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1. 发明申请

US20090135297A1 CAMERA MODULE 审中-公开
标题翻译：相机模块
公开(公告)号：US20090135297A1
公开(公告)日：2009-05-28
申请号：US12019914
申请日：2008-01-25
申请人： YING-CHENG WU , PANG-JUNG LIU , CHIEN-CHENG YAO , SHIH-MIN LO
发明人： YING-CHENG WU , PANG-JUNG LIU , CHIEN-CHENG YAO , SHIH-MIN LO
IPC分类号： H04N5/225 , G03B17/02
CPC分类号： H04N5/2253 , H04N5/2254 , H04N5/2257
摘要： An exemplary camera module includes a substrate, a printed circuit board, an imaging sensor chip, and a lens module. The substrate defines a top surface and a recessed portion in the top surface. The printed circuit board defines a bottom surface soldered to the top surface of the substrate. The imaging sensor chip is received in the recessed portion of the substrate. The lens module is positioned above the imaging sensor chip, with an optical center thereof aligned with that of the imaging sensor chip.
摘要翻译：示例性相机模块包括基板，印刷电路板，成像传感器芯片和透镜模块。衬底在顶表面中限定顶表面和凹陷部分。印刷电路板限定焊接到基板的顶表面的底表面。成像传感器芯片被接收在基板的凹部中。透镜模块位于成像传感器芯片上方，其光学中心与成像传感器芯片的光学中心对准。

2. 发明申请

US20090135296A1 IMAGING MODULE PACKAGE 审中-公开
标题翻译：成像模块包装
公开(公告)号：US20090135296A1
公开(公告)日：2009-05-28
申请号：US12013929
申请日：2008-01-14
申请人： YING-CHENG WU , PANG-JUNG LIU , CHIEN-CHENG YAO , SHIH-MIN LO
发明人： YING-CHENG WU , PANG-JUNG LIU , CHIEN-CHENG YAO , SHIH-MIN LO
IPC分类号： H04N5/225
CPC分类号： H05K1/183 , H01L24/14 , H01L27/14618 , H01L27/14625 , H01L2224/16 , H05K1/023 , H05K2201/10121 , H05K2201/10515
摘要： An exemplary imaging module package includes a housing, an imaging sensor module, and a lens module. The housing includes a first chamber and a second chamber coaxially aligned with the first chamber. The imaging sensor module is positioned within the first chamber and includes a substrate, an imaging sensor, a plurality of passive components and a plurality of soldering pads. The soldering pads connect the imaging sensor to the substrate. The passive components are mounted to the substrate and wholly disposed below the imaging sensor. The lens module is positioned within the second chamber of the housing.
摘要翻译：示例性成像模块包括壳体，成像传感器模块和透镜模块。壳体包括与第一腔室同轴对准的第一腔室和第二腔室。成像传感器模块位于第一腔室内，并且包括基底，成像传感器，多个无源部件和多个焊盘。焊盘将成像传感器连接到基板。无源部件安装到基板上，并且整体设置在成像传感器下方。透镜模块定位在壳体的第二腔室内。

3. 发明申请

US20090122176A1 IMAGING MODULE PACKAGE 有权
标题翻译：成像模块包装
公开(公告)号：US20090122176A1
公开(公告)日：2009-05-14
申请号：US12019918
申请日：2008-01-25
申请人： YING-CHENG WU , PANG-JUNG LIU , CHIEN-CHENG YAO , SHIH-MIN LO
发明人： YING-CHENG WU , PANG-JUNG LIU , CHIEN-CHENG YAO , SHIH-MIN LO
IPC分类号： H04N5/225
CPC分类号： H01L27/14618 , H01L27/14625 , H01L2924/0002 , H04N5/2253 , H04N5/2257 , H01L2924/00
摘要： An exemplary imaging module package includes a lens module and an imaging sensor module. The lens module includes a housing having a hollow top portion and a hollow bottom portion coaxially aligned with the hollow top portion. The imaging sensor module is received in the hollow bottom portion. The imaging sensor module includes an imaging sensor connected to the substrate and secured to the bottom portion, a substrate spaced from the bottom portion and defining at least one recess therein, and a plurality of passive components received in the at least one recess and wholly disposed below the imaging sensor.
摘要翻译：示例性成像模块包括透镜模块和成像传感器模块。透镜模块包括壳体，该壳体具有中空顶部部分和与中空顶部部分同轴对准的中空底部部分。成像传感器模块被容纳在中空底部。成像传感器模块包括连接到基板并固定到底部的成像传感器，与底部部分间隔开并在其中限定至少一个凹部的基板，以及容纳在至少一个凹部中并且完全设置的多个无源部件成像传感器下方。

