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1. 发明授权

US08692394B2 Adhesive for semiconductor bonding, adhesive film for semiconductor bonding, method for mounting semiconductor chip, and semiconductor device 有权
标题翻译：用于半导体结合的粘合剂，用于半导体结合的粘合膜，半导体芯片的安装方法和半导体器件
公开(公告)号：US08692394B2
公开(公告)日：2014-04-08
申请号：US13499134
申请日：2010-03-18
申请人： Yangsoo Lee , Sayaka Wakioka , Atsushi Nakayama , Carl Alvin Dilao
发明人： Yangsoo Lee , Sayaka Wakioka , Atsushi Nakayama , Carl Alvin Dilao
IPC分类号： H01L23/58
CPC分类号： C09J163/00 , C08G59/4014 , C08G59/686 , C08K3/36 , C09J7/35 , C09J2203/326 , C09J2205/102 , H01L23/295 , H01L24/29 , H01L2224/29101 , H01L2224/2919 , H01L2224/2929 , H01L2224/293 , H01L2224/29323 , H01L2224/29324 , H01L2224/29366 , H01L2224/2937 , H01L2224/29386 , H01L2924/00013 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/0102 , H01L2924/01027 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/0104 , H01L2924/01045 , H01L2924/01047 , H01L2924/0105 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/0665 , H01L2924/12042 , H01L2924/351 , H01L2924/00 , H01L2924/00014 , H01L2924/05442 , H01L2924/05432 , H01L2924/05032 , H01L2924/0503 , H01L2924/05042 , H01L2924/04642 , H01L2924/0532 , H01L2924/0542 , H01L2224/29099 , H01L2224/29199 , H01L2224/29299
摘要： The present invention is aimed to provide an adhesive for bonding a semiconductor which has high transparency and facilitates recognition of a pattern or position indication on the occasion of semiconductor chip bonding.The present invention is an adhesive for bonding a semiconductor containing: an epoxy resin; an inorganic filler; and a curing agent, wherein the amount of the inorganic filler in the adhesive is 30 to 70% by weight, the inorganic filler contains a filler A having an average particle size of less than 0.1 μm and a filler B having an average particle size of not less than 0.1 μm and less than 1 μm, and the weight ratio of the filler A to the filler B is 1/9 to 6/4. The present invention is an adhesive for bonding a semiconductor containing: an epoxy resin; an inorganic filler; and a curing agent, wherein difference in refractive index is not more than 0.1 between the epoxy resin and the inorganic filler.
摘要翻译：本发明的目的在于提供一种用于粘合半导体的粘合剂，其具有高透明度并便于在半导体芯片接合时识别图案或位置指示。本发明是一种用于粘合半导体的粘合剂，其包含：环氧树脂; 无机填料; 和固化剂，其中粘合剂中无机填料的量为30〜70重量％，无机填料含有平均粒径小于0.1μm的填料A和平均粒径为不小于0.1μm且小于1μm，填料A与填料B的重量比为1/9至6/4。本发明是一种用于粘合半导体的粘合剂，其包含：环氧树脂; 无机填料; 和固化剂，其中环氧树脂和无机填料之间的折射率差异不大于0.1。

2. 发明申请

US20120326301A1 THERMOSETTING RESIN COMPOSITION, FLIP-CHIP MOUNTING ADHESIVE, SEMICONDUCTOR DEVICE FABRICATION METHOD, AND SEMICONDUCTOR DEVICE 审中-公开
标题翻译：热固性树脂组合物，薄片安装粘合剂，半导体器件制造方法和半导体器件
公开(公告)号：US20120326301A1
公开(公告)日：2012-12-27
申请号：US13574149
申请日：2011-01-19
申请人： Sayaka Wakioka , Yangsoo Lee , Atsushi Nakayama , Carl Alvin Dilao
发明人： Sayaka Wakioka , Yangsoo Lee , Atsushi Nakayama , Carl Alvin Dilao
IPC分类号： C09J163/00 , H01L23/498 , C09J163/02 , H01L21/50
CPC分类号： H01L23/293 , C08G59/4215 , C08G59/4284 , C08G59/5073 , C08G59/56 , C08G59/686 , C08L63/00 , C09J163/00 , H01L2924/0002 , H01L2924/00
摘要： The present invention is aimed to provide a thermosetting resin composition which is easily produced, has excellent storage stability and thermal stability while maintaining high transparency and preventing formation of voids on the occasion of semiconductor chip bonding, and gives a cured product having excellent heat resistance, a flip-chip mounting adhesive containing the thermosetting resin composition, a method for producing a semiconductor device using the flip-chip mounting adhesive, and a semiconductor device produced by the method for producing a semiconductor device. The present invention is a thermosetting resin composition including an epoxy resin, an acid anhydride having a bicycle skeleton, and an imidazole curing accelerator that is in a liquid form at an ordinary temperature.
摘要翻译：本发明的目的在于提供一种容易制造的热固性树脂组合物，具有优异的储存稳定性和热稳定性，同时保持高透明性并且在半导体芯片接合时防止形成空隙，并且得到具有优异耐热性的固化产物，包含热固性树脂组合物的倒装芯片安装胶粘剂，使用倒装芯片安装胶粘剂的半导体装置的制造方法以及通过该半导体装置的制造方法制造的半导体装置。本发明是一种包含环氧树脂，具有自行车骨架的酸酐和在常温下为液态的咪唑固化促进剂的热固性树脂组合物。

