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1. 发明申请

US20130052852A1 ELECTRONIC DEVICE CONNECTOR 失效
标题翻译：电子设备连接器
公开(公告)号：US20130052852A1
公开(公告)日：2013-02-28
申请号：US13467121
申请日：2012-05-09
申请人： YUE-YONG LI , LI-FU XU , HUI YU , XIN-XIANG LI , YONG-NIAN CHEN
发明人： YUE-YONG LI , LI-FU XU , HUI YU , XIN-XIANG LI , YONG-NIAN CHEN
IPC分类号： H01R13/62
CPC分类号： H01R13/6272
摘要： A connector includes a body and a socket extending from the body. A blocking wall is located on the body. The socket includes a top wall, a resilient piece located on the top wall. The blocking wall is surrounded the resilient piece for preventing the resilient piece from destroying.
摘要翻译：连接器包括主体和从主体延伸的插座。阻塞墙位于身体上。插座包括顶壁，位于顶壁上的弹性片。阻挡壁被弹性件包围，以防止弹性片破坏。

2. 发明申请

US20130063005A1 ELECTRONIC DEVICE ENCLOSURE 失效
标题翻译：电子设备外壳
公开(公告)号：US20130063005A1
公开(公告)日：2013-03-14
申请号：US13482444
申请日：2012-05-29
申请人： CHENG QIAN , LI-FU XU , HUI YU , XIN-XIANG LI , YUE-YONG LI
发明人： CHENG QIAN , LI-FU XU , HUI YU , XIN-XIANG LI , YUE-YONG LI
IPC分类号： H05K5/02
CPC分类号： G06F1/181
摘要： An electronic device enclosure includes a rear panel and a blocking board. The rear panel comprises a front surface and a back surface opposite to the front surface. A through opening is defined in the rear panel. The blocking board comprises a main body, a first flange and a second flange opposite to the first flange. A first stopping piece is extends from the first flange. A second stopping piece is extended from the second flange. A latch portion is located on the first flange. A first protrusion is located on the second flange. The latch portion and the second protrusion extend through the through opening by being elastically deformed, the latch portion and the second protrusion abut on the front surface, and the first stopping piece and the second stopping piece abut on the back surface.
摘要翻译：电子设备外壳包括后面板和阻挡板。后面板包括前表面和与前表面相对的后表面。在后面板中定义了一个通孔。阻挡板包括主体，第一凸缘和与第一凸缘相对的第二凸缘。第一止动件从第一凸缘延伸。第二止动件从第二凸缘延伸。闩锁部分位于第一凸缘上。第一凸起位于第二凸缘上。闩锁部分和第二突起通过弹性变形延伸穿过通孔，闩锁部分和第二突起抵靠在前表面上，并且第一止动件和第二止动件抵靠在后表面上。

3. 发明申请

US20130084732A1 CONNECTOR ASSEMBLY 失效
标题翻译：连接器总成
公开(公告)号：US20130084732A1
公开(公告)日：2013-04-04
申请号：US13525606
申请日：2012-06-18
申请人： SHENG-MEI ZHANG , LI-FU XU , XIN-XIANG LI , HUI YU
发明人： SHENG-MEI ZHANG , LI-FU XU , XIN-XIANG LI , HUI YU
IPC分类号： H01R13/627
CPC分类号： H01R13/6275
摘要： A connector assembly includes a plug device and a socket device. The plug device includes a holding portion. The holding portion includes a top wall, a bottom wall opposite to the top wall, and an middle portion located between the top wall and the bottom wall. An inner surface of the top wall facing the middle portion defines a stopping hole. The socket device includes a main body and a resilient piece. The main body includes a top panel and a bottom panel opposite to the top panel. The resilient piece is located on the top panel. A latch portion is located on the resilient piece. The resilient piece is elastically deformable to engage the latch portion in the stopping hole. The main body is located between the top wall and the bottom wall. The middle portion is located on the top panel and the bottom panel.
摘要翻译：连接器组件包括插头装置和插座装置。插头装置包括保持部。保持部分包括顶壁，与顶壁相对的底壁，以及位于顶壁和底壁之间的中间部分。面向中间部分的顶壁的内表面限定了止动孔。插座装置包括主体和弹性件。主体包括顶板和与顶板相对的底板。弹性件位于顶板上。闩锁部分位于弹性件上。弹性件可弹性变形以与止动孔中的闩锁部分接合。主体位于顶壁和底壁之间。中间部分位于顶板和底板上。

