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    • 10. 发明授权
    • Reducing polymerization stress by controlled segmental curing
    • 通过受控的节段固化降低聚合应力
    • US06783810B2
    • 2004-08-31
    • US09809606
    • 2001-03-15
    • Xiaoming JinPaul D. Hammesfahr
    • Xiaoming JinPaul D. Hammesfahr
    • C08F446
    • G02B6/04A61C19/003A61C19/004B29C35/0894B29K2105/243G02B6/4298Y10S522/908
    • A photopolymerizable material is exposed to light to effect curing. A portion of the material is exposed to light in a conventional manner, while at least one other portion of the material is masked from direct exposure to the light by use of a mask (10) having at least one mask segment (11) which either completely or at least partially blocks the light. In this manner, the polymerization stress associated with the cured materials is limited or minimized due to extended molecular relaxation promoted by this controlled or hybrid curing technique. Also according to the invention, different segments (30, 31) of a material to be cured (22) are exposed to different wavelengths of light energy (21) or one such segment (30, 31) is exposed to light energy while another such segment is not.
    • 将光聚合材料曝光以实现固化。 材料的一部分以常规方式曝光,同时通过使用具有至少一个掩模段(11)的掩模(10)将材料的至少一个其它部分掩盖为直接暴露于光,其中任一 完全或至少部分阻挡光。 以这种方式,由于通过该受控或混合固化技术促进的扩展的分子松弛,与固化材料相关的聚合应力受到限制或最小化。 根据本发明,待固化材料(22)的不同部分(30,31)暴露于不同波长的光能(21),或者一个这样的部分(30,31)暴露于光能,而另一个 段不是