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    • 2. 发明申请
    • Method for forming hermetic glass bead assembly having high frequency compensation
    • 用于形成具有高频补偿的密封玻璃珠组件的方法
    • US20060134939A1
    • 2006-06-22
    • US11328636
    • 2006-01-10
    • William OldfieldMaurice Moberg
    • William OldfieldMaurice Moberg
    • H01R12/00
    • H01R24/44H01R2103/00
    • Methods and devices in accordance with the present invention can comprise forming an electrical feed-through assembly to provide a hermetic seal in a coaxial connector. In one embodiment, the electrical feed-through assembly comprises a conductive insert having a bore, a dielectric insert positioned within the bore having a first diameter sized such that an impedance of the dielectric insert is a target impedance, the dielectric insert having a center conductive pin extending there-through, and an air dielectric positioned within the bore, the air dielectric having a second diameter sized such that an impedance of the air dielectric is the target impedance, a portion of the air dielectric extending into the dielectric insert, wherein the portion of the air dielectric extending into the dielectric insert is a compensation gap.
    • 根据本发明的方法和装置可以包括形成电馈通组件以在同轴连接器中提供气密密封。 在一个实施例中,电气馈通组件包括具有孔的导电插入件,位于孔内的电介质插入件具有第一直径尺寸,使得电介质插入件的阻抗为目标阻抗,电介质插入件具有中心导电 引脚延伸穿过,以及位于孔内的空气介质,空气电介质具有第二直径尺寸,使得空气电介质的阻抗是目标阻抗,空气介质的一部分延伸到电介质插入件中,其中, 延伸到电介质插入件中的空气电介质的一部分是补偿间隙。
    • 3. 发明申请
    • Hermetic glass bead assembly having high frequency compensation
    • 密封玻璃珠组件具有高频补偿
    • US20050191869A1
    • 2005-09-01
    • US10790391
    • 2004-03-01
    • William OldfieldMaurice Moberg
    • William OldfieldMaurice Moberg
    • H01R12/00H01R13/646
    • H01R24/44H01R2103/00
    • Methods and devices in accordance with the present invention can comprise forming an electrical feed-through assembly to provide a hermetic seal in a coaxial connector. In one embodiment, the electrical feed-through assembly comprises a conductive insert having a bore, a dielectric insert positioned within the bore having a first diameter sized such that an impedance of the dielectric insert is a target impedance, the dielectric insert having a center conductive pin extending there-through, and an air dielectric positioned within the bore, the air dielectric having a second diameter sized such that an impedance of the air dielectric is the target impedance, a portion of the air dielectric extending into the dielectric insert, wherein the portion of the air dielectric extending into the dielectric insert is a compensation gap.
    • 根据本发明的方法和装置可以包括形成电馈通组件以在同轴连接器中提供气密密封。 在一个实施例中,电气馈通组件包括具有孔的导电插入件,位于孔内的电介质插入件具有第一直径尺寸,使得电介质插入件的阻抗为目标阻抗,电介质插入件具有中心导电 引脚延伸穿过,以及位于孔内的空气介质,空气电介质具有第二直径尺寸,使得空气电介质的阻抗是目标阻抗,空气介质的一部分延伸到电介质插入件中,其中, 延伸到电介质插入件中的空气电介质的一部分是补偿间隙。
    • 4. 发明授权
    • Microstrip dot termination usable with optical modulators
    • 微带点终端可用于光学调制器
    • US06593829B2
    • 2003-07-15
    • US09947480
    • 2001-09-06
    • William OldfieldKaram Noujeim
    • William OldfieldKaram Noujeim
    • H01P126
    • H01P1/268
    • A dot termination comprising a disk of thin film resistive material connects a transmission line on a substrate to a DC ground plane in a manner to provide broadband high frequency performance. The dot termination connects to DC ground connections spaced about the perimeter of the disk. Each DC connector includes a ground via passing through the substrate to the ground plane. A metal trace is used for each DC connection, the trace connecting a respective via with the perimeter of the disk. Each metal trace can include a resistive portion connected to the dot region and a metal trace portion connecting the trace to the via. A resistive extension tongue of the disk connects the disk to a transmission line trace.
    • 包括薄膜电阻材料盘的点终端以提供宽带高频性能的方式将基板上的传输线连接到DC接地层。 点终端连接到围绕磁盘周边间隔开的直流接地连接。 每个DC连接器包括通过基板通过接地平面的接地。 每个直流连接都使用金属轨迹,迹线将相应的通孔与磁盘的周边相连。 每个金属迹线可以包括连接到点区域的电阻部分和将迹线连接到通孔的金属迹线部分。 磁盘的电阻延长舌片将磁盘连接到传输线迹线。
    • 5. 发明授权
    • Apparatus for measuring and/or injecting high frequency signals in
integrated systems
    • 用于在集成系统中测量和/或注入高频信号的装置
    • US5905421A
    • 1999-05-18
    • US800952
    • 1997-02-18
    • William Oldfield
    • William Oldfield
    • G01R1/067G01R31/28
    • G01R1/06772G01R31/2822
    • A device for measuring and/or injecting a high frequency signal, such as a 20 GHz signal from and/or into a system, is provided. The device includes a connector coupled to a coaxial cable at one end. A relatively small, low inductive rectangular member is coupled to the connector at the other end. A conductive element is coupled to the rectangular member and is used for measuring and infecting the high frequency signal from and/or into a microwave transmission line positioned on a substrate. First and second rigid prongs are coupled to the rectangular member and are inserted into respective ground openings on the substrate. A network analyzer may be coupled to the cable for analyzing and generating the high frequency signal.
