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1. 发明授权

US07719108B2 Enhanced reliability semiconductor package 有权
标题翻译：增强可靠性半导体封装
公开(公告)号：US07719108B2
公开(公告)日：2010-05-18
申请号：US11032526
申请日：2005-01-10
申请人： William E. Murphy , Ryan S. Riegle , Richard Shields , David L. Vos
发明人： William E. Murphy , Ryan S. Riegle , Richard Shields , David L. Vos
IPC分类号： H01L27/00
CPC分类号： H05K1/0209 , B23K1/0016 , B23K2101/40 , H01L2224/16225 , H01L2924/00011 , H01L2924/00014 , H05K3/341 , H05K2201/09781 , H05K2201/10689 , H05K2201/10734 , H05K2201/10969 , Y02P70/613 , H01L2224/0401
摘要： A method of packaging a semiconductor component with a printed wiring board is disclosed. The method includes determining a first distance, applying a thin film onto a surface of the semiconductor component such that the thin film is spaced apart from a support of the semiconductor, applying a solder pad onto the printed wiring board, placing the semiconductor component with the thin film onto the printed wiring board, and positioning the thin film adjacent the solder pad.
摘要翻译：公开了一种用印刷线路板封装半导体部件的方法。该方法包括确定第一距离，将薄膜施加到半导体部件的表面上，使得薄膜与半导体的支撑体间隔开，将焊盘焊接到印刷线路板上，将半导体部件放置在将薄膜贴到印刷电路板上，并将薄膜定位在焊盘附近。

2. 发明授权

US07670877B2 Reliability enhancement process 有权
标题翻译：可靠性增强过程
公开(公告)号：US07670877B2
公开(公告)日：2010-03-02
申请号：US11873146
申请日：2007-10-16
申请人： William E. Murphy , Ryan S. Riegle , Richard W. Shields , David L. Vos
发明人： William E. Murphy , Ryan S. Riegle , Richard W. Shields , David L. Vos
IPC分类号： H01L21/00
CPC分类号： H05K1/0209 , B23K1/0016 , B23K2101/40 , H01L2224/16225 , H01L2924/00011 , H01L2924/00014 , H05K3/341 , H05K2201/09781 , H05K2201/10689 , H05K2201/10734 , H05K2201/10969 , Y02P70/613 , H01L2224/0401
摘要： A method of packaging a semiconductor component with a printed wiring board is disclosed. The method includes determining a first distance, applying a thin film onto a surface of the semiconductor component such that the thin film is spaced apart from a support of the semiconductor, applying a solder pad onto the printed wiring board, placing the semiconductor component with the thin film onto the printed wiring board, and positioning the thin film adjacent the solder pad.
摘要翻译：公开了一种用印刷线路板封装半导体部件的方法。该方法包括确定第一距离，将薄膜施加到半导体部件的表面上，使得薄膜与半导体的支撑体间隔开，将焊盘焊接到印刷线路板上，将半导体部件放置在将薄膜贴到印刷电路板上，并将薄膜定位在焊盘附近。

3. 发明授权

US07804179B2 Plastic ball grid array ruggedization 有权
标题翻译：塑料球栅阵列加固
公开(公告)号：US07804179B2
公开(公告)日：2010-09-28
申请号：US12108792
申请日：2008-04-24
申请人： Charles H. Dando, III , Stephen G. Gonya , William E. Murphy
发明人： Charles H. Dando, III , Stephen G. Gonya , William E. Murphy
IPC分类号： H01L21/00
CPC分类号： B23K3/0623 , B23K2101/40 , H01L23/16 , H01L23/3121 , H01L23/49811 , H01L23/49816 , H01L23/49833 , H01L24/16 , H01L24/45 , H01L24/48 , H01L2224/45147 , H01L2224/48 , H01L2924/10253 , H01L2924/10329 , H01L2924/15311 , H01L2924/15312 , H01L2924/181 , H01L2924/3025 , H01L2924/3511 , H01L2924/00014 , H01L2924/00012
摘要： A method and product which provides a thin metal or ceramic plate to the top of a plastic grid array (PGA) as a stiffener to maintain its flatness over temperature during a column attach process, and the columns are used for attachment to circuit boards or other circuit devices. These may be constructed in this manner initially or may be retrofitted plastic ball grid arrays from which the solder balls are removed and, the stiffener is attached to the top, and the solder columns have been added to replace the solder balls. The stiffener is a bonded thin metal or ceramic plate attached to the top of the PGA to maintain its flatness over temperature during the column attach process. An aluminum plate bonded to the top of a PGA results in a significant reduction in warping during a temperature cycle. This allows attachment of solder columns to the PBGA. The high melt solder columns are attached to an area array pattern on the PBGA substrate. This array is typically either a solid or perimeter grid. It is critical that the ends of the solder columns opposite the ends attached to the substrate align precisely with the matching grid of solder pads on the printed wiring board. The purpose of the stiffening plate is to maintain the flatness of the PBGA during the process of attaching the columns to the substrate as well as attaching the component to the printed wiring board such that the columns maintain their alignment over this temperature range.
摘要翻译：一种方法和产品，其在塑料栅格阵列（PGA）的顶部提供薄金属或陶瓷板作为加强件，以在柱附着过程中保持其在温度下的平坦度，并且该列用于附接到电路板或其它电路设备。这些可以以这种方式最初构造，或者可以是改进的塑料球栅阵列，焊球从中去除，并且加强件附接到顶部，并且已经添加了焊料柱来代替焊球。加强件是连接到PGA顶部的粘合薄金属或陶瓷板，以在柱连接过程中保持其在温度下的平坦度。结合到PGA的顶部的铝板导致在温度循环期间翘曲的显着降低。这样可以将焊料柱连接到PBGA。高熔点焊料柱与PBGA基板上的区域阵列图案相连。该阵列通常是固体或周边网格。至关重要的是，与连接到衬底的端部相对的焊料柱的端部与印刷电路板上的焊盘的匹配格栅精确对准。加强板的目的是在将柱附接到基板的过程中保持PBGA的平坦度，以及将部件附接到印刷线路板，使得柱在该温度范围内保持其对准。

