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1. 发明授权

US07017795B2 Solder pastes for providing high elasticity, low rigidity solder joints 有权
标题翻译：焊膏用于提供高弹性，低刚性焊点
公开(公告)号：US07017795B2
公开(公告)日：2006-03-28
申请号：US10954570
申请日：2004-10-01
申请人： Yan Liu , Derrick Herron , Ning-Cheng Lee
发明人： Yan Liu , Derrick Herron , Ning-Cheng Lee
IPC分类号： B23K35/12
CPC分类号： B23K35/025 , B23K35/0244 , B23K35/26 , B23K35/302 , B23K35/3612 , B23K2101/36 , H05K3/3484 , H05K2201/0215
摘要： Solder pastes for providing high elasticity, low rigidity solder joints are disclosed. The solder pastes may be used between two parts having large mismatches in their coefficients of thermal expansion and/or when there is a high likelihood of mechanical deformity when the two parts are soldered together. In one particular exemplary embodiment, a solder paste may be realized as a composition comprising a solder powder and high melting temperature particles with a flux, wherein the ratio between solder powder and high melting temperature particles may be between 2:1 and 1:10.
摘要翻译：公开了用于提供高弹性，低刚性焊点的焊膏。焊膏可以用于其热膨胀系数不匹配的两个部件和/或当两个部件被焊接在一起时机械变形的可能性很高的两个部件之间。在一个具体的示例性实施例中，焊膏可以实现为包含焊料粉末和具有焊剂的高熔点温度颗粒的组合物，其中焊料粉末和高熔点温度颗粒之间的比例可以在2:1和1:10之间。

2. 发明申请

US20050092819A1 Solder pastes for providing high elasticity, low rigidity solder joints 有权
标题翻译：焊膏用于提供高弹性，低刚性焊点
公开(公告)号：US20050092819A1
公开(公告)日：2005-05-05
申请号：US10954570
申请日：2004-10-01
申请人： Yan Liu , Derrick Herron , Ning-Cheng Lee
发明人： Yan Liu , Derrick Herron , Ning-Cheng Lee
IPC分类号： B23K31/02 , B23K35/02 , B23K35/12 , B23K35/26 , B23K35/30 , B23K35/36 , H05K3/34
CPC分类号： B23K35/025 , B23K35/0244 , B23K35/26 , B23K35/302 , B23K35/3612 , B23K2101/36 , H05K3/3484 , H05K2201/0215
摘要： Solder pastes for providing high elasticity, low rigidity solder joints are disclosed. The solder pastes may be used between two parts having large mismatches in their coefficients of thermal expansion and/or when there is a high likelihood of mechanical deformity when the two parts are soldered together. In one particular exemplary embodiment, a solder paste may be realized as a composition comprising a solder powder and high melting temperature particles with a flux, wherein the ratio between solder powder and high melting temperature particles may be between 2:1 and 1:10.
摘要翻译：公开了用于提供高弹性，低刚性焊点的焊膏。焊膏可以用于其热膨胀系数不匹配的两个部件和/或当两个部件被焊接在一起时机械变形的可能性很高的两个部件之间。在一个具体的示例性实施例中，焊膏可以实现为包含焊料粉末和具有焊剂的高熔点温度颗粒的组合物，其中焊料粉末和高熔点温度颗粒之间的比例可以在2:1和1:10之间。

3. 发明授权

US10010981B2 Materials having increased mobility after heating 有权
公开(公告)号：US10010981B2
公开(公告)日：2018-07-03
申请号：US12240396
申请日：2008-09-29
申请人： Ning-Cheng Lee , Runsheng Mao
发明人： Ning-Cheng Lee , Runsheng Mao
IPC分类号： B23K35/22 , B23K35/24
CPC分类号： B23K35/22 , B23K35/24
摘要： Materials having increased mobility after heating are disclosed. In one particular exemplary embodiment, the materials may be realized as a material which has reduced apparent molecular weight and/or viscosity and thus increased mobility after a heating process, and which consequently allows material residue to be more easily removed during subsequent cleaning processes. Such a material may be useful in any industrial process which requires heating the material followed by removing material residue.