4. 发明申请

US20090166833A1 SEMICONDUCTOR UNIT WHICH INCLUDES MULTIPLE CHIP PACKAGES INTEGRATED TOGETHER 审中-公开
标题翻译：半导体单元，其中包括多个芯片封装集成在一起
公开(公告)号：US20090166833A1
公开(公告)日：2009-07-02
申请号：US12061914
申请日：2008-04-03
申请人： STEVEN WEBSTER , YING-CHENG WU , MENG-LUNG YU , SHIH-MIN LO
发明人： STEVEN WEBSTER , YING-CHENG WU , MENG-LUNG YU , SHIH-MIN LO
IPC分类号： H01L23/02 , H01L21/00
CPC分类号： H01L25/50 , H01L25/105 , H01L2224/16225 , H01L2225/107 , H05K1/0284 , H05K1/119 , H05K1/183 , H05K3/0052 , H05K2201/10545 , H05K2201/10734
摘要： A semiconductor unit includes an interface plate, a supporting plate integrally formed with the interface plate, two chip packages positioned at opposite sides of the supporting plate, and leading traces running in the interface plate and the supporting plate, connected with the chip packages respectively.
摘要翻译：半导体单元包括接口板，与接口板一体形成的支撑板，位于支撑板的相对侧的两个芯片封装，以及分别与芯片封装相连接的界面板和支撑板中的导线。

5. 发明申请

US20090153706A1 IMAGING MODULE PACKAGE 审中-公开
标题翻译：成像模块包装
公开(公告)号：US20090153706A1
公开(公告)日：2009-06-18
申请号：US12100297
申请日：2008-04-09
申请人： STEVEN WEBSTER , YING-CHENG WU , SHUO-WEI HUANG , SHIH-MIN LO
发明人： STEVEN WEBSTER , YING-CHENG WU , SHUO-WEI HUANG , SHIH-MIN LO
IPC分类号： H04N5/335
CPC分类号： H01L25/16 , H01L27/14618 , H01L27/14625 , H01L31/0232 , H01L2224/48091 , H01L2224/8592 , H04N5/2257 , H01L2924/00014
摘要： An imaging module package includes a substrate, an imaging sensor chip, a functional unit, a housing, and a lens module positioned in the housing. The substrate defines an upper chamber extending through a top surface thereof, and a lower chamber extending through a bottom surface thereof. The imaging sensor chip is positioned in the upper chamber and is electrically connected to the substrate. The functional unit is positioned in the lower chamber and is electrically connected to the substrate. The housing is mounted on the top surface of the substrate and is disposed above the imaging sensor chip.
摘要翻译：成像模块封装包括基板，成像传感器芯片，功能单元，壳体和位于壳体中的透镜模块。衬底限定了通过其顶表面延伸的上室，以及延伸穿过其底表面的下室。成像传感器芯片定位在上部腔室中并且电连接到衬底。功能单元位于下腔室中，并与电极连接。壳体安装在基板的顶表面上并且设置在成像传感器芯片的上方。