4. 发明申请

US20090009966A1 COMPUTER WITH HEAT DISSIPATION SYSTEM 失效
标题翻译：具有散热系统的计算机
公开(公告)号：US20090009966A1
公开(公告)日：2009-01-08
申请号：US11838904
申请日：2007-08-15
申请人： HUI YU , MU-CHANG WANG
发明人： HUI YU , MU-CHANG WANG
IPC分类号： H05K7/20
CPC分类号： G06F1/20
摘要： A computer includes a motherboard (2), an enclosure (1), and a fan (153). The motherboard has a first heat generating device (21 ) mounted thereon. The enclosure has a substantially sealed first compartment (10), and an airflow chamber (30) in communication with an exterior of the enclosure. The first compartment receives the first heat generating device therein. The first compartment has a first heat exchanger (3) for conducting heat from an interior of the first compartment to the airflow chamber. The fan is arranged in the airflow chamber.
摘要翻译：计算机包括主板（2），外壳（1）和风扇（153）。主板具有安装在其上的第一发热装置（21）。外壳具有基本上密封的第一隔室（10）和与外壳的外部连通的气流室（30）。第一隔室在其中容纳第一发热装置。第一隔室具有用于将热量从第一隔室的内部传导到气流室的第一热交换器（3）。风扇布置在气流室中。

5. 发明申请

US20110068243A1 ADJUSTABLE APPARATUS 有权
标题翻译：可调节的装置
公开(公告)号：US20110068243A1
公开(公告)日：2011-03-24
申请号：US12650424
申请日：2009-12-30
申请人： LIU-JUN ZOU , HUI YU
发明人： LIU-JUN ZOU , HUI YU
IPC分类号： A47F5/08
CPC分类号： F16M11/046 , F16M2200/047 , F16M2200/065 , Y10S248/917 , Y10S248/919
摘要： An adjustable apparatus includes a bracket, an extendable member, a moving member, and a display supporting mount. The extendable member includes a base portion and a resilient tape portion attached to the base portion. The tape portion is secured to the bracket. The moving member is attached on the base portion. The display supporting mount is secured to the moving member for being secured to a display device, and movable with the moving member.
摘要翻译：可调节装置包括支架，可延伸构件，移动构件和显示器支撑座。可延伸构件包括基部和附接到基部的弹性带部分。胶带部分固定在支架上。移动构件附接在基部上。显示器支撑安装件固定到移动构件以固定到显示装置，并且可移动构件移动。

6. 发明申请

US20090016017A1 HEAT DISSIPATING SYSTEM 失效
标题翻译：热灭火系统
公开(公告)号：US20090016017A1
公开(公告)日：2009-01-15
申请号：US11842172
申请日：2007-08-21
申请人： HUI YU , MU-CHANG WANG
发明人： HUI YU , MU-CHANG WANG
IPC分类号： H05K7/20
CPC分类号： G06F1/20
摘要： A heat dissipating system comprises a computer enclosure (1), a motherboard (2), at least one dividing panel (271), at least one heat generating element, and at least one heat dissipating device. The computer enclosure has a bottom panel (11). The motherboard is mounted on and substantially parallel to the bottom panel. The at least one dividing panel is perpendicularly attached to the motherboard. The computer enclosure and the at least one dividing panel cooperatively form at least two heat dissipating chambers. The at least one heat generating element is disposed in each of the at least two chambers. The at least one heat dissipating device is disposed in each of the at least two heat dissipating chambers.
摘要翻译：散热系统包括计算机外壳（1），主板（2），至少一个分隔板（271），至少一个发热元件和至少一个散热装置。计算机外壳具有底板（11）。主板安装在底板上并基本上平行于底板。至少一个分隔板垂直地附接到主板。计算机外壳和至少一个分隔板协同地形成至少两个散热室。至少一个发热元件设置在至少两个室中的每一个中。至少一个散热装置设置在至少两个散热室中的每一个中。

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