4. 发明申请

US20090267227A1 PLASTIC BALL GRID ARRAY RUGGEDIZATION 有权
标题翻译：塑料球网阵列
公开(公告)号：US20090267227A1
公开(公告)日：2009-10-29
申请号：US12108792
申请日：2008-04-24
申请人： Charles H. Dando, III , Stephen G. Gonya , William E. Murphy
发明人： Charles H. Dando, III , Stephen G. Gonya , William E. Murphy
IPC分类号： H01L23/488 , B23K31/02
CPC分类号： B23K3/0623 , B23K2101/40 , H01L23/16 , H01L23/3121 , H01L23/49811 , H01L23/49816 , H01L23/49833 , H01L24/16 , H01L24/45 , H01L24/48 , H01L2224/45147 , H01L2224/48 , H01L2924/10253 , H01L2924/10329 , H01L2924/15311 , H01L2924/15312 , H01L2924/181 , H01L2924/3025 , H01L2924/3511 , H01L2924/00014 , H01L2924/00012
摘要： A method and product which provides a thin metal or ceramic plate to the top of a plastic grid array (PGA) as a stiffener to maintain its flatness over temperature during a column attach process, and the columns are used for attachment to circuit boards or other circuit devices. These may be constructed in this manner initially or may be retrofitted plastic ball grid arrays from which the solder balls are removed and, the stiffener is attached to the top, and the solder columns have been added to replace the solder balls. The stiffener is a bonded thin metal or ceramic plate attached to the top of the PGA to maintain its flatness over temperature during the column attach process. An aluminum plate bonded to the top of a PGA results in a significant reduction in warping during a temperature cycle. This allows attachment of solder columns to the PBGA. The high melt solder columns are attached to an area array pattern on the PBGA substrate. This array is typically either a solid or perimeter grid. It is critical that the ends of the solder columns opposite the ends attached to the substrate align precisely with the matching grid of solder pads on the printed wiring board. The purpose of the stiffening plate is to maintain the flatness of the PBGA during the process of attaching the columns to the substrate as well as attaching the component to the printed wiring board such that the columns maintain their alignment over this temperature range.
摘要翻译：一种方法和产品，其在塑料栅格阵列（PGA）的顶部提供薄金属或陶瓷板作为加强件，以在柱附着过程中保持其在温度下的平坦度，并且该列用于附接到电路板或其它电路设备。这些可以以这种方式最初构造，或者可以是改进的塑料球栅阵列，焊球从中去除，并且加强件附接到顶部，并且已经添加了焊料柱来代替焊球。加强件是连接到PGA顶部的粘合薄金属或陶瓷板，以在柱连接过程中保持其在温度下的平坦度。结合到PGA的顶部的铝板导致在温度循环期间翘曲的显着降低。这样可以将焊料柱连接到PBGA。高熔点焊料柱与PBGA基板上的区域阵列图案相连。该阵列通常是固体或周边网格。至关重要的是，与连接到衬底的端部相对的焊料柱的端部与印刷电路板上的焊盘的匹配格栅精确对准。加强板的目的是在将柱附接到基板的过程中保持PBGA的平坦度，以及将部件附接到印刷线路板，使得柱在该温度范围内保持其对准。

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