6. 发明申请

US20090166837A1 COMBINATION OF CHIP PACKAGE UNITS 有权
标题翻译：芯片包装单元的组合
公开(公告)号：US20090166837A1
公开(公告)日：2009-07-02
申请号：US12060106
申请日：2008-03-31
申请人： STEVEN WEBSTER , YING-CHENG WU , CHAO-YUAN CHAN , SHIH-MIN LO
发明人： STEVEN WEBSTER , YING-CHENG WU , CHAO-YUAN CHAN , SHIH-MIN LO
IPC分类号： H01L23/488
CPC分类号： H01L25/105 , H01L23/13 , H01L24/48 , H01L2224/48091 , H01L2224/48227 , H01L2225/1052 , H01L2225/107 , H01L2924/00014 , H01L2924/16195 , H01L2924/1627 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A combination includes a first chip package unit and a second chip package unit on which the first chip package unit is placed. Each of the first and second chip package units includes a substrate having a first surface, a second surface, a chip package electrically connected to the first surface, and a plurality of bonding pads formed on the first and second surfaces. The bonding pads on the first surface of the first chip package unit are respectively electrically connected with the bonding pads on the surface of the second chip package unit. The chip packages electrically connected to the first surfaces are enclosed by the substrates, and the bonding pads on the second surfaces are configured as interface terminals of the combination.
摘要翻译：组合包括第一芯片封装单元和放置第一芯片封装单元的第二芯片封装单元。第一和第二芯片封装单元中的每一个包括具有第一表面，第二表面，电连接到第一表面的芯片封装的衬底和形成在第一表面和第二表面上的多个焊盘。第一芯片封装单元的第一表面上的焊盘分别与第二芯片封装单元的表面上的焊盘电连接。电连接到第一表面的芯片封装被基板封闭，并且第二表面上的焊盘被配置为该组合的接口端子。

7. 发明申请

US20090262226A1 IMAGE SENSOR PACKAGE AND CAMERA MODULE HAVING SAME 有权
标题翻译：图像传感器封装和相机模块
公开(公告)号：US20090262226A1
公开(公告)日：2009-10-22
申请号：US12173002
申请日：2008-07-14
申请人： CHI-KUEI LEE , YING-CHENG WU
发明人： CHI-KUEI LEE , YING-CHENG WU
IPC分类号： H04N5/335 , H04N5/225
CPC分类号： H01L27/14618 , H01L25/043 , H01L25/0657 , H01L27/14625 , H01L2224/48091 , H01L2224/48227 , H01L2924/09701 , H01L2924/181 , H01L2924/19105 , H01L2924/00014 , H01L2924/00012
摘要： An image sensor package includes a first substrate, an image sensor chip, a processing chip and a plurality of passive elements. The first substrate has a supporting surface and a bottom surface opposite to the supporting surface. The image sensor chip is disposed on the supporting surface and electrically connected to the first substrate. The image sensor chip package further includes a second substrate. The processing chip and the passive elements are mounted on the second substrate and electrically connected to the second substrate. The bottom surface of the first substrate defines a cavity for receiving the second substrate, the processing chip and the passive elements therein.
摘要翻译：图像传感器封装包括第一基板，图像传感器芯片，处理芯片和多个无源元件。第一基板具有支撑表面和与支撑表面相对的底表面。图像传感器芯片设置在支撑表面上并电连接到第一基板。图像传感器芯片封装还包括第二基板。处理芯片和无源元件安装在第二基板上并电连接到第二基板。第一基板的底表面限定用于接收第二基板，处理芯片和其中的无源元件的空腔。

8. 发明申请

US20080252760A1 COMPACT IMAGE SENSOR PACKAGE AND METHOD OF MANUFACTURING THE SAME 有权
标题翻译：紧凑型图像传感器封装及其制造方法
公开(公告)号：US20080252760A1
公开(公告)日：2008-10-16
申请号：US11871925
申请日：2007-10-12
申请人： YING-CHENG WU
发明人： YING-CHENG WU
IPC分类号： H04N5/335
CPC分类号： H04N5/2253 , H01L27/14618 , H01L2224/48091 , H01L2224/73265 , H04N5/2257 , H01L2924/00014
摘要： An exemplary image sensor package includes a base, an image sensor chip, a bonding layer, and an imaging lens. The image sensor chip is disposed on the base. The image sensor chip includes a photosensitive area. The bonding layer is disposed on at least one of the image sensor chip and the base. The bonding pads surround the photosensitive area. The imaging lens is adhered onto the bonding layer and hermetically seals the photosensitive area with the bonding layer. The imaging lens is configured for forming images on the photosensitive area. The present invention also relates to a method for manufacturing the image sensor package.
摘要翻译：示例性图像传感器封装包括基底，图像传感器芯片，结合层和成像透镜。图像传感器芯片设置在基座上。图像传感器芯片包括感光区域。接合层设置在图像传感器芯片和基底中的至少一个上。接合焊盘围绕感光区域。将成像透镜粘附到粘合层上并用粘合层密封光敏区域。成像透镜被配置用于在光敏区域上形成图像。本发明还涉及图像传感器封装的制造方法。