3. 发明申请

US20120267803A1 ADHESIVE FOR SEMICONDUCTOR BONDING, ADHESIVE FILM FOR SEMICONDUCTOR BONDING, METHOD FOR MOUNTING SEMICONDUCTOR CHIP, AND SEMICONDUCTOR DEVICE 有权
标题翻译：用于半导体结合的粘合剂，用于半导体结合的粘合膜，用于安装半导体芯片的方法和半导体器件
公开(公告)号：US20120267803A1
公开(公告)日：2012-10-25
申请号：US13499134
申请日：2010-03-18
申请人： Yangsoo Lee , Sayaka Wakioka , Atsushi Nakayama , Carl Alvin Dilao
发明人： Yangsoo Lee , Sayaka Wakioka , Atsushi Nakayama , Carl Alvin Dilao
IPC分类号： C09J163/00 , H01L23/12 , H01L21/78
CPC分类号： C09J163/00 , C08G59/4014 , C08G59/686 , C08K3/36 , C09J7/35 , C09J2203/326 , C09J2205/102 , H01L23/295 , H01L24/29 , H01L2224/29101 , H01L2224/2919 , H01L2224/2929 , H01L2224/293 , H01L2224/29323 , H01L2224/29324 , H01L2224/29366 , H01L2224/2937 , H01L2224/29386 , H01L2924/00013 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/0102 , H01L2924/01027 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/0104 , H01L2924/01045 , H01L2924/01047 , H01L2924/0105 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/0665 , H01L2924/12042 , H01L2924/351 , H01L2924/00 , H01L2924/00014 , H01L2924/05442 , H01L2924/05432 , H01L2924/05032 , H01L2924/0503 , H01L2924/05042 , H01L2924/04642 , H01L2924/0532 , H01L2924/0542 , H01L2224/29099 , H01L2224/29199 , H01L2224/29299
摘要： The present invention is aimed to provide an adhesive for bonding a semiconductor which has high transparency and facilitates recognition of a pattern or position indication on the occasion of semiconductor chip bonding.The present invention is an adhesive for bonding a semiconductor containing: an epoxy resin; an inorganic filler; and a curing agent, wherein the amount of the inorganic filler in the adhesive is 30 to 70% by weight, the inorganic filler contains a filler A having an average particle size of less than 0.1 μm and a filler B having an average particle size of not less than 0.1 μm and less than 1 μm, and the weight ratio of the filler A to the filler B is 1/9 to 6/4. The present invention is an adhesive for bonding a semiconductor containing: an epoxy resin; an inorganic filler; and a curing agent, wherein difference in refractive index is not more than 0.1 between the epoxy resin and the inorganic filler.
摘要翻译：本发明的目的在于提供一种用于粘合半导体的粘合剂，其具有高透明度并便于在半导体芯片接合时识别图案或位置指示。本发明是一种用于粘合半导体的粘合剂，其包含：环氧树脂; 无机填料; 和固化剂，其中粘合剂中无机填料的量为30〜70重量％，无机填料含有平均粒径小于0.1μm的填料A和平均粒径为不小于0.1μm且小于1μm，填料A与填料B的重量比为1/9至6/4。本发明是一种用于粘合半导体的粘合剂，其包含：环氧树脂; 无机填料; 和固化剂，其中环氧树脂和无机填料之间的折射率差异不大于0.1。

