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    • 7. 发明申请
    • Organic silver complex compound used in paste for conductive pattern forming
    • 用于导电图案形成的糊料中的有机银络合物
    • US20100021704A1
    • 2010-01-28
    • US12311345
    • 2007-09-21
    • Sung-Ho YoonSo-Won KimSang-Ki ChunDong-Wook LeeSeoung-Wook KimWon-Jong Kwon
    • Sung-Ho YoonSo-Won KimSang-Ki ChunDong-Wook LeeSeoung-Wook KimWon-Jong Kwon
    • C07F1/10H01B1/12B32B3/00
    • H01B1/22H05K1/097H05K2203/121Y10T428/24802Y10T428/24917
    • Disclosed is an organic silver complex compound in which an organic ligand, containing an amine group (—NH2) and a hydroxyl group (—OH), is bonded with aliphatic silver (Ag) carboxylate at an equivalent ratio of 2:1 to form a complex. Also disclosed is a conductive paste comprising: a silver source selected from the group consisting of silver oxide powder, silver powder and silver flake; and organic silver complex compound in which an organic ligand, containing an amine group and a hydroxyl group, is bonded with an organic silver compound to form a complex. The organic silver complex compound has high solubility in a solvent and is present in the liquid state at room temperature. Thus, an extra solvent is not used in a conductive pattern-forming paste containing the complex compound or is used in a small amount, such that the content of silver in the conductive pattern-forming paste can be increased. Also, the conductive pattern-forming paste containing the complex compound has high viscosity, and thus shows excellent stability without adding a dispersant and, at the same time, is easily industrially applied.
    • 公开了一种有机银络合物,其中含有胺基(-NH 2)和羟基(-OH)的有机配体以2:1的当量比与脂肪族银(Ag)羧酸盐键合,形成 复杂。 还公开了一种导电膏,其包括:选自氧化银粉末,银粉和银片的银源; 和其中含有胺基和羟基的有机配体与有机银化合物键合以形成络合物的有机银络合物。 有机银络合物在溶剂中的溶解性高,在室温下呈液态。 因此,在含有配位化合物的导电图案形成糊剂中不使用额外的溶剂,或者少量使用,可以提高导电图案形成膏剂中的银含量。 此外,含有配合化合物的导电图形形成糊具有高粘度,因此在不添加分散剂的情况下显示出优异的稳定性,同时容易在工业上使用。