4. 发明申请

US20120328361A1 MN DOPED SN-BASE SOLDER ALLOY AND SOLDER JOINTS THEREOF WITH SUPERIOR DROP SHOCK RELIABILITY 有权
标题翻译： MN DOPED SN-BASE焊接合金及其焊接接头，具有超级倾斜冲击可靠性
公开(公告)号：US20120328361A1
公开(公告)日：2012-12-27
申请号：US13542586
申请日：2012-07-05
申请人： WEIPING LIU , Ning-Cheng Lee
发明人： WEIPING LIU , Ning-Cheng Lee
IPC分类号： C22C13/00 , B23K35/24
CPC分类号： C22C13/00 , B23K35/0244 , B23K35/262 , C22C13/02 , Y10T403/479
摘要： A Sn—Ag—Cu-based lead-free solder alloy and solder joints thereof with superior drop shock reliability are disclosed. The solder comprises between greater than 0 wt. % and less than or equal to about 1.5 wt. % Ag; between greater than or equal to about 0.7 wt. % and less than or equal to about 2.0 wt. % Cu; between greater than or equal to about 0.001 and less than or equal to about 0.2 wt. % Mn; and a remainder of Sn.
摘要翻译：公开了一种Sn-Ag-Cu基无铅焊料合金及其焊接接头，具有出色的跌落冲击可靠性。焊料包含大于0wt。％且小于或等于约1.5wt。％Ag; 大于或等于约0.7wt。％且小于或等于约2.0wt。％Cu; 在大于或等于约0.001和小于或等于约0.2重量％之间。％Mn; 和Sn的剩余部分。

5. 发明申请

US20110315429A1 METAL COATING FOR INDIUM BUMP BONDING 有权
标题翻译：金属涂层用于冲压粘结
公开(公告)号：US20110315429A1
公开(公告)日：2011-12-29
申请号：US13168505
申请日：2011-06-24
申请人： Sihai Chen , Ning-Cheng Lee
发明人： Sihai Chen , Ning-Cheng Lee
IPC分类号： H01B5/00 , B23K1/20 , B23K31/02
CPC分类号： H01L24/16 , H01L24/11 , H01L24/13 , H01L24/81 , H01L27/14618 , H01L27/14634 , H01L27/14636 , H01L2224/13109 , H01L2224/1357 , H01L2224/1358 , H01L2224/13582 , H01L2224/13583 , H01L2224/13599 , H01L2224/136 , H01L2224/13605 , H01L2224/13609 , H01L2224/13611 , H01L2224/13613 , H01L2224/13616 , H01L2224/13618 , H01L2224/81193 , H01L2224/81201 , H01L2224/81801 , H01L2924/00013 , H01L2924/01006 , H01L2924/0103 , H01L2924/01033 , H01L2924/01047 , H01L2924/01049 , H01L2924/01075 , H01L2924/01078 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/14 , H01L2924/15788 , H01L2924/00014 , H01L2924/01083 , H01L2924/0102 , H01L2224/13099 , H01L2924/00
摘要： A process of making efficient metal bump bonding with relative low temperature, preferably lower than the melting point of Indium, is described. To obtaining a lower processing temperature (preferred embodiments have a melting point of
摘要翻译：描述了以相对低的温度，优选低于铟的熔点进行有效的金属凸点接合的方法。为了获得较低的加工温度（优选实施方案具有<100℃的熔点），在铟凸块表面上沉积金属或合金层。优选地，选择材料使得金属或合金形成比下面的铟材料更耐氧化的钝化层。还优选选择钝化材料以在铟凸块表面上形成具有铟的低熔点合金。这通常通过将钝化材料扩散到铟中以形成扩散层合金来实现。可用于与铟形成二元至四元低熔点合金的各种金属，包括Ga，Bi，Sn，Pb和Cd。另外，Sn，Sn-Zn等金属向Ga-In合金中扩散; Sn，Cd，Pb-Sn合金成Bi-In合金; Cd，Zn，Pb，Pb-Cd成Sn-In合金可以帮助调整合金的熔点。

