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1. 发明申请

US20080218970A1 Thermal Management for a Ruggedized Electronics Enclosure 审中-公开
标题翻译：坚固耐用的电子外壳的热管理
公开(公告)号：US20080218970A1
公开(公告)日：2008-09-11
申请号：US12020487
申请日：2008-01-25
申请人： William E. Kehret , Dennis H. Smith
发明人： William E. Kehret , Dennis H. Smith
IPC分类号： H05K7/20
CPC分类号： H05K7/20418 , H05K7/1434 , H05K7/20254 , H05K7/20445 , H05K7/20509
摘要： The present invention relates to a liquid cooling assembly for cooling electronic components. The liquid cooling assembly contains a heat spreader plate for providing mechanical support and thermal dissipation; a fluid channel for directing a cooling fluid in the plane of the heat spreader; and a bottom plate for protecting against destructive shock events and for providing thermal dissipation. The present invention also provides a maze structure in the liquid cooling assembly to increase structural stability against destructive shock events. The present invention also relates to a ruggedized electronics enclosure for housing electronic components. A top compartment contains a first electronics layer and a second electronics layer adjacent to said first electronics layer and a cooling assembly. A thermal shunt is configured to channel heat from the first and second electronics layers to the cooling assembly and to provide additional mechanical support to protect against potentially destructive shock events.
摘要翻译：本发明涉及一种用于冷却电子部件的液体冷却组件。液体冷却组件包含用于提供机械支撑和散热的散热板; 用于将冷却流体引导到散热器的平面中的流体通道; 以及用于防止破坏性冲击事件并提供散热的底板。本发明还提供了液体冷却组件中的迷宫结构，以提高结构稳定性以抵抗破坏性冲击事件。本发明还涉及一种用于容纳电子元件的耐用电子外壳。顶部隔间包含第一电子层和与所述第一电子层相邻的第二电子层和冷却组件。热分流器被配置为将热量从第一和第二电子器件层传导到冷却组件，并且提供额外的机械支撑以防止潜在的破坏性冲击事件。

2. 发明授权

US06944022B1 Ruggedized electronics enclosure 有权
标题翻译：坚固的电子外壳
公开(公告)号：US06944022B1
公开(公告)日：2005-09-13
申请号：US10850523
申请日：2004-05-19
申请人： William E. Kehret , Dennis H. Smith
发明人： William E. Kehret , Dennis H. Smith
IPC分类号： H05K7/20
CPC分类号： H05K7/20418 , H05K7/1434 , H05K7/20254 , H05K7/20445 , H05K7/20509
摘要： The present invention relates to a ruggedized enclosure for housing and protecting electronic circuits. The enclosure utilizes a top compartment for housing the circuit and a cooling assembly rigidly coupled to the top compartment. The cooling assembly utilizes a passive radiator to for a rigid truss plate structure. The truss plate structure rigidifies the enclosure helping to protect the enclosure and circuit from destructive shock events and destructive vibration events. The cooling assembly further provides an efficient heat exchange for removing heat from the electronic circuit. A method for protecting an electronic circuit utilizing a rigid truss plate structure is also provided.
摘要翻译：本发明涉及用于容纳和保护电子电路的加固外壳。外壳采用顶部隔间，用于容纳电路和刚性地连接到顶部隔间的冷却组件。冷却组件使用无源辐射器用于刚性桁架板结构。桁架板结构使外壳硬化，有助于保护外壳和电路免受破坏性冲击事件和破坏性振动事件的影响。冷却组件进一步提供有效的热交换以从电子电路移除热量。还提供了一种利用刚性桁架板结构来保护电子电路的方法。

3. 发明申请

US20080174960A1 CLAMSHELL ENCLOSURE FOR ELECTRONIC CIRCUIT ASSEMBLIES 审中-公开
标题翻译：电子电路组件的CLAMSHELL外壳
公开(公告)号：US20080174960A1
公开(公告)日：2008-07-24
申请号：US12016091
申请日：2008-01-17
申请人： William E. Kehret , Dennis H. Smith
发明人： William E. Kehret , Dennis H. Smith
IPC分类号： H05K7/20
CPC分类号： H05K7/20563
摘要： A clamshell enclosure is disclosed for providing thermal and kinetic management for an enclosed electronic circuit. The clamshell enclosure comprises a sealed clamshell casing containing the circuit, and a cover that in combination with a wall of the clamshell casing forms a duct. A heat exchanger conducts heat from the electronic circuit inside the clamshell casing to a thermal interface element located within the duct, and a thermally conductive gas moving through the duct comes into contact with the interface element, dispelling the heat and thereby cooling the enclosed electronic circuit. A cellular topology of the clamshell casing and of the cover provides stiffness to the enclosure and reduces the effects of shock and vibration on the enclosed electronic circuit.
摘要翻译：公开了一种用于为封闭的电子电路提供热和动力学管理的蛤壳式外壳。蛤壳式外壳包括容纳电路的密封蛤壳式外壳，并且与蛤壳式外壳的壁结合形成导管的盖。热交换器将热量从蛤壳式壳体内的电子电路传导到位于管道内的热界面元件，并且通过管道移动的导热气体与界面元件接触，消除热量，从而冷却封闭的电子电路。蛤壳式外壳和外壳的蜂窝拓扑结构提供了对外壳的刚度，并减少了冲击和振动对封闭式电子电路的影响。

