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    • 5. 发明授权
    • Method of forming a polysilicon layer
    • 形成多晶硅层的方法
    • US06498082B1
    • 2002-12-24
    • US09643730
    • 2000-08-23
    • Won-Joon HoHyung-Sik Kim
    • Won-Joon HoHyung-Sik Kim
    • H01L213205
    • H01L29/4925H01L21/28035H01L21/32055
    • A method of forming a polysilicon layer includes the steps of: loading a semiconductor substrate in a CVD reactor wherein a gate insulating layer is formed on the substrate; decompressing the reactor; depositing a first polysilicon layer on the substrate by flowing an SiH4 gas into the reactor; forming a plurality of Si—N bonds on the first polysilicon layer by maintaining atmospheric pressure of the reactor by filling the reactor with nitrogen gas; decompressing the reactor; and depositing a second polysilicon layer on the first polysilicon layer by flowing SiH4 gas into the reactor.
    • 形成多晶硅层的方法包括以下步骤:将半导体衬底装载在CVD反应器中,其中栅极绝缘层形成在衬底上; 减压反应器; 通过使SiH 4气体流入反应器而在衬底上沉积第一多晶硅层; 通过用氮气填充反应器来保持反应器的大气压在第一多晶硅层上形成多个Si-N键; 减压反应器; 以及通过将SiH 4气体流入反应器而在第一多晶硅层上沉积第二多晶硅层。