专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明授权

US4935843A Lead filled ceramic capacitor 失效
标题翻译：引线填充陶瓷电容器
公开(公告)号：US4935843A
公开(公告)日：1990-06-19
申请号：US439320
申请日：1989-11-20
申请人： William McLaughlin , Doug Lee , Ricardo Garcia
发明人： William McLaughlin , Doug Lee , Ricardo Garcia
IPC分类号： H01G4/232 , H01G4/30 , H01G4/10 , H01G7/00
CPC分类号： H01G4/232 , H01G4/2325 , H01G4/302 , H01G4/308 , Y10T29/435
摘要： A method of manufacturing a ceramic capacitor of the lead filled type includes coating the ends of the ceramic monolith with a terminating paste incorporating oxidizable metal particles characterized in that the lead will not wet to oxides of the metals but will wet to unoxidized or lightly oxidized increments of the metals. The paste is fused in an oxidizing environment or is fused in an inert environment and thereafter heated in an oxidizing environment with the result that the metal increments adjacent the exterior of the fused coating are oxidized whereas the metal at the interior portions of the paste are unoxidized or only slightly oxidized. Upon metal injection, the lead will wet to the interior portions of the fused paste but will not wet to the exterior of the paste whereby injected chips may be readily separated and whereby the size of the chip is rendered predictable due to the absence of adherent lead.
摘要翻译：制造铅填充型陶瓷电容器的方法包括用包含可氧化金属颗粒的终止浆料涂覆陶瓷整体料的端部，其特征在于，铅不会润湿金属的氧化物，但会润湿至未氧化或轻度氧化的增量的金属。将糊状物在氧化环境中熔融或在惰性环境中熔融，然后在氧化环境中加热，结果邻近熔融涂层的金属增量被氧化，而糊料内部的金属未氧化或仅稍微氧化。在金属注入时，铅将会熔化到熔融糊状物的内部，但不会湿到糊料的外部，从而可以容易地分离注入的芯片，由此由于不存在粘附的引线，芯片的尺寸可以预测。

2. 发明授权

US4881308A Method of terminating lead filled capacitor 失效
标题翻译：终端充电电容器的方法
公开(公告)号：US4881308A
公开(公告)日：1989-11-21
申请号：US214513
申请日：1988-07-01
申请人： William McLaughlin , Doug Lee , Ricardo Garcia
发明人： William McLaughlin , Doug Lee , Ricardo Garcia
IPC分类号： H01G4/12 , H01G4/232 , H01G4/30
CPC分类号： H01G4/232 , H01G4/2325 , H01G4/302 , H01G4/308 , Y10T29/435 , Y10T29/49163
摘要： A method of manufacturing a ceramic capacitor of the lead filled type includes coating the ends of the ceramic monolith with a terminating paste incorporating oxidizable metal particles characterized in that the lead will not wet to oxides of the metals but will wet to unoxidized or lightly oxidized increments of the metals. The paste is fused in an oxidizing environment or is fused in an inert environment and thereafter heated in an oxidizing environment with the result that the metal increments adjacent the exterior of the fused coating are oxidized whereas the metal at the interior portions of the paste are unoxidized or only slightly oxidized. Upon metal injection, the lead will wet to the interior portions of the fused paste but will not wet to the exterior of the paste whereby injected chips may be readily separated and whereby the size of the chip is rendered predictable due to the absence of adherent lead.
摘要翻译：制造铅填充型陶瓷电容器的方法包括用包含可氧化金属颗粒的终止浆料涂覆陶瓷整料的端部，其特征在于，铅不会润湿金属的氧化物，而是会润湿到未氧化或轻微氧化的增量的金属。将糊状物在氧化环境中熔融或在惰性环境中熔融，然后在氧化环境中加热，结果邻近熔融涂层的金属增量被氧化，而糊料内部的金属未氧化或仅稍微氧化。在金属注入时，铅将会熔化到熔融糊状物的内部，但不会湿到糊料的外部，从而可以容易地分离注入的芯片，由此由于不存在粘附的引线，芯片的尺寸可以预测。