 102 of an etching device 100 is structured from a lower assembly 128 at a processing chamber 102 side including an upper electrode 130, and an upper assembly 128 at a power supply side including an electro-body 144. A lock mechanism 156 is released, and after the upper assembly 126 is independently raised and removed by a lift mechanism 164, maintenance of the upper assembly 126 and/or the lower assembly 128 is carried out. The lock mechanism 156 is locked, and after the upper and lower assemblies 126, 128 are integrally raised and removed by the lift mechanism 164, maintenance of an interior of the processing chamber 102 is carried out.
摘要翻译：能够容易地进行维护并且能够减轻对作业者的负担的处理装置，并且提供维持装置的方法。构成蚀刻装置100的处理室102的顶部的上电极单元106由包括上电极130的处理室102侧的下组件128和在电源侧的上组件128构成，电机144.释放锁定机构156，并且在上部组件126被提升机构164独立地升高和移除之后，执行上部组件126和/或下部组件128的维护。锁定机构156被锁定，并且在上部和下部组件126,128由提升机构164整体地升高和移除之后，执行处理室102的内部的维护。

8. 发明授权

US06899786B2 Processing device and method of maintaining the device, mechanism and method for assembling processing device part, and lock mechanism and method for locking the lock mechanism 有权
标题翻译：维护装置的处理装置和方法，组装处理装置部分的机构和方法，以及锁定机构的锁定机构和方法
公开(公告)号：US06899786B2
公开(公告)日：2005-05-31
申请号：US10276671
申请日：2001-05-16
申请人： Shigeru Senzaki , Toshiki Sasaki , Tadashi Aoto , Nobuyuki Nagayama , Kouji Mitsuhashi
发明人： Shigeru Senzaki , Toshiki Sasaki , Tadashi Aoto , Nobuyuki Nagayama , Kouji Mitsuhashi
IPC分类号： H01J37/32 , H01L21/3065 , C23C16/00 , H05H1/00
CPC分类号： H01J37/32458
摘要： A processing device in which maintenance can be easily carried out and a burden on a worker can be reduced, and a method of maintaining the device are provided. An upper electrode unit 106 structuring a ceiling portion of a processing chamber 102 of an etching device 100 is structured from a lower assembly 128 at a processing chamber 102 side including an upper electrode 130, and an upper assembly 126 at a power supply side including an electro-body 144. A lock mechanism 156 is released, and after the upper assembly 126 is independently raised and removed by a lift mechanism 164, maintenance of the upper assembly 126 and/or the lower assembly 128 is carried out. The lock mechanism 156 is locked, and after the upper and lower assemblies 126, 128 are integrally raised and removed by the lift mechanism 164, maintenance of an interior of the processing chamber 102 is carried out.
摘要翻译：能够容易地进行维护并且能够减轻对作业者的负担的处理装置，并且提供维持装置的方法。构成蚀刻装置100的处理室102的顶部的上电极单元106由包括上电极130的处理室102侧的下组件128和在电源侧的上组件126构成，电子体144。释放锁定机构156，并且在上部组件126被提升机构164独立地升高和移除之后，执行上部组件126和/或下部组件128的维护。锁定机构156被锁定，并且在上部和下部组件126,128由提升机构164整体地升高和移除之后，执行处理室102的内部的维护。

9. 发明申请

US20050150456A1 Processing device and method of maintaining the device, mechanism and method for assembling processing device parts, and lock mechanism and method for locking the lock mechanism 有权
标题翻译：维护装置的处理装置和方法，组装处理装置部件的机构和方法，以及锁定机构的锁定机构和方法
公开(公告)号：US20050150456A1
公开(公告)日：2005-07-14
申请号：US11067784
申请日：2005-03-01
申请人： Shigeru Senzaki , Toshiki Sasaki , Tadashi Aoto , Nobuyuki Nagayama , Kouji Mitsuhashi
发明人： Shigeru Senzaki , Toshiki Sasaki , Tadashi Aoto , Nobuyuki Nagayama , Kouji Mitsuhashi
IPC分类号： H01J37/32 , C23C16/00
CPC分类号： H01J37/32458
摘要： A processing device in which maintenance can be easily carried out and a burden on a worker can be reduced, and a method of maintaining the device are provided. An upper electrode unit 106 structuring a ceiling portion of a processing chamber 102 of an etching device 100 is structured from a lower assembly 128 at a processing chamber 102 side including an upper electrode 130, and an upper assembly 128 at a power supply side including an electro-body 144. A lock mechanism 156 is released, and after the upper assembly 126 is independently raised and removed by a lift mechanism 164, maintenance of the upper assembly 126 and/or the lower assembly 128 is carried out. The lock mechanism 156 is locked, and after the upper and lower assemblies 126, 128 are integrally raised and removed by the lift mechanism 164, maintenance of an interior of the processing chamber 102 is carried out.
摘要翻译：能够容易地进行维护并且能够减轻对作业者的负担的处理装置，并且提供维持装置的方法。构成蚀刻装置100的处理室102的顶部的上电极单元106由包括上电极130的处理室102侧的下组件128和在电源侧的上组件128构成，电机144.释放锁定机构156，并且在上部组件126被提升机构164独立地升高和移除之后，执行上部组件126和/或下部组件128的维护。锁定机构156被锁定，并且在上部和下部组件126,128由提升机构164整体地升高和移除之后，执行处理室102的内部的维护。

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