4. 发明授权

US08303283B2 Power steering oil pump 有权
标题翻译：动力转向油泵
公开(公告)号：US08303283B2
公开(公告)日：2012-11-06
申请号：US12561026
申请日：2009-09-16
申请人： Minjung Kim , Yangsoo Lee
发明人： Minjung Kim , Yangsoo Lee
IPC分类号： F03C4/00 , F04C2/00
CPC分类号： F04C15/0088 , F01C21/0809 , F04C2/344
摘要： A power steering oil pump may include a pump housing, a rotor that is equipped with a plurality of vanes and coupled to the pump housing to rotate therein, a cam ring inserted between the rotor and the pump housing to form a pumping space between the cam ring and the rotor, a rotor shaft that passes through the rotor and is fitted therein to transmit rotational force to the rotor, and a bush that has at least a first oil groove on an inner circumference thereof and supports the rotor shaft to a pump cover coupled to the pump housing while covering a portion of the rotor shaft which passes through the rotor, wherein at least a second oil groove is formed on an end portion of the vanes contacting with an inner circumference of the cam ring.
摘要翻译：动力转向油泵可以包括泵壳体，转子，其配备有多个叶片并且联接到泵壳体以在其中旋转;插入在转子和泵壳体之间的凸轮环，以在凸轮之间形成泵送空间环和转子，通过转子并装配在其中以将转动力传递到转子的转子轴，以及在其内周上至少具有第一油槽并且将转子轴支撑到泵盖的衬套耦合到泵壳体，同时覆盖通过转子的转子轴的一部分，其中至少第二油槽形成在与凸轮环的内圆周接触的叶片的端部上。

5. 发明申请

US20100135838A1 Power Steering Oil Pump 有权
标题翻译：动力转向油泵
公开(公告)号：US20100135838A1
公开(公告)日：2010-06-03
申请号：US12561026
申请日：2009-09-16
申请人： Minjung KIM , Yangsoo Lee
发明人： Minjung KIM , Yangsoo Lee
IPC分类号： F01C19/08
CPC分类号： F04C15/0088 , F01C21/0809 , F04C2/344
摘要： A power steering oil pump may include a pump housing, a rotor that is equipped with a plurality of vanes and coupled to the pump housing to rotate therein, a cam ring inserted between the rotor and the pump housing to form a pumping space between the cam ring and the rotor, a rotor shaft that passes through the rotor and is fitted therein to transmit rotational force to the rotor, and a bush that has at least a first oil groove on an inner circumference thereof and supports the rotor shaft to a pump cover coupled to the pump housing while covering a portion of the rotor shaft which passes through the rotor, wherein at least a second oil groove is formed on an end portion of the vanes contacting with an inner circumference of the cam ring.
摘要翻译：动力转向油泵可以包括泵壳体，转子，其配备有多个叶片并且联接到泵壳体以在其中旋转;插入在转子和泵壳体之间的凸轮环，以在凸轮之间形成泵送空间环和转子，通过转子并装配在其中以将转动力传递到转子的转子轴，以及在其内周上至少具有第一油槽并且将转子轴支撑到泵盖的衬套耦合到泵壳体，同时覆盖通过转子的转子轴的一部分，其中至少第二油槽形成在与凸轮环的内圆周接触的叶片的端部上。

6. 发明授权

US5846070A Party candle having visually commemorative effect 失效
标题翻译：派对蜡烛具有视觉上的纪念作用
公开(公告)号：US5846070A
公开(公告)日：1998-12-08
申请号：US934987
申请日：1997-09-22
申请人： Youngchoon Kim , Sangkye Lee , Byongjoo Jung , Yangsoo Lee
发明人： Youngchoon Kim , Sangkye Lee , Byongjoo Jung , Yangsoo Lee
IPC分类号： F21S8/00 , F21S19/00 , F21V8/00 , F23D3/02
CPC分类号： G02B6/0021 , F21S19/00 , G02B6/006 , G02B6/0081 , G02B6/0083 , F21W2121/00 , Y10S362/812
摘要： A party candle having a visually commemorative effect according to the present invention including: a decoration plate which is comprised of a transparent plate having a concave groove, an operation device inserting groove and a switching plate passing groove. A light emitting diode is connected to first and second electric wires which is inserted at the left side ends of the concave groove. A rear plate covers the back of the decoration plate and; a leg portion which is bonded vertically to the bottom surface of the center portion of the decoration plate holds the device up. A candle portion which is comprised of a wick, a vinyl sheet formed on the center portion thereof, and a switching plate formed near the wick and comprised of first and second aluminum plates attached on the front and rear sides of the vinyl sheet; and an operation device which is comprised of a casing having an electric wire passing hole on the side surface thereof, a plurality of batteries installed in the casing, positive (+) and negative(-) terminals connecting positive electrodes and negative electrodes of the plurality of batteries, and a cover is in the device.
摘要翻译：根据本发明的具有视觉上纪念效果的派对蜡烛，包括：装饰板，其包括具有凹槽的透明板，操作装置插入槽和开关板通过槽。发光二极管连接到插入在凹槽的左侧端部的第一和第二电线。后板覆盖装饰板的背面; 与装饰板的中心部的底面垂直结合的脚部保持装置。蜡烛部分，其由芯，其中心部分上形成的乙烯基片组成，以及形成在灯芯周围的切换板，包括安装在乙烯基板的前后侧的第一和第二铝板; 以及操作装置，其包括在其侧表面上具有电线通孔的壳体，安装在壳体中的多个电池，连接多个正极和负极的正极（+）和负极（ - ）端子的电池，并且一个盖子在设备中。

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