6. 发明申请

US20110273847A1 ALLOY COMPOSITIONS AND TECHNIQUES FOR REDUCING INTERMETALLIC COMPOUND THICKNESSES AND OXIDATION OF METALS AND ALLOYS 审中-公开
标题翻译：合金组合物和减少金属间化合物厚度和金属和合金氧化的技术
公开(公告)号：US20110273847A1
公开(公告)日：2011-11-10
申请号：US13099135
申请日：2011-05-02
申请人： Hong-Sik Hwang , Ning-Cheng Lee
发明人： Hong-Sik Hwang , Ning-Cheng Lee
IPC分类号： H05K7/20 , H05K7/00
CPC分类号： C22C28/00 , B23K35/24 , H01L23/3733 , H01L23/3736 , H01L23/42 , H01L23/4275 , H01L24/13 , H01L24/16 , H01L24/29 , H01L24/32 , H01L2224/05568 , H01L2224/05573 , H01L2224/13099 , H01L2224/13105 , H01L2224/13109 , H01L2224/16221 , H01L2224/16225 , H01L2224/29101 , H01L2224/29105 , H01L2224/29109 , H01L2224/29111 , H01L2224/29113 , H01L2224/2929 , H01L2224/29301 , H01L2224/29305 , H01L2224/29309 , H01L2224/29313 , H01L2224/32012 , H01L2224/32014 , H01L2224/81192 , H01L2224/83191 , H01L2224/83192 , H01L2924/00014 , H01L2924/01006 , H01L2924/01025 , H01L2924/0103 , H01L2924/01032 , H01L2924/01033 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/01322 , H01L2924/01327 , H01L2924/0133 , H01L2924/0134 , H01L2924/014 , H01L2924/3651 , H01L2924/01048 , H01L2924/0108 , H01L2924/01083 , H01L2924/01015 , H01L2924/01022 , H01L2924/00 , H01L2924/01031 , H01L2224/29311 , H01L2924/00012 , H01L2224/05599
摘要： Alloy compositions and techniques for reducing IMC thickness and oxidation of metals and alloys are disclosed. In one particular exemplary embodiment, the alloy compositions may be realized as a composition of alloy or mixture consisting essentially of from about 90% to about 99.999% by weight indium and from about 0.001% to about 10% by weight germanium and unavoidable impurities. In another particular exemplary embodiment, the alloy compositions may be realized as a composition of alloy consisting essentially of from about 90% to about 99.999% by weight gallium and from about 0.001% to about 10% by weight germanium and unavoidable impurities.
摘要翻译：公开了用于降低金属和合金的IMC厚度和氧化的合金组成和技术。在一个具体的示例性实施方案中，合金组合物可以实现为基本上由约90重量％至约99.999重量％的铟和约0.001重量％至约10重量％的锗和不可避免的杂质组成的合金或混合物。在另一个具体的示例性实施方案中，合金组合物可以实现为基本上由约90重量％至约99.999重量％的镓和约0.001重量％至约10重量％的锗和不可避免的杂质组成的合金。

7. 发明申请

US20110220704A1 COMPOSITE SOLDER ALLOY PREFORM 有权
标题翻译：复合焊接合金预选
公开(公告)号：US20110220704A1
公开(公告)日：2011-09-15
申请号：US12720532
申请日：2010-03-09
申请人： Weiping Liu , Ning-Cheng Lee
发明人： Weiping Liu , Ning-Cheng Lee
IPC分类号： B23K1/20 , B32B15/01
CPC分类号： B23K35/0238 , B23K35/26 , B23K35/262 , H01L24/29 , H01L24/83 , H01L2224/29083 , H01L2224/83101 , H01L2224/83801 , H01L2224/8381 , H01L2224/83825 , H01L2924/01322 , H01L2924/15747 , Y10T428/12708 , Y10T428/12715 , Y10T428/12722 , H01L2924/00
摘要： Various embodiments of the invention provide laminate composite preform foils for high-temperature Pb-free soldering applications. The laminate composite preform foil is composed of a high-melting, ductile metal or alloy core layer and a low-melting solder coating layer at either side of the core layer. During soldering, the core metal, liquid solder layer, and substrate metals react and consume the low-melting solder phase to form high-melting intermetallic compound phases (IMCs). The resultant solder joint is composed of a ductile core layer sandwiched by the IMCs layers at substrate sides. The joint has a much higher remelt temperature than the original melting temperature of the initial solder alloy coating, allowing subsequent mounting of packaged devices.
摘要翻译：本发明的各种实施例提供了用于高温无铅焊接应用的叠层复合预制箔。层叠复合预成型体箔由芯层的任一侧的高熔点，延性金属或合金芯层和低熔点焊料涂层构成。在焊接期间，芯金属，液体焊料层和基底金属反应并消耗低熔点焊料相以形成高熔点金属间化合物相（IMC）。所得到的焊点由在基板侧被IMC层夹持的延性芯层构成。接头具有比初始焊料合金涂层的原始熔化温度高得多的熔融温度，允许随后安装封装的装置。