4. 发明授权

US06765793B2 Ruggedized electronics enclosure 失效
标题翻译：坚固的电子外壳
公开(公告)号：US06765793B2
公开(公告)日：2004-07-20
申请号：US10232915
申请日：2002-08-30
申请人： William E. Kehret , Dennis H. Smith
发明人： William E. Kehret , Dennis H. Smith
IPC分类号： H05K720
CPC分类号： H05K7/20418 , H05K7/1434 , H05K7/20254 , H05K7/20445 , H05K7/20509
摘要： The present invention relates to a ruggedized enclosure for housing and protecting electronics circuits. The enclosure utilizes a top compartment for housing the circuit and a cooling assembly rigidly coupled to the top compartment. The cooling assembly utilizes a passive radiator to form a rigid truss plate structure. The truss plate structure rigidifies the enclosure helping to protect the enclosure and circuit from destructive shock events and destructive vibration events. The cooling assembly further provides an efficient heat exchange for removing heat from the electronic circuit. A method for protecting an electronic circuit utilizing a rigid truss plate structure is also provided.
摘要翻译：本发明涉及用于容纳和保护电子电路的加固外壳。外壳采用顶部隔间，用于容纳电路和刚性地连接到顶部隔间的冷却组件。冷却组件利用无源辐射器形成刚性桁架板结构。桁架板结构使外壳硬化，有助于保护外壳和电路免受破坏性冲击事件和破坏性振动事件的影响。冷却组件进一步提供有效的热交换以从电子电路移除热量。还提供了一种利用刚性桁架板结构来保护电子电路的方法。

5. 发明授权

US08427828B2 Printed circuit board module enclosure and apparatus using same 有权
标题翻译：印刷电路板模块外壳及其使用方法
公开(公告)号：US08427828B2
公开(公告)日：2013-04-23
申请号：US12882161
申请日：2010-09-14
申请人： William E. Kehret , Dennis Henry Smith
发明人： William E. Kehret , Dennis Henry Smith
IPC分类号： H05K7/20
CPC分类号： H05K7/20445 , G06F1/183 , G06F1/20 , H05K7/20545
摘要： A modular electronic component includes a circuit board having disposed thereon one or more electronic components and an enclosure for housing the circuit board. The enclosure comprises a thermally conductive shell having front and back surfaces being substantially parallel to the plane of the circuit board and being disposed on opposite sides of the circuit board from each other, left and right surfaces being substantially perpendicular to the plane of the circuit board and being disposed on opposite sides of the circuit board from each other, and top and bottom surfaces being substantially perpendicular to the left and right surfaces and substantially perpendicular to the top and bottom surfaces and being disposed on opposite sides of the circuit board from each other. A thermal shunt comprised of a thermally conductive material is disposed between the circuit board and the front surface of the enclosure and provides a thermally conductive path between at least some of the electronic components and the front surface of the enclosure, where the front surface of the enclosure conducts heat to at least one of the top, left, and right surfaces of the enclosure.
摘要翻译：模块化电子部件包括其上设置有一个或多个电子部件的电路板和用于容纳电路板的外壳。外壳包括导热壳体，其前表面和后表面基本上平行于电路板的平面并且布置在电路板的相对侧上，左表面和右表面基本上垂直于电路板的平面并且设置在电路板的相对侧上，并且顶表面和底表面基本上垂直于左表面和大致垂直于顶表面和底表面并且彼此相对设置在电路板的相对侧上。由导热材料组成的热分流器设置在电路板和外壳的前表面之间，并且在至少一些电子部件和外壳的前表面之间提供导热通路，其中，外壳将热量传导到外壳的顶部，左侧和右侧表面中的至少一个。

6. 发明申请

US20120020017A1 PRINTED CIRCUIT BOARD MODULE ENCLOSURE AND APPARATUS USING SAME 有权
标题翻译：打印电路板模块外壳和使用相同的设备
公开(公告)号：US20120020017A1
公开(公告)日：2012-01-26
申请号：US12882161
申请日：2010-09-14
申请人： William E. Kehret , Dennis Henry Smith
发明人： William E. Kehret , Dennis Henry Smith
IPC分类号： G06F1/20 , H05K7/20
CPC分类号： H05K7/20445 , G06F1/183 , G06F1/20 , H05K7/20545
摘要： A modular electronic component includes a circuit board having disposed thereon one or more electronic components and an enclosure for housing the circuit board. The enclosure comprises a thermally conductive shell having front and back surfaces being substantially parallel to the plane of the circuit board and being disposed on opposite sides of the circuit board from each other, left and right surfaces being substantially perpendicular to the plane of the circuit board and being disposed on opposite sides of the circuit board from each other, and top and bottom surfaces being substantially perpendicular to the left and right surfaces and substantially perpendicular to the top and bottom surfaces and being disposed on opposite sides of the circuit board from each other. A thermal shunt comprised of a thermally conductive material is disposed between the circuit board and the front surface of the enclosure and provides a thermally conductive path between at least some of the electronic components and the front surface of the enclosure, where the front surface of the enclosure conducts heat to at least one of the top, left, and right surfaces of the enclosure.
摘要翻译：模块化电子部件包括其上设置有一个或多个电子部件的电路板和用于容纳电路板的外壳。外壳包括导热壳体，其前表面和后表面基本上平行于电路板的平面并且布置在电路板的相对侧上，左表面和右表面基本上垂直于电路板的平面并且设置在电路板的相对侧上，并且顶表面和底表面基本上垂直于左表面和大致垂直于顶表面和底表面并且彼此相对设置在电路板的相对侧上。由导热材料构成的热分流器设置在电路板和外壳的前表面之间，并且在至少一些电子元件与外壳的前表面之间提供导热路径，其中，外壳将热量传导到外壳的顶部，左侧和右侧表面中的至少一个。

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