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    • 4. 发明申请
    • CIRCUIT PROTECTION DEVICE INCLUDING RESISTOR AND FUSE ELEMENT
    • 包括电阻和保险丝元件的电路保护装置
    • US20090261451A1
    • 2009-10-22
    • US12106797
    • 2008-04-21
    • Stephen J. Whitney
    • Stephen J. Whitney
    • H01L29/76H01L21/44
    • H01H85/0241H01H85/0052H01L23/62H01L2924/0002H01L2924/00
    • An integral circuit protection device includes a substrate disposed between first and second terminals. The substrate is composed of a resistive material. A first conductive layer is disposed on a first surface of the substrate and in electrical contact with the first terminal. A second conductive layer is disposed on a second surface of the substrate. A first electrically insulating layer is disposed on the second conductive layer and substantially covers the second conductive layer. The first electrically insulating layer includes an aperture. A fuse element is disposed on the first electrically insulating layer and is in electrical contact with the second conductive layer through the aperture and in electrical contact with the second terminal. The fuse element is in electrical series with the resistive material. A second electrically insulating layer is disposed over the fuse element.
    • 集成电路保护装置包括设置在第一和第二端子之间的衬底。 基板由电阻材料构成。 第一导电层设置在基板的第一表面上并与第一端子电接触。 第二导电层设置在基板的第二表面上。 第一电绝缘层设置在第二导电层上并且基本上覆盖第二导电层。 第一电绝缘层包括孔。 熔丝元件设置在第一电绝缘层上,并且通过该孔与第二导电层电接触并与第二端子电接触。 熔丝元件与电阻材料电连接。 第二电绝缘层设置在熔丝元件上方。
    • 9. 发明授权
    • Circuit protection device including resistor and fuse element
    • 电路保护装置包括电阻和熔丝元件
    • US08076751B2
    • 2011-12-13
    • US12106797
    • 2008-04-21
    • Stephen J. Whitney
    • Stephen J. Whitney
    • H01L29/72
    • H01H85/0241H01H85/0052H01L23/62H01L2924/0002H01L2924/00
    • An integral circuit protection device includes a substrate disposed between first and second terminals. The substrate is composed of a resistive material. A first conductive layer is disposed on a first surface of the substrate and in electrical contact with the first terminal. A second conductive layer is disposed on a second surface of the substrate. A first electrically insulating layer is disposed on the second conductive layer and substantially covers the second conductive layer. The first electrically insulating layer includes an aperture. A fuse element is disposed on the first electrically insulating layer and is in electrical contact with the second conductive layer through the aperture and in electrical contact with the second terminal. The fuse element is in electrical series with the resistive material. A second electrically insulating layer is disposed over the fuse element.
    • 集成电路保护装置包括设置在第一和第二端子之间的衬底。 基板由电阻材料构成。 第一导电层设置在基板的第一表面上并与第一端子电接触。 第二导电层设置在基板的第二表面上。 第一电绝缘层设置在第二导电层上并且基本上覆盖第二导电层。 第一电绝缘层包括孔。 熔丝元件设置在第一电绝缘层上,并且通过该孔与第二导电层电接触并与第二端子电接触。 熔丝元件与电阻材料电连接。 第二电绝缘层设置在熔丝元件上方。