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2. 发明申请

US20110242793A1 BACKLIGHT MODULE 有权
标题翻译：背光模组
公开(公告)号：US20110242793A1
公开(公告)日：2011-10-06
申请号：US13042001
申请日：2011-03-07
申请人： HUNG-CHIH LIN , YI-WEN LIN
发明人： HUNG-CHIH LIN , YI-WEN LIN
IPC分类号： G02F1/13357
CPC分类号： G02F1/133603 , G02F2001/133628
摘要： A backlight module includes a heat-dissipating element, at least one light-emitting element disposed on a first side of the heat-dissipating element, a back plate, and a heat-insulation element. The back plate has at least one opening and is disposed on the first side of the heat-dissipating element, and the back plate is not overlapped with the light-emitting element. The heat-insulation element is disposed between the back plate and the heat-dissipating element for reducing heat conduction between the back plate and the heat-dissipating element so as to prevent the heat generated by the light-emitting element from being conducted to the back plate.
摘要翻译：背光模块包括散热元件，设置在散热元件的第一侧上的至少一个发光元件，背板和隔热元件。背板具有至少一个开口并且设置在散热元件的第一侧上，并且背板不与发光元件重叠。隔热元件设置在背板和散热元件之间，用于减少背板和散热元件之间的热传导，以防止发光元件产生的热量被传导到背部盘子。

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