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1. 发明授权

US06372042B1 System for processing semiconductor wafers producing a downward laminar flow of clean air in front of baking units 失效
标题翻译：用于处理半导体晶片的系统，其在烘烤单元前面产生清洁空气的向下层流
公开(公告)号：US06372042B1
公开(公告)日：2002-04-16
申请号：US09482537
申请日：2000-01-14
申请人： Woo-dong Sung , Sam-soon Han , Chang-wook Oh , Jeong-lim Nam
发明人： Woo-dong Sung , Sam-soon Han , Chang-wook Oh , Jeong-lim Nam
IPC分类号： B05C1102
CPC分类号： H01L21/67034
摘要： A photo process system for semiconductor wafers prevents air from flowing across the top of a baking region to produce a stable downward laminar air flow in front of baking units disposed at several levels in the baking region. The baking region is located on one side of a housing, and a coating unit for coating a wafer with a photoresist is located on the other side of the housing. The housing has a clean air entrance and air filters at an upper portion thereof, and a clean air discharge opening at the very bottom thereof. An air flow containment dam prevents clean air entering the housing from flowing horizontally at the top of the baking region. Such a horizontal flow of air would otherwise produce turbulence severely affecting the ability of the air to flow downward across the front of the baking units and toward the discharge opening as a laminar air flow. The laminar air flow hardly passes into the baking units and thus, hardly induces temperature variations in the coated wafers that are being baked. Accordingly, the thickness of the photoresist film on the wafer becomes highly uniform, as does the critical dimension of a pattern produced from the film. Also, dust or ionic contaminants are directly discharged through the discharge opening at the bottom of the housing by the downward laminar flow of clean air. The wafers within the baking units are prevented from being contaminated, thereby enhancing the yield of the semiconductor products.
摘要翻译：用于半导体晶片的照相处理系统防止空气流过烘烤区域的顶部，以在烘烤单元前面设置稳定的向下层流气流，该烘烤单元设置在烘烤区域中的若干水平。烘烤区域位于壳体的一侧，并且用于用光致抗蚀剂涂覆晶片的涂布单元位于壳体的另一侧。壳体在其上部具有清洁空气入口和空气过滤器，并且在其最底部具有清洁空气排出口。一个气流容纳挡板防止进入壳体的清洁空气在烘烤区域的顶部水平流动。这样的水平空气流动否则将产生严重影响空气沿烘烤单元的前部向下流动并且以层流空气流向排放口的能力的湍流。层流气流几乎不会进入烘焙单元，因此几乎不会引起被烘烤的涂覆的晶片的温度变化。因此，晶片上的光致抗蚀剂膜的厚度变得高度均匀，与由膜产生的图案的临界尺寸一样。此外，灰尘或离子污染物通过清洁空气的向下层流直接排出通过壳体底部的排放口。防止烘烤单元内的晶片被污染，从而提高半导体产品的产量。

2. 发明授权

US06347990B1 Microelectronic fabrication system cleaning methods and systems that maintain higher air pressure in a process area than in a transfer area 有权
标题翻译：微电子制造系统清洁方法和系统，其在处理区域中保持比在转移区域更高的空气压力
公开(公告)号：US06347990B1
公开(公告)日：2002-02-19
申请号：US09338712
申请日：1999-06-23
申请人： Woo-dong Sung , Sam-soon Han , Chang-wook Oh , Kang-sik Lee
发明人： Woo-dong Sung , Sam-soon Han , Chang-wook Oh , Kang-sik Lee
IPC分类号： F24F710
CPC分类号： H01L21/67748 , F24F2011/0004 , H01L21/67017 , H01L21/6715 , Y10S414/14
摘要： A microelectronic fabrication system that includes a service area, a process area in the service area where microelectronic devices are processed, and a transfer area in the service area where microelectronic devices are transferred to and from the process area, is cleaned by maintaining higher pressure in the process area than in the transfer area, to thereby reduce particle flow from the transfer area to the process area. It has been found that conventional microelectronic fabrication system cleaning methods and systems can allow air to flow backward to the wafer process area. By allowing backward flow of air to the wafer process area, air may be induced from a place where a lower degree of cleanliness is maintained to a place where a higher degree of cleanliness should be maintained. Due to the backward flow of air, particles contained in the transfer area, that may be generated by the transfer system, may flow onto the wafer that is being processed in the process area. In sharp contrast, by maintaining higher air pressure in the process area than in the transfer area, particle flow from the transfer area to the process area can be reduced and preferably can be eliminated.
摘要翻译：一种微电子制造系统，其包括服务区域，处理微电子器件的服务区域中的处理区域和将微电子设备传送到处理区域的服务区域中的传送区域通过保持更高的压力处理面积大于转印区域，从而减少从转印区域到处理区域的颗粒流动。已经发现，传统的微电子制造系统清洁方法和系统可以允许空气向后流动到晶片处理区域。通过允许空气向晶片加工区域的反向流动，可以从维持较低洁净度的地方诱导到维持较高洁净度的地方的空气。由于空气的反向流动，可能由转移系统产生的转移区域中包含的颗粒可能流入正在处理区域中的晶片。与之形成鲜明对比的是，通过在处理区域中保持比在转印区域更高的空气压力，可以减少从转印区域到处理区域的颗粒流动，并且优选地可以消除。

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