8. 发明申请

US20070092396A1 Technique For Increasing The Compliance Of Lead-Free Solders Containing Silver 有权
标题翻译：增加含银无铅焊料的合规性的技术
公开(公告)号：US20070092396A1
公开(公告)日：2007-04-26
申请号：US11550640
申请日：2006-10-18
申请人： Benlih Huang , Hong-Sik Hwang , Ning-Cheng Lee
发明人： Benlih Huang , Hong-Sik Hwang , Ning-Cheng Lee
IPC分类号： C22C13/00
CPC分类号： C22C13/00 , B23K35/262 , B23K35/3006
摘要： A technique for technique for increasing the compliance of lead-free solders containing silver is disclosed. In one particular exemplary embodiment, the technique may be realized as a Sn—Ag—Al alloy composition comprising (0.01-20)% Ag, (0.01-2)% Al, balanced with Sn. In another particular exemplary embodiment, the technique may be realized as a Sn—Ag—Cu—Al alloy composition comprising (0.01-20)% Ag, (0.01-1)% Cu, (0.01-2)% Al, balanced with Sn. In still another particular exemplary embodiment, the technique may be realized as a Sn—Ag—Al—Ni composition comprising (0.01-20)% Ag, (0.01-2)% Al, (0.01-4)% Ni, balanced with Sn. In yet another particular exemplary embodiment, the technique may be realized as a Sn—Ag—Cu—Al—Ni alloy composition comprising (0.01-20)% Ag, (0.01-1)% Cu, (0.01-2)% Al, (0.01-4)% Ni, balanced with Sn.
摘要翻译：公开了一种提高含银无铅焊料柔顺性的技术。在一个具体的示例性实施方案中，该技术可以实现为包含与Sn平衡的（0.01-20）％Ag，（0.01-2）％Al，Sn-Ag-Al合金组合物。在另一特定示例性实施方案中，该技术可以实现为包含（0.01-20）％Ag，（0.01-1）％Cu，（0.01-2）％Al，Sn与Sn平衡的Sn-Ag-Cu-Al合金组合物。在另一个具体的示例性实施方案中，该技术可以实现为包含（0.01-20）％Ag，（0.01-2）％Al，（0.01-4）％Ni，与Sn平衡的Sn-Ag-Al-Ni组合物。在另一个具体的示例性实施方案中，该技术可以实现为包含（0.01-20）％Ag，（0.01-1）％Cu，（0.01-2）％Al，Sn-Ag-Cu-Al- （0.01-4）％Ni，与Sn平衡。

9. 发明公开

US20230241725A1 SOLDER PASTES AND METHODS OF USING THE SAME 审中-公开
公开(公告)号：US20230241725A1
公开(公告)日：2023-08-03
申请号：US17578615
申请日：2022-01-19
申请人： Ning-Cheng Lee
发明人： Ning-Cheng Lee
IPC分类号： B23K35/02 , B23K1/00 , B23K35/26 , C22C13/00 , C22C12/00 , C22C28/00 , H05K3/34
CPC分类号： B23K35/025 , B23K1/0016 , B23K35/262 , B23K35/264 , C22C12/00 , C22C13/00 , C22C28/00 , H05K3/3485 , B23K2101/42
摘要： Solder pastes comprise a high temperature solder powder, a low temperature solder powder and flux. The melting temperature of the low temperature solder powder is lower than that of the high temperature solder powder. The high temperature solder powder and the low temperature solder powder are both capable of wetting upon heating.

10. 发明申请

US20100116376A1 ANTI-TOMBSTONING LEAD FREE ALLOYS FOR SURFACE MOUNT REFLOW SOLDERING 审中-公开
标题翻译：防反射焊接自由合金表面安装反射焊接
公开(公告)号：US20100116376A1
公开(公告)日：2010-05-13
申请号：US12576123
申请日：2009-10-08
申请人： Benlih Huang , Ning-Cheng Lee
发明人： Benlih Huang , Ning-Cheng Lee
IPC分类号： B23K35/34 , B23K1/00
CPC分类号： C22C13/00 , B23K35/262 , H05K3/3463 , H05K2201/10636 , Y02P70/611
摘要： A lead-free solder alloy composition comprising tin, silver and copper, and a process for reflow soldering for minimizing tombstoning frequency are disclosed. In one particular exemplary embodiment, the lead-free Sn—Ag—Cu solder alloys for minimizing the tombstoning effect of the present disclosure display high mass fraction during melting and prolonged melting as shown by a widened DSC peaks, that allows for a balanced surface tension on both ends of the chip component to develop. In accordance with further aspects of this exemplary embodiment, the alloys display a mass fraction of solid during melting greater than 20% and a DSC peak width greater than 8° C. using a 5° C./min scan rate. In accordance with further aspects of this exemplary embodiment, the alloy comprises on a weight basis Ag 1-4.5%, Cu 0.3-1% balanced with Sn.
摘要翻译：公开了一种包含锡，银和铜的无铅焊料合金组合物，以及用于最小化墓碑频率的回流焊接方法。在一个具体的示例性实施例中，用于最小化本公开的墓碑效应的无铅Sn-Ag-Cu焊料合金在熔化和延长熔化期间显示高质量分数，如扩大的DSC峰所示，其允许平衡的表面张力在芯片组件的两端进行开发。根据该示例性实施方案的其它方面，合金在熔化时显示大于20％的固体的质量分数，并且使用5℃/ min扫描速率显示大于8℃的DSC峰宽。根据本示例性实施方案的其它方面，合金的重量基础为Ag 1-4.5％，Cu为0.3-1％，与Sn平衡。

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