    • 提供了一种用于测量和/或注入来自系统和/或系统的20GHz信号的高频信号的装置。 该装置包括在一端耦合到同轴电缆的连接器。 相对小的低电感性矩形构件在另一端耦合到连接器。 导电元件耦合到矩形构件并且用于测量和感染来自位于基板上的微波传输线的高频信号和/或传送到位于基板上的微波传输线。 第一和第二刚性插脚联接到矩形构件并且插入到基板上的相应的开口中。 网络分析器可以耦合到电缆,用于分析和产生高频信号。
    • 7. 发明授权
    • Connector having an axial resilient inner and outer conductors
    • 连接器具有轴向弹性内外导体
    • US6053755A
    • 2000-04-25
    • US120655
    • 1998-07-22
    • William Oldfield
    • William Oldfield
    • H01R13/115H01R24/54H01R13/28
    • H01R24/542H01R2103/00
    • A microwave coaxial connector having both inner and outer axial resilient conductors is provided. The connector may be used for connecting a microwave device to a coaxial cable without causing damage to the microwave device housing or degrading a transmitted microwave signal. The inner axial resilient conductor includes an inner cylindrical conducting member having an inner bore formed by a plurality of fingers. A cylindrical contact member includes a first end for inserting into the inner bore. The outer axially resilient conductor includes an outer cylindrical conducting member circumjacent about the inner conductor forming a ring-shaped opening. An outer contact member having a plurality of fingers is inserted in the ring-shaped opening to provide an outer resilient conductor. A connector for connecting adjacent devices is also provided. This connector includes a pair of inner and outer resilient conductors positioned at opposite ends of the connector. The connector eliminates the need of selecting and cutting coaxial cable as well as using soldering, ribbon bonding or screws in connecting adjacent microwave devices.
    • 提供具有内部和外部轴向弹性导体的微波同轴连接器。 该连接器可以用于将微波设备连接到同轴电缆,而不会损坏微波器件外壳或降低发射的微波信号。 内部轴向弹性导体包括具有由多个手指形成的内孔的内圆柱形导电构件。 圆柱形接触构件包括用于插入内孔的第一端。 外部轴向弹性导体包括围绕形成环形开口的内部导体周围的外部圆柱形导电构件。 具有多个指状物的外部接触构件被插入到环形开口中以提供外部弹性导体。 还提供了用于连接相邻设备的连接器。 该连接器包括位于连接器的相对端的一对内部和外部弹性导体。 连接器消除了选择和切割同轴电缆以及连接相邻微波设备时使用焊接,色带接合或螺丝的需要。
    • 8. 发明授权
    • Apparatus for providing a ground for circuits on carriers
    • 用于为载体上的电路提供接地的装置
    • US5812039A
    • 1998-09-22
    • US800960
    • 1997-02-18
    • William Oldfield
    • William Oldfield
    • H01L23/66H01P3/08H05K1/02H05K1/05H05K1/14H01P1/00
    • H01P3/081H01L23/66H01L2224/45144H01L2224/48137H01L2224/48472H01L24/45H01L24/48H01L2924/00014H01L2924/01004H01L2924/01079H01L2924/3011H05K1/0237H05K1/05H05K1/142
    • A ground path for microwave circuits positioned on carriers is provided. A ground path is provided between a first and second carrier coupled to respective microwave circuit substrates. The first and second carriers are coupled to a base, forming an opening between the first and second carriers. A conductive element is coupled to a first microstrip transmission line on the first substrate and a second microstrip transmission line on the second substrate. A conductive spring is then positioned in the opening in order to create a ground path. The microstrip transmission line may consist of alumina or a high-frequency plastic, such as Teflon or Duroid.RTM.. The conductive spring may consist of beryllium copper. A conductive rubber material may also be positioned in the opening, contacting the conductive spring and the base. The conductive spring and conductive element form a transmission having an impedance of between approximately 45 ohms and 60 ohms, thereby substantially improving microwave signal quality transmitted on a substrate coupled to relatively thick carriers.
    • 提供了位于载体上的微波电路的接地路径。 在耦合到相应的微波电路基板的第一和第二载体之间提供接地路径。 第一和第二载体联接到基座,在第一和第二载体之间形成开口。 导电元件耦合到第一基板上的第一微带传输线和第二基板上的第二微带传输线。 然后将导电弹簧定位在开口中,以便产生接地路径。 微带传输线可以由氧化铝或高频塑料(例​​如特氟龙或Duroid TM)组成。 导电弹簧可由铍铜组成。 导电橡胶材料也可以定位在开口中,与导电弹簧和底座接触。 导电弹簧和导电元件形成具有在大约45欧姆和60欧姆之间的阻抗的传输,从而基本上改善了在耦合到相对厚的载体上的基板上传输的微波信号质量。