9. 发明申请

US20080265350A1 IMAGE CAPTURING DEVICE 有权
标题翻译：图像捕获设备
公开(公告)号：US20080265350A1
公开(公告)日：2008-10-30
申请号：US11862510
申请日：2007-09-27
申请人： YING-CHENG WU , KUN-HSIAO LIU
发明人： YING-CHENG WU , KUN-HSIAO LIU
IPC分类号： H01L31/0232
CPC分类号： H01L31/0203 , H01L31/02325 , H01L2224/48227 , H01L2924/3025 , H04N5/2253 , H04N5/2254 , H04N5/2257 , H01L2224/48091 , H01L2924/00014 , H01L2924/00
摘要： An image capturing device includes an image sensor package and a lens module aligned with the image sensor package. The image sensor package includes a substrate, at least one passive component, an insulative layer, and an image sensor. The substrate has a surface facing an object side of the image capturing device, the surface defines a cavity therein. The at least one passive component is disposed within the cavity and electrically connected to the substrate. The insulative layer is received in the cavity and encases the at least one passive component. The image sensor is disposed on the insulative layer and electrically connected to the substrate. The holder has an end connecting with the barrel and an opposite end secured on the substrate.
摘要翻译：图像捕获装置包括图像传感器封装和与图像传感器封装件对准的透镜模块。图像传感器封装包括衬底，至少一个无源部件，绝缘层和图像传感器。基板具有面向图像捕获装置的物体侧的表面，该表面在其中限定空腔。所述至少一个无源部件设置在所述腔体内并电连接到所述基板。绝缘层被接收在空腔中并且包围至少一个无源部件。图像传感器设置在绝缘层上并与衬底电连接。保持器具有与筒连接的端部，并且相对端固定在基底上。

10. 发明申请

US20080252771A1 CAMERA MODULE WITH COMPACT PACKAGING OF IMAGE SENSOR CHIP AND METHOD OF MANUFACTURING THE SAME 审中-公开
标题翻译：具有图像传感器芯片的紧凑包装的相机模块及其制造方法
公开(公告)号：US20080252771A1
公开(公告)日：2008-10-16
申请号：US11871923
申请日：2007-10-12
申请人： YING-CHENG WU
发明人： YING-CHENG WU
IPC分类号： H04N5/225
CPC分类号： H04N5/2254 , H04N5/2257
摘要： An exemplary camera module includes a lens module, a base, an image sensor chip, a bonding layer, and an imaging lens. The lens module is disposed on the base. The lens module is optically aligned with the image sensor chip. The image sensor chip is disposed on the base. The image sensor chip includes a photosensitive area. The bonding layer is disposed on at least one of the image sensor chip and the base. The bonding pads surround the photosensitive area. The imaging lens is adhered onto the bonding layer and hermetically seals the photosensitive area. The imaging lens is configured for focusing light signals onto the photosensitive area. The present invention also relates to a method for manufacturing the camera module.
摘要翻译：示例性相机模块包括透镜模块，底座，图像传感器芯片，粘结层和成像透镜。透镜模块设置在基座上。镜头模块与图像传感器芯片光学对准。图像传感器芯片设置在基座上。图像传感器芯片包括感光区域。接合层设置在图像传感器芯片和基底中的至少一个上。接合焊盘围绕感光区域。成像透镜粘附到粘合层上并气密地密封感光区域。成像透镜被配置为将光信号聚焦到感光区域上。本发明还涉及一种用于制造相机模块的方法。

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